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STR755FR2H6

STMicroelectronics

STR755FR2H6 by STMicroelectronics

STR755FR2H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,601 parts In-Stock

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3,601

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Digiode

USA . 2,087 parts In-Stock

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2,087

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Anansix

USA . 1,961 parts In-Stock

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1,961

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 208 parts In-Stock

1+ parts

$9.961

100+ parts

-

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208

$9.961

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AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$20.400

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553

$20.400

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IDEA Electronic Components Group

UK . 280 parts In-Stock

1+ parts

$22.367

100+ parts

-

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$20.130

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280

$22.367

-

$20.130

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MKK Technologies

India . 1,848 parts In-Stock

1+ parts

$42.060

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1,848

$42.060

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DigiPath Technology Company

USA . 1,848 parts In-Stock

1+ parts

$42.060

100+ parts

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1,848

$42.060

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Corphita

USA . 4,978 parts In-Stock

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4,978

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Parana Technologies

USA . 707 parts In-Stock

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$26.743

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707

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$26.743

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Overview

Unlock the potential of your next project with the STR755FR2H6 microcontroller from STMicroelectronics, a leader in innovation and quality. This versatile 32-bit ARM7-based solution combines robust performance with low power consumption, perfect for industrial applications and beyond. Experience seamless integration, enhanced reliability, and advanced features like ADC and PWM channels. Elevate your designs with the trusted expertise of STMicroelectronics—where excellence meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

Supporting a maximum supply voltage of 5.5 V provides flexibility in powering the microcontroller in different applications.

Package Shape: SQUARE

The square package shape facilitates uniform placement on PCB layouts and improves thermal performance.

Bit Size: 32

As a 32-bit microcontroller, it can handle more data efficiently, enhancing processing power for complex applications.

Power Supplies (V): 3.3/5

Dual power supply options (3.3V and 5V) increase versatility for various electronics projects and systems.

No. of Terminals: 64

With 64 terminals, this microcontroller provides extensive connectivity options for peripherals and sensors.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array package style is ideal for high-density applications, leading to more compact designs.

Minimum Supply Voltage: 4.5 V

The range for minimum supply voltage allows for compatibility with a wide variety of power sources.

Maximum Operating Temperature: 85 °C

An operational temperature of up to 85 °C makes it suitable for industrial conditions and demanding environments.

CPU Family: ARM7

The ARM7 architecture is known for its efficiency and performance, making it ideal for many embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability in harsh environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, enhancing longevity and performance.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog signals, broadening its application range.

DMA Channels: YES

Direct Memory Access channels enhance performance by allowing peripherals to communicate without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning can optimize space on PCBs and accommodate various mounting styles.

ROM Words: 262144

The large ROM capacity allows for the storage of extensive programs and data, essential for complex applications.

Maximum Seated Height: 1.7 mm

A low seated height allows for compact design solutions, important in size-constrained applications.

Width: 8 mm

A compact width enables integration into small devices, making it excellent for space-sensitive designs.

Maximum Clock Frequency: 60 MHz

With a clock frequency of up to 60 MHz, this microcontroller can execute tasks quickly, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds allows for robust soldering process, ensuring reliable connections.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates compatibility with modern soldering processes and materials.

Length: 8 mm

The short length lends itself to miniaturized designs, making it suitable for compact electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that this microcontroller meets the rigorous demands of industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient processing capabilities, leading to lower power consumption.

RAM Bytes: 16384

The 16 KB of RAM provides ample memory for handling complex applications and data processing.

Technology: CMOS

CMOS technology enhances efficiency, reducing power consumption compared to other technologies.

Terminal Form: BALL

Ball terminal form provides excellent electrical contact, minimizing signal loss and enhancing performance.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is commonly used in many applications, ensuring wide compatibility.

PWM Channels: YES

PWM channels facilitate control of motors and other devices, making it versatile for various applications.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications, keeping the system adaptable to changes.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is suitable for high-density PCB designs, enabling more components in smaller areas.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 means it can withstand standard moisture levels during storage and handling, ensuring reliability.

Speed: 48 rpm

A speed rating of 48 rpm indicates the microcontroller's capability in applications requiring speed control.

No. of I/O Lines: 38

With 38 I/O lines, it provides ample options for interfacing with various external devices and components.

Technical Specifications

Microcontrollers STR755FR2H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR755FR2H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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