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STR755FV1T6

STMicroelectronics

STR755FV1T6 by STMicroelectronics

STR755FV1T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 100 terminals, supports I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and DMA capabilities, it excels in real-time processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,819 parts In-Stock

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Vyrian

USA . 3,035 parts In-Stock

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Chip Stock

USA . 2,579 parts In-Stock

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Anansix

USA . 196 parts In-Stock

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Lakeland Logistics Inc

USA . 5 parts In-Stock

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5

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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AZTECH Wire

Italy . 421 parts In-Stock

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$12.240

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421

$12.240

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Microchip USA

USA . 443 parts In-Stock

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$12.794

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443

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IDEA Electronic Components Group

UK . 646 parts In-Stock

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$38.988

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$35.089

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MKK Technologies

India . 833 parts In-Stock

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$73.314

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DigiPath Technology Company

USA . 833 parts In-Stock

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Component Stockers USA

USA . 313 parts In-Stock

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$99.990

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GreenTree Electronics

Israel . 8,010 parts In-Stock

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Kepictronics

USA . 7,720 parts In-Stock

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Perfect Parts

USA . 4,605 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,506 parts In-Stock

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Parana Technologies

USA . 2,093 parts In-Stock

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$46.616

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Corphita

USA . 1,984 parts In-Stock

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RC Electronics

USA . 310 parts In-Stock

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Overview

Unlock limitless possibilities with the STR755FV1T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this 32-bit ARM7 powerhouse excels in various applications, from industrial automation to consumer electronics. With superior performance, enhanced connectivity options, and robust temperature tolerance, it ensures your projects run smoothly and efficiently. Elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage enhances compatibility with various power supply systems.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and minimizes space usage.

Bit Size: 32

A 32-bit architecture enables processing of complex operations and improved performance.

Power Supplies (V): 3.3/5

Dual voltage supply capability provides flexibility in power management.

No. of Terminals: 100

A high terminal count allows for extensive input/output connections and features.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is ideal for space-constrained applications and easy integration.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage ensures compatibility with various battery-operated devices.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, providing reliability in high-temperature environments.

CPU Family: ARM7

The ARM7 core offers high performance with efficient power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it suitable for harsh environments and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and ensures reliable connections.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, improving system capability.

DMA Channels: YES

DMA support enables efficient data handling without CPU intervention, improving overall performance.

Terminal Position: QUAD

Quad terminal arrangement provides better electrical performance and stability.

ROM Words: 131072

A large ROM capacity allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

This low profile contributes to compact designs in multi-layer PCBs.

Width: 14 mm

Compact width allows for space-efficient designs in embedded applications.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

A rich set of peripherals enhances functionality and allows for versatile applications.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast processing, enhancing application responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Standard reflow profile compatibility ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 250

Tolerating high temperatures during assembly improves manufacturing efficiency.

Length: 14 mm

The compact length is ideal for space-restricted designs, making it versatile for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance in demanding settings.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power efficiency for embedded applications.

RAM Bytes: 16384

Sufficient RAM capacity supports multiple concurrent tasks and data storage.

Technology: CMOS

CMOS technology results in low power consumption, extending battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals offer better handling and soldering reliability.

Analog To Digital Converters: 16-Ch 10-Bit

The 16-channel ADC allows for expanded input options, facilitating complex sensor interactions.

Nominal Supply Voltage: 5 V

Standard nominal voltage ensures compatibility with most existing power supply designs.

PWM Channels: YES

PWM capability enables effective control of motors and other actuators.

Connectivity: I2C, LIN, SPI(2), UART(3)

Multiple connectivity options allow easy integration into various systems and networks.

ROM Programmability: FLASH

Flash programmability enables easy updates and reprogramming of applications in the field.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density layouts, maximizing PCB space efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding proper storage and handling.

Speed: 48 rpm

Efficient operation for applications requiring modest speed, conserving power.

On Chip Program ROM Width: 8

An 8-bit program ROM width is suitable for many embedded applications, optimizing data handling.

No. of I/O Lines: 72

A robust I/O line count supports diverse interfacing with various components and accessories.

Technical Specifications

Microcontrollers STR755FV1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR755FV1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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