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STR752FR1T7

STMicroelectronics

STR752FR1T7 by STMicroelectronics

STR752FR1T7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 64 terminals, supports CAN/I2C/SPI/UART connectivity, and includes ADC/DMA capabilities for versatile applications. Ideal for industrial automation and control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,213 parts In-Stock

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4,213

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Digiode

USA . 3,255 parts In-Stock

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3,255

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Anansix

USA . 1,108 parts In-Stock

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1,108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,209 parts In-Stock

1+ parts

$11.790

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-

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1,209

$11.790

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$12.123

100+ parts

$11.032

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$9.941

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1,000

$12.123

$11.032

$9.941

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Microchip USA

USA . 2,380 parts In-Stock

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$16.557

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2,380

$16.557

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

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$30.864

100+ parts

-

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$27.778

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1,611

$30.864

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$27.778

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MKK Technologies

India . 1,504 parts In-Stock

1+ parts

$58.038

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1,504

$58.038

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DigiPath Technology Company

USA . 1,504 parts In-Stock

1+ parts

$58.038

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1,504

$58.038

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Corphita

USA . 4,055 parts In-Stock

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4,055

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Parana Technologies

USA . 1,266 parts In-Stock

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$36.903

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$36.903

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Overview

Unlock the potential of your projects with the STR752FR1T7 microcontroller from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers a powerful 32-bit ARM7 solution designed for performance and reliability. With versatile connectivity options and robust temperature handling, this microcontroller is perfect for industrial automation, automotive applications, and IoT devices. Experience superior efficiency and unparalleled support, making your designs smarter and more efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for space-efficient designs and enables automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

The capacity to handle up to 5.5 V allows for flexibility in power supply configurations.

Package Shape: SQUARE

The square package design enhances thermal performance and eases layout considerations for circuit boards.

Bit Size: 32

The 32-bit architecture provides efficient processing power suitable for complex applications.

Power Supplies (V): 3.3/5

Dual voltage options (3.3V and 5V) enhance compatibility with various systems and devices.

No. of Terminals: 64

With 64 terminals, the microcontroller offers ample I/O options for extensive connectivity and functional requirements.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is ideal for compact applications, facilitating ease of embedding in tight spaces.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures reliable operation in various power environments.

Maximum Operating Temperature: 105 °C

This microcontroller's high-temperature tolerance makes it suitable for industrial applications that endure harsh conditions.

CPU Family: ARM7

The ARM7 CPU family is known for its performance and energy efficiency, making it a suitable choice for embedded systems.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller suitable for extreme environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing reliability.

ADC Channels: YES

Analog-to-digital conversion capability allows the microcontroller to interface with analog signals, broadening application scope.

DMA Channels: YES

DMA channels improve data transfer efficiency, allowing the CPU to focus on processing tasks while minimizing latency.

Terminal Position: QUAD

Quad terminal positioning allows for versatile PCB layout and design options.

ROM Words: 131072

131072 ROM words provide significant storage capacity for applications, enabling complex programming functionalities.

Maximum Seated Height: 1.6 mm

The low seated height fits well in applications requiring slim profiles without sacrificing performance.

Width: 10 mm

Compact width allows for integration into small devices, making it versatile for a variety of applications.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Multiple peripherals increase the microcontroller's functionality, enabling diverse application scenarios like motor control, timekeeping, and more.

Maximum Clock Frequency: 60 MHz

A maximum clock frequency of 60 MHz offers a balance between processing power and energy consumption, suitable for real-time applications.

Length: 10 mm

The small length enhances the microcontroller's adaptability in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures reliable performance in challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture typically leads to improved performance and reduced power consumption, making it an efficient choice for embedded applications.

RAM Bytes: 16384

16 KB of RAM allows for efficient data handling and execution of complex algorithms and functions.

Technology: CMOS

CMOS technology typically offers low power consumption, enhancing the battery life of portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better electrical performance in PCB connections.

Analog To Digital Convertors: 11-Ch 10-Bit

The 11-channel 10-bit ADC enables multiple simultaneous analog signal monitoring, enhancing the versatility of applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with a wide range of equipment and systems.

PWM Channels: YES

PWM channels are essential for efficient motor control and other applications requiring variable frequency operation.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3)

Diverse connectivity options provide a robust framework for communication with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexible software deployment in the field.

Terminal Pitch: 0.5 mm

A tight terminal pitch enables higher density layouts on PCBs, facilitating more complex designs.

Speed: 48 rpm

An operational speed of 48 rpm is suitable for various industrial applications, particularly in control systems.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides a good balance for many applications requiring efficient code execution.

No. of I/O Lines: 38

With 38 I/O lines, the microcontroller supports diverse input/output configurations, making it versatile for numerous designs.

Technical Specifications

Microcontrollers STR752FR1T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR752FR1T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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