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STSR2MCD

STMicroelectronics

STSR2MCD by STMicroelectronics

STSR2MCD by STMicroelectronics is a high-side MOSFET gate driver designed for automotive applications. It operates b/w 4.5V and 5.5V, with a peak output current of 3.5A and a temperature range from -40 °C to 125 °C. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,191

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-

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Digiode

USA . 1,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,401

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Anansix

USA . 557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$10.346

100+ parts

-

1k+ parts

$9.312

10k+ parts

-

860

$10.346

-

$9.312

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MKK Technologies

India . 1,708 parts In-Stock

1+ parts

$19.456

100+ parts

-

1k+ parts

-

10k+ parts

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1,708

$19.456

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DigiPath Technology Company

USA . 1,708 parts In-Stock

1+ parts

$19.456

100+ parts

-

1k+ parts

-

10k+ parts

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1,708

$19.456

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Corphita

USA . 4,898 parts In-Stock

1+ parts

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4,898

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Parana Technologies

USA . 1,780 parts In-Stock

1+ parts

-

100+ parts

$12.371

1k+ parts

-

10k+ parts

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1,780

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$12.371

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Overview

Unlock the potential of your designs with the STSR2MCD from STMicroelectronics, a premium MOSFET gate driver that ensures top-notch performance in automotive applications. Engineered for reliability and efficiency, this compact driver thrives in extreme temperatures, delivering robust functionality and seamless integration. Elevate your projects with industry-leading quality and proven expertise—experience unmatched advantages that translate into enhanced performance and longevity for your systems!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the driver suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient manufacturing and a compact design, saving space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various applications while ensuring safe operation without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for space utilization on PCBs, facilitating easier layout and design.

Power Supplies (V): 5

Designed to operate efficiently with a 5V power supply, ensuring compatibility with standard logic levels in automotive applications.

No. of Terminals: 8

The 8-terminal configuration supports flexible connections and functionalities, suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline packages are advantageous for high-density applications where PCB space is limited, contributing to overall system miniaturization.

Minimum Supply Voltage: 4.5 V

The minimum operating threshold of 4.5 V allows for a wide operating range, making the driver versatile in various environments.

Maximum Operating Temperature: 125 °C

The ability to function at high temperatures of up to 125 °C makes this driver suitable for demanding automotive applications.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures reliability and performance in extreme environments, crucial for automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish enhances connectivity and ensures long-term reliability, reducing the risk of oxidation and failures.

Terminal Position: DUAL

Dual terminal position optimizes connection options, making the product versatile for different PCB layouts.

Maximum Seated Height: 1.75 mm

A low profile of 1.75 mm allows for space-saving designs and easier integration into compact systems.

Width: 3.9 mm

The narrow width of 3.9 mm enables dense PCB layouts, accommodating other components in tight spaces.

High Side Driver: YES

Being a high-side driver enhances its ability to control loads effectively, crucial for various switching applications.

Length: 4.9 mm

Compact length of 4.9 mm contributes to overall space efficiency on the PCB, allowing for multi-functional designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards ensures reliability and performance in vehicles, vital for demanding automotive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide strong mechanical support, enhancing the durability of solder joints.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures it can interface seamlessly with standard digital logic levels in automotive electronics.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for finer spacing in component layout, which is essential for high-density designs.

Nominal Output Peak Current Limit: 3.5 A

The ability to handle a peak output current of 3.5 A makes this driver suitable for driving larger MOSFETs, thus enhancing load control.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

This IC type provides versatility in its applications, making it a valuable component in a range of switching and control circuits.

Technical Specifications

MOSFET Gate Drivers STSR2MCD attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STSR2MCD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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