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STR735FZ1H6

STMicroelectronics

STR735FZ1H6 by STMicroelectronics

STR735FZ1H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 144 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,594 parts In-Stock

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7,594

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Anansix

USA . 1,582 parts In-Stock

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1,582

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Digiode

USA . 759 parts In-Stock

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759

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Microchip USA

USA . 351 parts In-Stock

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$12.925

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351

$12.925

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AZTECH Wire

Italy . 244 parts In-Stock

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$16.260

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244

$16.260

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IDEA Electronic Components Group

UK . 998 parts In-Stock

1+ parts

$27.585

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$24.827

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998

$27.585

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$24.827

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MKK Technologies

India . 976 parts In-Stock

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$51.872

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976

$51.872

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DigiPath Technology Company

USA . 976 parts In-Stock

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$51.872

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976

$51.872

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Corphita

USA . 2,010 parts In-Stock

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Parana Technologies

USA . 1,840 parts In-Stock

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$32.982

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1,840

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$32.982

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Overview

Unlock the power of innovation with the STR735FZ1H6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and reliability, STMicroelectronics delivers a versatile solution perfect for industrial applications, robotics, and IoT devices. This robust 32-bit ARM7 controller enhances performance while ensuring energy efficiency. Experience seamless integration and unmatched durability, enabling you to elevate your projects with cutting-edge technology that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern PCBs.

Maximum Supply Voltage: 5.5 V

Supports a wide voltage range, providing flexibility in power supply requirements.

Package Shape: SQUARE

The square shape facilitates efficient space utilization on the circuit board.

Bit Size: 32

32-bit architecture enhances processing power and efficiency for complex applications.

Power Supplies (V): 5

Standard 5V operating voltage simplifies power management in embedded systems.

No. of Terminals: 144

A high number of terminals enables greater connectivity and peripheral support.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Low profile and fine pitch design facilitate compact PCB layouts, fitting into space-constrained applications.

Minimum Supply Voltage: 4.5 V

Minimum supply voltage requirement ensures reliable operation in diverse environments.

Maximum Operating Temperature: 85 °C

High operating temperature rating makes it suitable for industrial and harsh environment applications.

CPU Family: ARM7

ARM7 architecture provides robust performance and is widely supported in development tools.

Minimum Operating Temperature: -40 °C

Low operating temperature extends usability in extreme conditions.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish ensures better solderability and corrosion resistance.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, adding versatility.

DMA Channels: YES

Direct Memory Access channels enhance data throughput for efficient processing.

Terminal Position: BOTTOM

Bottom terminal position optimizes layout and thermal performance.

ROM Words: 131072

Substantial ROM capacity allows for complex programs and firmware storage.

Maximum Seated Height: 1.7 mm

Low height contributes to compact design, essential for portable or space-limited applications.

Width: 10 mm

Standard width enables compatibility with a variety of PCB designs.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency strikes a balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Adaptability to peak reflow conditions enhances manufacturing reliability.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering processes, ensuring robust assembly.

Length: 10 mm

Standard length promotes compatibility with existing designs and manufacturing processes.

Temperature Grade: INDUSTRIAL

Industrial temperature rating ensures reliability in challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances efficiency and performance for embedded system applications.

RAM Bytes: 16384

Ample RAM ensures smooth multitasking and performance of complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption, critical for battery-operated devices.

Terminal Form: BALL

Ball terminal form factor enables efficient heat dissipation and improved electrical performance.

Nominal Supply Voltage: 5 V

Stability at nominal voltage ensures consistent performance across diverse applications.

PWM Channels: YES

Integrated PWM channels are beneficial for motor control and other signal modulation applications.

ROM Programmability: FLASH

Flash ROM allows for reprogramming, providing flexibility in firmware updates.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables more compact design possibilities while maintaining connectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, guiding handling and storage procedures.

Speed: 36 rpm

Moderate speed rating caters well to low-speed applications, ensuring reliability.

No. of I/O Lines: 112

A high number of I/O lines provides significant expansion potential for various peripherals.

Technical Specifications

Microcontrollers STR735FZ1H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STR735FZ1H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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