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STR730FZ1T7

STMicroelectronics

STR730FZ1T7 by STMicroelectronics

STR730FZ1T7 by STMicroelectronics is a 32-bit ARM7 microcontroller designed for industrial applications, operating b/w -40 °C to 105 °C. It features 144 terminals, supports ADC and PWM channels, and has a max supply voltage of 5.5V. Ideal for low-profile designs with fine pitch requirements.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,962 parts In-Stock

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5,962

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Anansix

USA . 2,147 parts In-Stock

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2,147

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Digiode

USA . 1,920 parts In-Stock

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1,920

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Distributors (Availability)

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AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$15.180

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754

$15.180

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Microchip USA

USA . 359 parts In-Stock

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$22.868

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359

$22.868

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

1+ parts

$28.691

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$25.822

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1,242

$28.691

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$25.822

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MKK Technologies

India . 2,241 parts In-Stock

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$53.952

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2,241

$53.952

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DigiPath Technology Company

USA . 2,241 parts In-Stock

1+ parts

$53.952

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2,241

$53.952

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Corphita

USA . 4,313 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,693 parts In-Stock

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$34.305

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1,693

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$34.305

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Perfect Parts

USA . 12 parts In-Stock

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Overview

Unlock your project's potential with the STR730FZ1T7 microcontroller from STMicroelectronics! Renowned for their innovation and reliability, STMicroelectronics delivers a 32-bit powerhouse designed for industrial applications. With its exceptional temperature range and robust performance, this microcontroller ensures durability in any environment. Experience seamless integration, enhanced efficiency, and versatile functionality that empowers your designs to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances the microcontroller's reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with most standard power supplies.

Package Shape: SQUARE

The square package shape offers ease of component placement on PCBs, enhancing manufacturing efficiency.

Bit Size: 32

The 32-bit architecture provides enhanced processing power, enabling more complex tasks and better performance.

Power Supplies (V): 5

Designed to operate at 5 V, this microcontroller can be sourced easily, improving its accessibility.

No. of Terminals: 144

With 144 terminals, it offers sufficient connectivity options for various peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design promotes flexible PCB layout and compact system integration.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable performance in a range of power scenarios.

Maximum Operating Temperature: 105 °C

Operational capability at high temperatures makes it suitable for industrial applications.

CPU Family: ARM7

The ARM7 family ensures efficient processing and broad software support, simplifying development.

Minimum Operating Temperature: -40 °C

Extreme operational temperature range enhances reliability in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term performance.

ADC Channels: YES

Integrated ADC channels enable precise analog signal processing, adding versatility to the design.

DMA Channels: YES

DMA channels allow for high-speed data transfers, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies layout on PCBs and enhances connection reliability.

ROM Words: 131072

A sizable ROM allows for substantial program storage, supporting complex applications.

Maximum Seated Height: 1.6 mm

Low seated height minimizes board space and allows for thinner device designs.

Width: 20 mm

Standard width fits well in most design frameworks, ensuring compatibility with existing systems.

Maximum Clock Frequency: 8 MHz

Sufficient clock frequency caters to a broad range of applications without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 40

Extended time at peak reflow temperature ensures robust solder joints during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with various soldering processes.

Length: 20 mm

Standard length contributes to its usability in a variety of electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient operation, making it apt for power-sensitive applications.

RAM Bytes: 16384

A generous amount of RAM supports complex tasks and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical strength.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with most digital circuits.

PWM Channels: YES

PWM channels allow for precise control of motors and other actuators in various applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and reprogramming, enhancing flexibility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a denser layout, saving space on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance, facilitating safe handling and soldering.

Speed: 36 rpm

Operational speed of 36 rpm ensures smooth control in applications like motor drives.

No. of I/O Lines: 112

With 112 I/O lines, the microcontroller supports various interfacing options and expansions.

Technical Specifications

Microcontrollers STR730FZ1T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STR730FZ1T7 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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