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STR736FV2T6

STMicroelectronics

STR736FV2T6 by STMicroelectronics

STR736FV2T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 72 I/O lines, 12 ADC channels, and supports various connectivity options like I2C and UART. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

$14.567

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 86 parts In-Stock

1+ parts

-

100+ parts

$14.567

1k+ parts

$14.567

10k+ parts

$14.567

86

-

$14.567

$14.567

$14.567

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

10k+ parts

-

4

$11.540

$8.650

$7.500

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Vyrian

USA . 8,570 parts In-Stock

1+ parts

-

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8,570

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Chip Stock

USA . 2,786 parts In-Stock

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2,786

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Digiode

USA . 1,824 parts In-Stock

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1,824

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Anansix

USA . 1,819 parts In-Stock

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1,819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,048 parts In-Stock

1+ parts

$22.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1,048

$22.110

-

-

-

Microchip USA

USA . 196 parts In-Stock

1+ parts

$29.217

100+ parts

-

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-

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196

$29.217

-

-

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$58.952

100+ parts

-

1k+ parts

$53.057

10k+ parts

-

1,139

$58.952

-

$53.057

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MKK Technologies

India . 1,623 parts In-Stock

1+ parts

$110.855

100+ parts

-

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-

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1,623

$110.855

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DigiPath Technology Company

USA . 1,623 parts In-Stock

1+ parts

$110.855

100+ parts

-

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1,623

$110.855

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QUARKTWIN TECHNOLOGY LTD

USA . 6,325 parts In-Stock

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6,325

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A-Z Elektronik GmbH

Germany . 4,752 parts In-Stock

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4,752

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Metaverse IC Inc.

Canada . 3,800 parts In-Stock

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3,800

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Corphita

USA . 1,867 parts In-Stock

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1,867

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Perfect Parts

USA . 1,791 parts In-Stock

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1,791

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Parana Technologies

USA . 1,602 parts In-Stock

1+ parts

-

100+ parts

$70.486

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1,602

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$70.486

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Component Stockers USA

USA . 92 parts In-Stock

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92

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Kepictronics

USA . 84 parts In-Stock

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84

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the potential of your projects with the STR736FV2T6 microcontroller from STMicroelectronics, a leader in innovative technology. Built with precision and reliability, this 32-bit ARM7 powerhouse delivers exceptional performance across various applications, from industrial automation to smart home devices. Experience low power consumption, robust connectivity options, and an extensive range of peripherals that ensure seamless integration. Elevate your designs with unmatched quality and support, knowing you’re backed by a trusted name in the industry!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of sturdy plastic/epoxy ensures durability, protecting the microcontroller from environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

This specification provides flexibility in power supply options while ensuring reliable operation.

Package Shape: SQUARE

A square package shape optimizes space on printed circuit boards, facilitating efficient layout.

Bit Size: 32

The 32-bit architecture enhances processing power and efficiency, making it apt for complex tasks.

Power Supplies (V): 5

Standard 5V power supply minimizes design complexity and integrates easily into existing systems.

No. of Terminals: 100

Having 100 terminals allows for a rich set of functionalities and connections to various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is optimal for high-density circuit boards and modern electronics.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage enables compatibility with a variety of power sources, enhancing versatility.

Maximum Operating Temperature: 85 °C

This temperature range ensures reliability even in higher temperature environments.

CPU Family: ARM7

The ARM7 family is known for its efficiency and performance, providing excellent processing capability.

Minimum Operating Temperature: -40 °C

This wide operating temperature range makes it suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium terminal finish enhances conductivity and reliability over time.

ADC Channels: YES

Integrated ADC channels facilitate analog signal processing, adding to the product’s versatility.

DMA Channels: YES

Direct Memory Access channels improve data throughput and efficiency in data handling tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates easier connections and improves thermal management.

ROM Words: 262144

A significant ROM capacity allows for storing complex firmware, improving functionality.

Maximum Seated Height: 1.6 mm

A low profile enhances compatibility with tighter design constraints in modern electronics.

Width: 14 mm

Compact width aids in space-efficient designs, suitable for a variety of applications.

Peripherals: DMA(4), POR, RTC, TIMER(16), WDT

The extensive range of peripherals adds functionality, making it ideal for various embedded applications.

Maximum Clock Frequency: 8 MHz

An 8MHz clock frequency balances speed and power consumption, serving a wide range of applications.

Peak Reflow Temperature: 260 °C

This high reflow temperature ensures compatibility with advanced soldering techniques.

Length: 14 mm

Compact length further supports space-efficient designs in electronic assemblies.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it ensures durability and reliability under challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance and energy efficiency for embedded systems.

RAM Bytes: 16384

ample RAM enables efficient data handling and execution of complex algorithms.

Technology: CMOS

CMOS technology ensures low power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering surface area, strengthening the connection and reliability.

Analog To Digital Converters: 12-Ch 10-Bit

12-channel, 10-bit ADC enables precise interfacing with multiple sensors, broadening application potential.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V aligns with common power supplies, simplifying design integration.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of motors and other actuators.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options ensure seamless communication with various peripherals and devices.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, enhancing product longevity and adaptability.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for denser component placement, perfect for modern electronic designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate handling precautions, suitable for standard manufacturing processes.

Speed: 36 rpm

This specification indicates performance metrics suitable for specific controlled applications.

On Chip Program ROM Width: 8

8-bit ROM width provides a base for storing instructions efficiently in embedded applications.

No. of I/O Lines: 72

With 72 I/O lines, it supports extensive interfacing capabilities for various external devices.

Technical Specifications

Microcontrollers STR736FV2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR736FV2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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