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STSR2PCD

STMicroelectronics

STSR2PCD by STMicroelectronics

STSR2PCD by STMicroelectronics is a half-bridge MOSFET driver designed for automotive applications. It operates b/w 4.5V and 5.5V, with a max output peak current of 3.5A and can withstand temperatures from -40 °C to 125 °C. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 10,016 parts In-Stock

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Digiode

USA . 2,514 parts In-Stock

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2,514

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Anansix

USA . 783 parts In-Stock

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EMSNET

USA . 67 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 883 parts In-Stock

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$10.370

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883

$10.370

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IDEA Electronic Components Group

UK . 273 parts In-Stock

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$10.961

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$9.865

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273

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$9.865

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MKK Technologies

India . 638 parts In-Stock

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$20.611

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$20.611

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DigiPath Technology Company

USA . 638 parts In-Stock

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$20.611

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638

$20.611

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QUARKTWIN TECHNOLOGY LTD

USA . 10,767 parts In-Stock

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Perfect Parts

USA . 9,667 parts In-Stock

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Metaverse IC Inc.

Canada . 5,840 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,514 parts In-Stock

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Microchip USA

USA . 5,018 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,735 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 203 parts In-Stock

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$13.105

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$13.105

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Overview

Elevate your designs with the STSR2PCD from STMicroelectronics, a premier choice in MOSFET gate drivers. Crafted for reliability and performance, this compact driver operates seamlessly across extreme temperatures, making it perfect for automotive applications. With exceptional efficiency and robust construction, it empowers your circuits to achieve superior power management while ensuring long-lasting durability. Experience unmatched quality and innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for demanding applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact circuits and improves manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this driver is suitable for low-voltage applications, ensuring compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, allowing for efficient layouts.

Power Supplies (V): 5

Designed to operate at 5V, this driver is ideal for standard digital logic levels, simplifying design integration.

No. of Terminals: 8

Featuring 8 terminals, the driver supports multiple connections, making it flexible for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package contributes to a compact footprint, enabling high-density circuit designs.

Minimum Supply Voltage: 4.5 V

The operational range of 4.5 V to 5.5 V ensures reliable performance in systems with a slight voltage drop.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the driver can function effectively in harsh environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in -40 °C conditions makes this driver ideal for extreme environments and automotive use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish not only enhances solderability but also ensures long-term reliability and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for versatile PCB layout options, enhancing adaptability in circuit designs.

Maximum Seated Height: 1.75 mm

With a low seated height, the device enables the design of ultra-thin end-products without compromising performance.

Width: 3.9 mm

A compact width ensures that this driver can fit into small spaces, making it suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time enhances the manufacturing process, ensuring reliable solder joints without damaging the component.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature ensures compatibility with modern soldering processes, facilitating easier assembly.

Length: 4.9 mm

A short length contributes to a compact design, allowing efficient placement in dense electronic layouts.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, this driver meets stringent quality and reliability standards necessary for automotive electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and are easy to solder, improving assembly reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, this product is highly compatible with logic-level components commonly used in digital systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for effective spacing between connections, reducing the risk of short circuits in high-density designs.

Nominal Output Peak Current Limit: 3.5 A

The capability of 3.5 A peak output current provides sufficient drive strength for various MOSFETs, enhancing performance in power applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Designed as a half bridge driver, it efficiently controls high-side and low-side MOSFETs, making it suitable for various motor control and power management applications.

Technical Specifications

MOSFET Gate Drivers STSR2PCD attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

STSR2PCD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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