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STSR2PMCD

STMicroelectronics

STSR2PMCD by STMicroelectronics

STSR2PMCD by STMicroelectronics is a half-bridge MOSFET driver designed for automotive applications. It operates b/w 4.5V and 5.5V, with a peak output current of 3.5A and a temperature range from -40 °C to 125 °C. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,206 parts In-Stock

1+ parts

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100+ parts

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3,206

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Digiode

USA . 2,337 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,337

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Anansix

USA . 554 parts In-Stock

1+ parts

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554

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EMSNET

USA . 55 parts In-Stock

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,343 parts In-Stock

1+ parts

$4.576

100+ parts

-

1k+ parts

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10k+ parts

-

1,343

$4.576

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-

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IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$6.208

100+ parts

-

1k+ parts

$5.587

10k+ parts

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429

$6.208

-

$5.587

-

MKK Technologies

India . 1,913 parts In-Stock

1+ parts

$11.674

100+ parts

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1,913

$11.674

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DigiPath Technology Company

USA . 1,913 parts In-Stock

1+ parts

$11.674

100+ parts

-

1k+ parts

-

10k+ parts

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1,913

$11.674

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-

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AZTECH Wire

Italy . 972 parts In-Stock

1+ parts

$22.010

100+ parts

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972

$22.010

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Parana Technologies

USA . 2,297 parts In-Stock

1+ parts

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100+ parts

$7.423

1k+ parts

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2,297

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$7.423

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Kepictronics

USA . 1,800 parts In-Stock

1+ parts

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1,800

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Corphita

USA . 721 parts In-Stock

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721

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Overview

Elevate your designs with the STSR2PMCD from STMicroelectronics, a premier MOSFET gate driver that effortlessly brings reliability and efficiency to automotive applications. With exceptional temperature resilience and a compact design, this product ensures optimal performance in demanding environments. Trust in STMicroelectronics’ commitment to quality and innovation, and empower your projects with enhanced control, reduced power loss, and unmatched durability for long-lasting results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent mechanical protection and thermal stability, ensuring reliable performance in demanding environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, saving space and improving assembly efficiency.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this driver can operate safely in a variety of low-voltage applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape is compatible with standard PCB layouts, facilitating straightforward placement and alignment during assembly.

Power Supplies (V): 5

This driver operates on a standard 5V power supply, making it compatible with commonly used systems and simplifying design requirements.

No. of Terminals: 8

An 8-terminal configuration allows for sufficient connections while maintaining a compact footprint, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, ensuring that this driver can fit into tight designs.

Minimum Supply Voltage: 4.5 V

Operating with a minimum supply voltage of 4.5 V ensures compatibility with various power sources while maintaining efficient performance.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) makes this driver suitable for automotive and industrial applications where heat management is critical.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver is suitable for use in extreme conditions, including outdoor and automotive environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers superior corrosion resistance and ensures reliable electrical connections, extending the lifetime of the product.

Terminal Position: DUAL

The dual terminal position enhances routing flexibility on the PCB, allowing for improved layout designs and signal integrity.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm ensures a low-profile design, which is beneficial for compact electronic devices where height is a constraint.

Width: 3.9 mm

At a width of 3.9 mm, this driver is designed to fit in small spaces, making it a suitable choice for miniaturized applications.

Length: 4.9 mm

The compact length of 4.9 mm allows for higher density layouts on PCBs, accommodating more components in limited spaces.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this driver complies with strict industry standards, ensuring reliability and durability in vehicles.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and inspection, enhancing manufacturability and ensuring quality production.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V simplifies integration into existing circuits and enhances compatibility with standard components.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a good balance between space efficiency and ease of soldering, suitable for automated assembly.

Nominal Output Peak Current Limit: 3.5 A

With a nominal output peak current limit of 3.5 A, this driver provides sufficient power to switch heavy loads effectively, ideal for demanding applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Being a half-bridge based driver allows for efficient control of connected MOSFETs, making it highly effective in motor control and power management applications.

Technical Specifications

MOSFET Gate Drivers STSR2PMCD attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STSR2PMCD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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