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STR752FR2H6

STMicroelectronics

STR752FR2H6 by STMicroelectronics

STR752FR2H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 64 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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BCID Electronics Ltd.

Israel . 13,976 parts In-Stock

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13,976

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Vyrian

USA . 6,882 parts In-Stock

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6,882

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Digiode

USA . 1,569 parts In-Stock

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1,569

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Anansix

USA . 884 parts In-Stock

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884

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Distributors (Availability)

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AZTECH Wire

Italy . 130 parts In-Stock

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$11.530

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130

$11.530

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IDEA Electronic Components Group

UK . 2,183 parts In-Stock

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$76.400

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$68.760

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2,183

$76.400

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$68.760

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MKK Technologies

India . 1,188 parts In-Stock

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$143.666

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1,188

$143.666

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DigiPath Technology Company

USA . 1,188 parts In-Stock

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$143.666

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1,188

$143.666

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QUARKTWIN TECHNOLOGY LTD

USA . 25,469 parts In-Stock

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Microchip USA

USA . 5,309 parts In-Stock

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5,309

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Corphita

USA . 1,954 parts In-Stock

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1,954

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Parana Technologies

USA . 1,252 parts In-Stock

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$91.348

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1,252

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$91.348

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Overview

Elevate your projects with the STR752FR2H6 microcontroller from STMicroelectronics, a leader in innovation and reliability. With its robust design and versatility, this 32-bit ARM7 powerhouse is perfect for industrial applications, offering high performance in challenging environments. Enjoy seamless integration, low power consumption, and advanced features like ADC and PWM channels that boost efficiency. Choose STMicroelectronics for unmatched quality and support—transforming ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliable performance and longevity in various environments.

Surface Mount: YES

Surface mount compatibility allows for easy integration into compact designs, saving valuable PCB space.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely in a wide range of applications.

Package Shape: SQUARE

The square package shape facilitates uniform thermal and electrical characteristics for consistent performance.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities, making it suitable for advanced applications.

Power Supplies (V): 3.3/5

Dual voltage supply options enable flexibility in design, allowing use in various systems.

No. of Terminals: 64

With 64 terminals, the microcontroller offers extensive connectivity options for peripherals and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array design enhances thermal performance and allows for high-density mounting.

Minimum Supply Voltage: 4.5 V

This specification accommodates a variety of power supply environments, enhancing operational reliability.

Maximum Operating Temperature: 85 °C

This wide operating temperature range ensures robust performance in demanding industrial conditions.

CPU Family: ARM7

The ARM7 CPU family architecture is well-regarded for its power efficiency and performance in embedded applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures makes it ideal for harsh environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish ensures improved solderability and long-term reliability of connections.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface directly with analog sensors for versatile applications.

DMA Channels: YES

Support for DMA channels allows efficient data transfer without CPU intervention, enhancing performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better heat dissipation, contributing to improved thermal management.

ROM Words: 262144

A substantial amount of ROM storage enables complex programs and applications to be deployed effectively.

Maximum Seated Height: 1.7 mm

The low seated height aids in space-saving designs and ensures compatibility with compact applications.

Width: 8 mm

The compact width makes this microcontroller suitable for space-constrained applications.

Maximum Clock Frequency: 60 MHz

The 60 MHz clock frequency allows for fast processing capabilities, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature: 30 s

This timing specification ensures compatibility with standard reflow soldering processes for assembly efficiency.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance supports reliable soldering processes in production.

Length: 8 mm

The 8 mm length complements its width for a compact footprint, making it ideal for tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade is vital for long-term reliability in challenging operational conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers improved instruction execution which enhances overall efficiency.

RAM Bytes: 16384

With 16,384 bytes of RAM, it provides sufficient memory for complex task handling and data processing.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form provides reliable connections and improves signal integrity within the PCB.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is common in many electronic systems, ensuring broad compatibility.

PWM Channels: YES

Integrated PWM channels allow the microcontroller to control motors and other devices efficiently.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware without physical changes.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables high-density designs, essential for modern electronic applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, providing guidance for proper storage and handling to prevent damage.

Speed: 48 rpm

The specified speed enhances performance, suitable for applications requiring precise control.

No. of I/O Lines: 38

38 I/O lines provide ample option for interfacing with various devices, making it versatile for different applications.

Technical Specifications

Microcontrollers STR752FR2H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR752FR2H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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