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STR750FV0T6

STMicroelectronics

STR750FV0T6 by STMicroelectronics

STR750FV0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 16 ADC channels, DMA support, and connectivity options like CAN and USB. Ideal for industrial applications requiring robust performance.

Median Price

$9.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

1+ parts

$9.620

100+ parts

$7.210

1k+ parts

$6.250

10k+ parts

-

6

$9.620

$7.210

$6.250

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Vyrian

USA . 7,618 parts In-Stock

1+ parts

-

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7,618

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Digiode

USA . 4,981 parts In-Stock

1+ parts

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4,981

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Anansix

USA . 1,541 parts In-Stock

1+ parts

-

100+ parts

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1,541

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ComSIT Distribution GmbH

Germany . 7 parts In-Stock

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-

1k+ parts

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 282 parts In-Stock

1+ parts

$12.861

100+ parts

-

1k+ parts

-

10k+ parts

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282

$12.861

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-

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AZTECH Wire

Italy . 908 parts In-Stock

1+ parts

$13.620

100+ parts

-

1k+ parts

-

10k+ parts

-

908

$13.620

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-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$18.347

100+ parts

$16.696

1k+ parts

$15.045

10k+ parts

-

5,000

$18.347

$16.696

$15.045

-

IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$65.387

100+ parts

-

1k+ parts

$58.848

10k+ parts

-

677

$65.387

-

$58.848

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MKK Technologies

India . 2,019 parts In-Stock

1+ parts

$122.956

100+ parts

-

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-

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2,019

$122.956

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DigiPath Technology Company

USA . 2,019 parts In-Stock

1+ parts

$122.956

100+ parts

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2,019

$122.956

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 2,052 parts In-Stock

1+ parts

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2,052

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Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

-

100+ parts

$78.180

1k+ parts

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1,413

-

$78.180

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Perfect Parts

USA . 806 parts In-Stock

1+ parts

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806

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Futuretech Components

Singapore . 178 parts In-Stock

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178

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Overview

Unlock the potential of your next project with the STR750FV0T6 microcontroller from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics delivers a robust solution ideal for industrial applications that require reliability under extreme temperatures. With its powerful ARM7 architecture, versatile connectivity options, and advanced peripherals, this microcontroller ensures seamless performance, empowering you to create smarter, more efficient systems. Experience superior value and elevate your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and good thermal conductivity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly.

Maximum Supply Voltage: 5.5 V

With this voltage range, it can easily interface with common low-voltage logic devices.

Package Shape: SQUARE

A square package shape helps in efficient board layout and thermal management.

Bit Size: 32

The 32-bit architecture enables high-performance processing capabilities for complex tasks.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V supply levels, allowing versatility in various applications.

No. of Terminals: 100

A higher number of terminals allows for more flexible connections to peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design facilitates compact device implementations suited for space-constrained conditions.

Minimum Supply Voltage: 4.5 V

This makes it suitable for battery-operated devices that need to operate over a range of voltages.

Maximum Operating Temperature: 85 °C

High operating temperatures ensure reliability in demanding industrial environments.

CPU Family: ARM7

ARM architecture is renowned for efficiency and performance, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures makes it suitable for outdoor and harsh environment applications.

Terminal Finish: MATTE TIN

Provides good solderability and reduces oxidation during storage, ensuring reliable connections.

ADC Channels: YES

Integrated ADCs allow for direct measurements of analog signals, simplifying system design.

DMA Channels: YES

Direct Memory Access enables efficient data transfers, improving performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning aids in stable mounting, enhancing overall reliability of the product.

ROM Words: 65536

Sufficient ROM provides ample space for application code, ensuring versatile firmware capabilities.

Maximum Seated Height: 1.6 mm

Low seated height contributes to slim designs, beneficial in portable and compact devices.

Width: 14 mm

The compact width is ideal for tight PCB layouts where space is a constraint.

Peripherals: DMA(4), PWM, RTC, TIMER(6)

Rich peripheral set allows for advanced functionalities, suitable for complex control scenarios.

Maximum Clock Frequency: 60 MHz

This frequency supports fast processing speeds, allowing for real-time application performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow parameters ensure quality solder joints, enhancing long-term reliability.

Peak Reflow Temperature °C: 250

Designed to withstand high temperatures during soldering without compromising integrity.

Length: 14 mm

The size is convenient for modern electronics designs where space optimization is critical.

Temperature Grade: INDUSTRIAL

Industrial-grade components are ideal for use in challenging environments, ensuring durability and longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for higher performance at lower power consumption, perfect for embedded systems.

RAM Bytes: 16384

Adequate RAM size allows the execution of more complex applications and efficient multitasking.

Technology: CMOS

CMOS technology provides low power consumption which is ideal for battery-powered applications.

Terminal Form: GULL WING

Gull-wing terminals offer better soldering characteristics, ensuring secure connections during assembly.

Analog To Digital Converters: 16-Ch 10-Bit

Multiple ADC channels provide flexibility for measuring various analog signals simultaneously.

Nominal Supply Voltage: 5 V

Standard nominal voltage compatibility makes it easy to integrate into existing systems.

PWM Channels: YES

Supports Pulse Width Modulation for precise control applications, such as motor control and lighting.

Connectivity: CAN, I2C, LIN, SPI(2), UART(3), USB

Rich connectivity options make it easy to connect with various devices and expand application scope.

ROM Programmability: FLASH

Flash programmability allows easy updates and modifications to firmware, enhancing product longevity.

Terminal Pitch: 0.5 mm

Fine pitch allows for tighter spacing on PCBs, conducive to modern electronic design requirements.

Moisture Sensitivity Level (MSL): 3

Suitable for a variety of manufacturing processes while maintaining reliable performance in humid environments.

Speed: 48 rpm

Speed rating indicates its suitability for various control tasks such as motors and drives.

On Chip Program ROM Width: 8

8-bit program ROM width facilitates compatibility with a wide range of instructions and operations.

No. of I/O Lines: 72

A high number of I/O lines allows for extensive interfacing options, making it versatile for various applications.

Technical Specifications

Microcontrollers STR750FV0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SPI(2), UART(3), USB

Peripherals:

DMA(4), PWM, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR750FV0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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