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STR752FR1T6

STMicroelectronics

STR752FR1T6 by STMicroelectronics

STR752FR1T6 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 64 terminals, 11 ADC channels, and supports various connectivity options like CAN and I2C. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,294 parts In-Stock

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Digiode

USA . 2,585 parts In-Stock

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2,585

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Anansix

USA . 923 parts In-Stock

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923

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Distributors (Availability)

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Microchip USA

USA . 418 parts In-Stock

1+ parts

$7.305

100+ parts

-

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418

$7.305

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AZTECH Wire

Italy . 194 parts In-Stock

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$18.070

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194

$18.070

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IDEA Electronic Components Group

UK . 447 parts In-Stock

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$55.145

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$49.630

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447

$55.145

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$49.630

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MKK Technologies

India . 344 parts In-Stock

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$103.696

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344

$103.696

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DigiPath Technology Company

USA . 344 parts In-Stock

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$103.696

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344

$103.696

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A-Z Elektronik GmbH

Germany . 5,741 parts In-Stock

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5,741

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Corphita

USA . 3,364 parts In-Stock

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3,364

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Parana Technologies

USA . 2,054 parts In-Stock

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$65.934

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2,054

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$65.934

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Perfect Parts

USA . 1,075 parts In-Stock

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1,075

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Assy Fe

Spain . 320 parts In-Stock

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320

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Overview

Elevate your project with the STR752FR1T6 microcontroller from STMicroelectronics, renowned for its industry-leading quality and reliability. This powerful ARM7-based solution excels in a variety of applications, from industrial automation to smart home devices. With advanced features like multiple connectivity options and robust performance at extreme temperatures, it ensures seamless integration and enhanced efficiency. Choose STR752FR1T6 for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers good insulation and thermal stability, making this microcontroller durable and reliable in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and easier manufacturing, making integration into your project simpler.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage provides flexibility in power supply options for different applications without risking damage.

Package Shape: SQUARE

The square package shape is efficient for placement on PCBs, enhancing layout design and space utilization.

Bit Size: 32

A 32-bit architecture allows for more complex processing, making this microcontroller suitable for advanced applications.

Power Supplies (V): 3.3/5

Dual voltage supply options make this microcontroller versatile for various applications and systems, enhancing compatibility.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample I/O connections for interfaces and peripherals, increasing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch of the package improve space efficiency on PCBs, making it ideal for compact devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for stable operation in a wide range of environments, enhancing reliability.

Maximum Operating Temperature: 85 °C

This high operating temperature tolerance ensures that the microcontroller can function in demanding conditions, suitable for industrial applications.

CPU Family: ARM7

The ARM7 family offers efficient processing capabilities and power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller suitable for automotive and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish ensures corrosion resistance and longevity, enhancing the reliability of connections.

ADC Channels: YES

Integrated ADC capabilities are crucial for applications requiring analog signal processing, making it adaptable for various uses.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU load and improving overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and layout on PCBs, enhancing manufacturability.

ROM Words: 131072

A substantial ROM size allows for extensive program storage and complex application development.

Maximum Seated Height: 1.6 mm

Compact height enhances the design flexibility and suitability for low-profile applications.

Width: 10 mm

The width allows for efficient space utilization on PCBs, especially in tightly designed circuits.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Integrated peripherals like PWM and timers enhance the microcontroller's capabilities for real-time applications.

Maximum Clock Frequency: 60 MHz

A 60 MHz clock frequency ensures fast processing speeds, supporting real-time computations and applications.

Maximum Time At Peak Reflow Temperature (s): 30

Accommodates the standard reflow soldering processes, ensuring compatibility with common manufacturing practices.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures robust solder joints during assembly, enhancing the reliability of the product.

Length: 10 mm

The compact length aids in minimizing PCB space usage, making it an excellent choice for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the microcontroller performs reliably in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture provides efficient processing, reducing power consumption while delivering high performance.

RAM Bytes: 16384

Generous RAM size supports more complex data manipulation and processing, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide reliable mechanical support for the microcontroller.

Analog To Digital Convertors: 11-Ch 10-Bit

Multiple ADC channels and decent resolution make this microcontroller highly effective for applications requiring precise analog readings.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V provides stability and is compatible with a wide range of components.

PWM Channels: YES

Pulse width modulation capability allows for control of motors and other devices, broadening application possibilities.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3)

Versatile connectivity options ensure seamless integration with various sensors and devices, increasing flexibility in system design.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications of the firmware, enhancing the usability of the microcontroller.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for denser packing of components on the PCB, saving valuable space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity, guiding proper storage and handling to maintain product integrity.

Speed: 48 rpm

Operational speed supports a variety of applications, ensuring suitable performance across different project requirements.

On Chip Program ROM Width: 8

An 8-bit width efficiently stores instructions, allowing for streamlined processing performance.

No. of I/O Lines: 38

38 I/O lines provide extensive interfacing options, making the microcontroller adaptable to diverse project needs.

Technical Specifications

Microcontrollers STR752FR1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3)

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

STR752FR1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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