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STSR2MCD-TR

STMicroelectronics

STSR2MCD-TR by STMicroelectronics

STSR2MCD-TR by STMicroelectronics is a high-side MOSFET gate driver designed for automotive applications. It operates b/w 4.5V and 5.5V, supports up to 3.5A output current, and functions effectively in temperatures from -40 °C to 125 °C. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,814 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,814

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Digiode

USA . 2,450 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,450

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-

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Vyrian

USA . 1,241 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,241

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$5.846

100+ parts

-

1k+ parts

$5.261

10k+ parts

-

485

$5.846

-

$5.261

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MKK Technologies

India . 1,137 parts In-Stock

1+ parts

$10.992

100+ parts

-

1k+ parts

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10k+ parts

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1,137

$10.992

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DigiPath Technology Company

USA . 1,137 parts In-Stock

1+ parts

$10.992

100+ parts

-

1k+ parts

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10k+ parts

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1,137

$10.992

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Corphita

USA . 4,331 parts In-Stock

1+ parts

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4,331

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Parana Technologies

USA . 341 parts In-Stock

1+ parts

-

100+ parts

$6.989

1k+ parts

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10k+ parts

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341

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$6.989

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Overview

Unlock the potential of your designs with the STSR2MCD-TR from STMicroelectronics, a leading name in innovation and quality. This robust MOSFET gate driver excels in automotive and industrial applications, delivering reliability in challenging environments. With a compact surface mount design, it ensures efficient space utilization while providing superior performance at high temperatures. Elevate your projects with confidence, knowing you have the strength of STMicroelectronics backing your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for easier and more compact PCB design, which is crucial for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of low-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient layout and utilization of PCB space.

Power Supplies (V): 5

A standardized power supply of 5V simplifies integration into existing systems and reduces design complexity.

No. of Terminals: 8

With 8 terminals, the device supports a variety of connection options, enhancing its versatility in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications while providing reliable performance.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in low-voltage systems, offering flexibility for various designs.

Maximum Operating Temperature: 125 °C

Operating at temperatures up to 125 °C makes this product suitable for automotive and industrial applications requiring high thermal performance.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product is resilient in cold weather, ensuring reliable operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance, ensuring long-term reliability and conductivity.

Terminal Position: DUAL

The dual terminal position aids in layout flexibility, allowing easier design integration in compact spaces.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm enhances PCB density while ensuring stability during operation.

Width: 3.9 mm

A compact width of 3.9 mm contributes to a slimmer overall design, important in modern electronics.

High Side Driver: YES

As a high-side driver, it can directly control the load, providing enhanced control in various applications.

Length: 4.9 mm

The compact length of 4.9 mm further aids in minimizing PCB real estate while ensuring performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent reliability and performance standards in the automotive industry.

Terminal Form: GULL WING

The gull wing terminal form is standard for surface mount devices, providing ease of handling and assembly during production.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes it easier to integrate with common digital circuits.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient mounting while maintaining a robust electrical connection.

Nominal Output Peak Current Limit: 3.5 A

With a peak current limit of 3.5 A, it is capable of driving higher power loads, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based design allows for high-speed operation and integration into diverse circuit configurations.

Technical Specifications

MOSFET Gate Drivers STSR2MCD-TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

STSR2MCD-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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