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STR735FZ2T7

STMicroelectronics

STR735FZ2T7 by STMicroelectronics

STR735FZ2T7 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 144 terminals, supports I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and DMA support, it excels in data processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,571 parts In-Stock

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4,571

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Vyrian

USA . 4,529 parts In-Stock

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4,529

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Anansix

USA . 2,728 parts In-Stock

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2,728

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Distributors (Availability)

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Benley Electronics

USA . 5 parts In-Stock

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$1.500

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-

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5

$1.500

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AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$16.330

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435

$16.330

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Advanced Electronics

New Zealand . 39 parts In-Stock

1+ parts

$33.873

100+ parts

$30.824

1k+ parts

$27.776

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39

$33.873

$30.824

$27.776

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IDEA Electronic Components Group

UK . 396 parts In-Stock

1+ parts

$49.106

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$44.195

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396

$49.106

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$44.195

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MKK Technologies

India . 1,483 parts In-Stock

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$92.340

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1,483

$92.340

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DigiPath Technology Company

USA . 1,483 parts In-Stock

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$92.340

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1,483

$92.340

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QUARKTWIN TECHNOLOGY LTD

USA . 21,105 parts In-Stock

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21,105

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Microchip USA

USA . 4,954 parts In-Stock

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4,954

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Corphita

USA . 4,670 parts In-Stock

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4,670

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Parana Technologies

USA . 1,980 parts In-Stock

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$58.714

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1,980

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$58.714

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A-Z Elektronik GmbH

Germany . 677 parts In-Stock

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677

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Kepictronics

USA . 451 parts In-Stock

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451

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Overview

Unlock the potential of your next project with the STR735FZ2T7 microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics combines innovation with expertise to deliver solutions that power a variety of applications, from industrial automation to consumer electronics. Experience seamless connectivity, robust performance, and versatile functionalities, all encapsulated in a compact design, ensuring your designs are not only efficient but also future-ready. Achieve more with ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on printed circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum of 5.5 V supply makes it compatible with standard digital circuits.

Package Shape: SQUARE

Square package allows for efficient use of PCB real estate and simplifies layout.

Bit Size: 32

The 32-bit architecture enhances performance and ensures the ability to handle complex calculations and larger data.

Power Supplies (V): 5

Standard 5V power supply options are widely available and simplify integration.

No. of Terminals: 144

With 144 terminals, it offers extensive connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design reduces height and supports high-density applications.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement of 4.5 V allows for battery-operated applications and lower power consumption.

Maximum Operating Temperature: 105 °C

Capable of operating in high-temperature conditions, making it suitable for industrial applications.

CPU Family: ARM7

ARM7 offers a balance between performance and energy efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 105 °C) ensures functionality in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and reduces the chance of oxidation.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, facilitating diverse applications.

DMA Channels: YES

DMA channels reduce CPU load by allowing data transfers without processor intervention, enhancing performance.

Terminal Position: QUAD

Quad terminal position facilitates robust and reliable connections to the PCB.

ROM Words: 262144

Substantial ROM capacity allows for storing complex programs or data, suitable for demanding applications.

Maximum Seated Height: 1.6 mm

Low seated height enables compact designs, making it ideal for space-constrained applications.

Width: 20 mm

Standard width aids in easier design compatibility with existing systems.

Peripherals: DMA(4), POR, RTC, TIMER(20), WDT

Multiple peripherals enhance functionality and versatility in various control and timing applications.

Maximum Clock Frequency: 8 MHz

8 MHz clock frequency supports efficient processing speed for a wide array of applications.

Maximum Time At Peak Reflow Temperature (s): 40

Optimized for assembly processes, allowing safe handling at high temperatures.

Peak Reflow Temperature °C: 260

Support for high peak reflow temperatures ensures compatibility with lead-free solder processes.

Length: 20 mm

Standard length simplifies integration into existing designs and products.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating signifies robustness and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction processing, improving application responsiveness.

RAM Bytes: 16384

Adequate RAM capacity allows for running complex applications and handling data efficiently.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering capability for reliable connections.

Analog To Digital Convertors: 16-Ch 10-Bit

The availability of 16-channels 10-bit ADCs enables high-resolution data acquisition from various sensors.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns with common logic levels, simplifying system design.

PWM Channels: YES

PWM channels facilitate control over motors and other devices, expanding application possibilities.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options provide flexibility for integration with different devices and sensors.

ROM Programmability: FLASH

Flash programmable ROM allows for quick updates to the firmware, enhancing product adaptability.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch optimizes space on dense boards while ensuring proper connectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures that the product is suitable for standard handling and soldering processes.

Speed: 36 rpm

With a speed rating of 36 rpm, it enables effective control in applications requiring precise motion.

On Chip Program ROM Width: 8

8-bit ROM width ensures compatibility with standard data formats and ease of development.

No. of I/O Lines: 112

112 I/O lines provide ample interfacing options for various applications, enhancing flexibility.

Technical Specifications

Microcontrollers STR735FZ2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(20), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR735FZ2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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