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STR730FZ2T7

STMicroelectronics

STR730FZ2T7 by STMicroelectronics

STR730FZ2T7 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 105 °C. It features 144 terminals, supports CAN, I2C, SPI, and UART connectivity, making it ideal for industrial applications. With 16 ADC channels and DMA capabilities, it ensures efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,480 parts In-Stock

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4,480

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Digiode

USA . 4,100 parts In-Stock

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4,100

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Anansix

USA . 1,856 parts In-Stock

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1,856

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Chip Stock

USA . 485 parts In-Stock

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485

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Pegasus Components GmbH

Germany . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$16.820

100+ parts

-

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244

$16.820

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$65.924

100+ parts

-

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$59.331

10k+ parts

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2,297

$65.924

-

$59.331

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Microchip USA

USA . 222 parts In-Stock

1+ parts

$118.207

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222

$118.207

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MKK Technologies

India . 892 parts In-Stock

1+ parts

$123.965

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892

$123.965

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DigiPath Technology Company

USA . 892 parts In-Stock

1+ parts

$123.965

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892

$123.965

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RC Electronics

USA . 1,490 parts In-Stock

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1,490

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 353 parts In-Stock

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353

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Parana Technologies

USA . 244 parts In-Stock

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$78.822

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244

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$78.822

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Perfect Parts

USA . 212 parts In-Stock

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212

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Overview

Unlock unparalleled performance with the STR730FZ2T7 microcontroller from STMicroelectronics! Renowned for its innovative technology and quality, this 32-bit powerhouse excels in diverse applications—from industrial automation to smart home devices. With robust connectivity options and impressive efficiency across a wide temperature range, it empowers your projects while optimizing energy use. Experience reliability and precision that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and automated assembly.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage provides versatility in application scenarios.

Package Shape: SQUARE

The square package shape facilitates efficient space management on PCB layouts.

Bit Size: 32

A 32-bit architecture allows for processing of larger data types, enhancing performance.

Power Supplies (V): 5

A standard power supply voltage makes integration with common power sources straightforward.

No. of Terminals: 144

A higher number of terminals offers more I/O options for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design is ideal for space-constrained designs.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage ensures compatibility with various power supply levels.

Maximum Operating Temperature: 105 °C

This wide operating temperature range makes the product suitable for industrial applications.

CPU Family: ARM7

ARM7 family offers efficient processing with extensive support for various applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures enhances its usability in extreme environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and reduces oxidation.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal input, simplifying design.

DMA Channels: YES

DMA support improves data handling efficiency, reducing CPU load.

Terminal Position: QUAD

Quad terminal position provides secure mounting and better electrical performance.

ROM Words: 262144

A substantial amount of ROM enables complex applications and firmware storage.

Maximum Seated Height: 1.6 mm

Low seated height ideal for compact designs and contributes to overall system miniaturization.

Width: 20 mm

A moderate width facilitates easy integration into standard PCB designs.

Peripherals: DMA(4), POR, RTC, TIMER(20), WDT

Multiple integrated peripherals enhance functionality and reduce component count.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock speed provides adequate processing for a variety of applications.

Maximum Time At Peak Reflow Temperature (s): 40

Compliance with reflow specifications ensures high reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature rating ensures compatibility with lead-free solder processes.

Length: 20 mm

A standardized length allows for easier fitting into various designs.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enables more efficient execution of instructions, enhancing performance.

RAM Bytes: 16384

Adequate RAM size supports more complex operations and tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form is widely used, ensuring compatibility with existing manufacturing processes.

Analog To Digital Convertors: 16-Ch 10-Bit

A 16-channel ADC with 10-bit resolution allows for flexible sensor integration.

Nominal Supply Voltage: 5 V

The nominal voltage enables easy interfacing with most components in embedded applications.

PWM Channels: YES

PWM support makes it suitable for motor control and other analog applications.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Diverse communication interfaces allow integration in various networking and control applications.

ROM Programmability: FLASH

Flash memory provides flexibility for updates and rewrites, enhancing long-term usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates compact design layouts without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable precautions should be taken for moisture sensitivity during handling.

Speed: 36 rpm

A rated speed of 36 rpm is suitable for various low-speed control applications.

On Chip Program ROM Width: 8

An 8-bit wide program ROM allows for efficient data handling and instruction processing.

No. of I/O Lines: 112

A large number of I/O lines enables complex interfacing possibilities for diverse applications.

Technical Specifications

Microcontrollers STR730FZ2T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(20), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR730FZ2T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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