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STR731FV2T6

STMicroelectronics

STR731FV2T6 by STMicroelectronics

STR731FV2T6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. It features 100 terminals, supports CAN, I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16KB RAM and 262144 ROM words, it excels in embedded systems requiring robust performance.

Median Price

$11.540

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

$11.540

100+ parts

$8.650

1k+ parts

$7.500

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4

$11.540

$8.650

$7.500

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Vyrian

USA . 6,365 parts In-Stock

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Flip Electronics

USA . 5,940 parts In-Stock

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5,940

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Chip Stock

USA . 2,580 parts In-Stock

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2,580

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Digiode

USA . 630 parts In-Stock

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630

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ComSIT Distribution GmbH

Germany . 330 parts In-Stock

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330

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Anansix

USA . 273 parts In-Stock

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273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$15.100

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-

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420

$15.100

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IDEA Electronic Components Group

UK . 1,223 parts In-Stock

1+ parts

$23.880

100+ parts

-

1k+ parts

$21.492

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1,223

$23.880

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$21.492

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MKK Technologies

India . 810 parts In-Stock

1+ parts

$44.906

100+ parts

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810

$44.906

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DigiPath Technology Company

USA . 810 parts In-Stock

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$44.906

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810

$44.906

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Microchip USA

USA . 462 parts In-Stock

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$93.667

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462

$93.667

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Perfect Parts

USA . 13,815 parts In-Stock

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13,815

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S.R.D Solutions

India . 1,770 parts In-Stock

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1,770

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RC Electronics

USA . 1,357 parts In-Stock

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1,357

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Kepictronics

USA . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 779 parts In-Stock

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779

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Parana Technologies

USA . 254 parts In-Stock

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$28.553

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254

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$28.553

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Corphita

USA . 56 parts In-Stock

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56

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Overview

Unlock the potential of your next project with the STR731FV2T6 microcontroller from STMicroelectronics, a leader in innovation and quality. This powerful ARM7-based solution delivers exceptional performance in a compact design, ideal for industrial applications where reliability is crucial. With versatile connectivity options and advanced peripherals, it empowers engineers to create efficient, high-performance systems that stand the test of time, ensuring your success in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller is compatible with a wide range of power supply circuits.

Package Shape: SQUARE

The square package shape contributes to efficient space utilization on PCBs and simplifies mounting processes.

Bit Size: 32

The 32-bit architecture allows for better performance and the capability to handle large data sets and complex calculations.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of devices while maintaining low power consumption.

No. of Terminals: 100

A higher number of terminals provides more connectivity options, making the microcontroller versatile in various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style allows for low-profile designs, which is ideal for applications with space constraints.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, it can function efficiently in lower voltage environments.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for harsher environments.

CPU Family: ARM7

ARM7 architecture provides robust performance, making it a popular choice for embedded systems.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliable operation in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish offers excellent conductivity and resistance to corrosion, ensuring longevity.

ADC Channels: YES

Inclusion of ADC channels allows for precise analog signal processing, enhancing measurement capabilities.

DMA Channels: YES

DMA support enhances data transfer efficiency, reducing CPU load and improving system performance.

Terminal Position: QUAD

Quad terminal positioning facilitates effective space utilization and improved soldering processes.

ROM Words: 262144

A significant amount of ROM ensures ample space for program instructions, supporting complex applications.

Maximum Seated Height: 1.6 mm

The low seated height is ideal for compact designs and suitable for modern electronic devices.

Width: 14 mm

Compact width allows for efficient PCB layouts and device designs.

Peripherals: DMA(4), POR, RTC, TIMER(16), WDT

A rich set of peripherals enhances functionality and integration into various applications.

Maximum Clock Frequency: 8 MHz

8 MHz clock speed provides adequate processing power for many applications in embedded systems.

Peak Reflow Temperature °C: 260

The peak reflow temperature indicates compatibility with standard soldering processes, ensuring reliable manufacturing.

Length: 14 mm

Compact length further supports smaller form factor designs, crucial in minimizing space in electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it assures reliability and durability under demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance through efficient instruction execution.

RAM Bytes: 16384

Adequate RAM allows for smooth operation of applications and real-time data processing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, improving device efficiency.

Terminal Form: GULL WING

Gull wing terminals ease the process of soldering and improve reliability.

Analog To Digital Convertors: 12-Ch 10-Bit

12-channel, 10-bit ADCs expand the capability for interfacing with a variety of sensors and inputs.

Nominal Supply Voltage: 5 V

The nominal supply voltage optimally balances performance and power consumption.

PWM Channels: YES

Support for PWM channels enables advanced control features, crucial for motor and LED applications.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Diverse connectivity options provide flexibility and interoperability with other devices within a system.

ROM Programmability: FLASH

Flash programmability allows for easy updating and reprogramming of firmware, extending the product lifecycle.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is advantageous for high-density applications, enabling more terminals within a small area.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates adequate handling and storage precautions to ensure reliability.

Speed: 36 rpm

This microcontroller is capable of handling low-speed applications effectively, making it suitable for various uses.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports optimized data handling and efficiency for embedded applications.

No. of I/O Lines: 72

A high number of I/O lines offers extensive interfacing capabilities, suitable for complex systems.

Technical Specifications

Microcontrollers STR731FV2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(16), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

STR731FV2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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