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STR730FZ2H7

STMicroelectronics

STR730FZ2H7 by STMicroelectronics

STR730FZ2H7 from STMicroelectronics is a 32-bit ARM7 microcontroller designed for industrial applications, featuring a max supply voltage of 5.5V and operating temp range of -40 °C to 105 °C. It includes 16 ADC channels and supports multiple connectivity options like CAN and UART. With a compact low-profile package, it’s ideal for space-constrained designs requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,562 parts In-Stock

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3,562

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Digiode

USA . 2,796 parts In-Stock

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2,796

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Anansix

USA . 1,698 parts In-Stock

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1,698

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Distributors (Availability)

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$16.580

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677

$16.580

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Microchip USA

USA . 132 parts In-Stock

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$22.184

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132

$22.184

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IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$52.889

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$47.600

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816

$52.889

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$47.600

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MKK Technologies

India . 1,846 parts In-Stock

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$99.454

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1,846

$99.454

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DigiPath Technology Company

USA . 1,846 parts In-Stock

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$99.454

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1,846

$99.454

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Parana Technologies

USA . 389 parts In-Stock

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$63.237

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389

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$63.237

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Corphita

USA . 302 parts In-Stock

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Overview

Unlock exceptional performance and reliability with the STR730FZ2H7 microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics offers a robust solution tailored for industrial applications where efficiency matters. With advanced features like multiple connectivity options and impressive temperature resilience, this microcontroller enhances your designs and propels your projects forward. Experience the perfect blend of power and versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides reliable performance in various environments, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB layouts, saving valuable space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square shape offers uniformity in mounting options, providing flexibility in design and layout.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and wider data operations efficiently.

Power Supplies (V): 5

Designed for a nominal supply voltage of 5 V, this microcontroller integrates easily into existing circuits, reducing redesign costs.

No. of Terminals: 144

The high number of terminals allows for extensive connectivity options, supporting various peripherals and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style facilitates high-density assembly and is ideal for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V provides flexibility for different operating conditions while ensuring functionality.

Maximum Operating Temperature: 105 °C

Suitable for high-temperature environments, ensuring reliability in industrial applications and harsh conditions.

CPU Family: ARM7

The ARM7 CPU family offers a well-established architecture with a large support community, simplifying development.

Minimum Operating Temperature: -40 °C

Operating at -40 °C ensures performance in extreme conditions, making it ideal for industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish enhances solderability, ensuring reliable connections during assembly.

ADC Channels: YES

The presence of ADC channels allows for easy interfacing with analog sensors, broadening application possibilities.

DMA Channels: YES

DMA support improves data handling efficiency, freeing the CPU for other tasks and enhancing performance.

Terminal Position: BOTTOM

Bottom terminal position promotes better thermal performance and simplifies PCB assembly.

ROM Words: 262144

With a substantial ROM capacity, it allows for extensive program storage, accommodating complex applications.

Maximum Seated Height: 1.7 mm

The low profile design is advantageous for height-sensitive applications, allowing for compact final products.

Width: 10 mm

A width of 10 mm contributes to a compact footprint, making it easier to fit in smaller electronic designs.

Peripherals: DMA(4), POR, RTC, TIMER(10), WDT

Diverse peripherals enhance functionality by enabling real-time operations and reducing the need for external components.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency ensures an efficient processing speed for many applications while maintaining power efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature: 260 °C

Designed to withstand high reflow temperatures, ensuring robust performance in assembly processes.

Length: 10 mm

Along with its width, the length of 10 mm allows for a compact design, important for space-limited applications.

Temperature Grade: INDUSTRIAL

Industrial temperature rating signifies reliability in challenging environments, suitable for various applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller makes it efficient in processing tasks with lower power requirements.

RAM Bytes: 16384

With 16 KB of RAM, it can handle moderate data processing tasks, providing adequate memory for a variety of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making this microcontroller energy-efficient.

Terminal Form: BALL

Ball terminal form allows for high-density packing and efficient heat dissipation in compact designs.

Analog To Digital Converters: 16-Ch 10-Bit

16 channels of 10-bit ADCs provide versatile interfacing options with sensors and other devices.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V ensures compatibility with standard digital logic devices.

PWM Channels: YES

PWM channels enable precise control of motors and other devices, making the microcontroller suitable for control applications.

Connectivity: CAN(3), I2C(2), SPI(3), UART(4)

Multiple connectivity options allow for integration into a wide range of systems and devices, enhancing versatility.

ROM Programmability: FLASH

Flash programmability offers flexibility for firmware updates and adaptation to different application demands.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables a compact layout, maximizing the number of I/O pins while minimizing board space.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable precautions for storage and handling, ensuring the integrity of the microcontroller.

Speed: 36 rpm

The 36 rpm speed rating makes it suitable for certain real-time applications, contributing to its versatility.

On Chip Program ROM Width: 8

An 8-bit width in ROM allows efficient data processing and compatibility with a wide range of software.

No. of I/O Lines: 112

Having 112 I/O lines provides extensive interfacing options, accommodating a broad range of external devices.

Technical Specifications

Microcontrollers STR730FZ2H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(2), SPI(3), UART(4)

Peripherals:

DMA(4), POR, RTC, TIMER(10), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

STR730FZ2H7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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