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STR712FR2H6

STMicroelectronics

STR712FR2H6 by STMicroelectronics

STR712FR2H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 64 terminals, supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,509 parts In-Stock

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4,509

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Vyrian

USA . 2,010 parts In-Stock

1+ parts

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2,010

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Anansix

USA . 695 parts In-Stock

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695

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 496 parts In-Stock

1+ parts

$11.281

100+ parts

-

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496

$11.281

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$14.920

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206

$14.920

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IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$44.935

100+ parts

-

1k+ parts

$40.441

10k+ parts

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9

$44.935

-

$40.441

-

MKK Technologies

India . 1,279 parts In-Stock

1+ parts

$84.497

100+ parts

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1,279

$84.497

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DigiPath Technology Company

USA . 1,279 parts In-Stock

1+ parts

$84.497

100+ parts

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10k+ parts

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1,279

$84.497

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Authorized Procurement Solutions

USA . 2,400 parts In-Stock

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2,400

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Parana Technologies

USA . 1,775 parts In-Stock

1+ parts

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100+ parts

$53.726

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1,775

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$53.726

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Corphita

USA . 1,094 parts In-Stock

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1,094

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Overview

Elevate your projects with the STR712FR2H6 microcontroller from STMicroelectronics—where innovation meets reliability. Designed for versatility, this 32-bit powerhouse excels in demanding environments, ensuring robust performance across various applications, from industrial automation to consumer electronics. Its compact, low-profile design allows for seamless integration into your systems, while ST's commitment to quality guarantees long-lasting value and superior efficiency. Unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact design and optimized space on PCBs, making integration easier.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can efficiently operate in low-voltage applications.

Package Shape: SQUARE

The square package shape facilitates efficient layout for space-critical applications on PCBs.

Bit Size: 32

A 32-bit architecture allows for processing of larger data sets and enables more complex operations efficiently.

Power Supplies (V): 3.3

Running on a nominal supply voltage of 3.3 V positions this microcontroller for compatibility with modern low-voltage systems.

No. of Terminals: 64

Having 64 terminals provides ample connectivity for peripheral devices and I/O operations, enhancing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This packaging style supports high density and low profile designs, ideal for compact electronic applications.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V allows for stable operation in a variety of circuit conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures stable performance in moderate industrial environments.

CPU Family: ARM7

The ARM7 CPU family offers robust performance and a wide range of support for software development tools.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables this microcontroller to function well in extreme conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent solderability and minimizes corrosion, ensuring long-term reliability.

ADC Channels: YES

Built-in ADC channels allow direct analog signal processing, making it ideal for sensor integration.

Terminal Position: BOTTOM

Bottom terminal positioning aids in effective heat dissipation and compact designs on PCB layouts.

ROM Words: 262144

With significant ROM capacity of 262,144 words, ample program space is available for complex applications.

Maximum Seated Height: 1.7 mm

The low seated height contributes to reduced profile designs, beneficial in space-constrained applications.

Width: 8 mm

The compact width of 8 mm is suitable for a variety of applications, including portable devices.

Maximum Clock Frequency: 16.5 MHz

The operational clock frequency of up to 16.5 MHz allows for efficient processing and quicker response times.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time limit of 30 seconds at peak reflow temperature ensures adherence to manufacturing standards.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures up to 260 °C ensures compatibility with common soldering processes.

Length: 8 mm

An 8 mm length contributes to the microcontroller's compact form factor, allowing for versatile applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this microcontroller is built for reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from reduced instruction cycles, enhancing processing efficiency.

RAM Bytes: 65536

Equipped with 65,536 bytes of RAM, it supports complex applications and multitasking capabilities.

Technology: CMOS

The CMOS technology minimizes power consumption, making it suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and compact connections in modern electronic designs.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA supports moderate power requirements for active applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with many contemporary digital circuits, maximizing compatibility.

PWM Channels: YES

Inclusion of PWM channels enables precise control of motors and other devices, enhancing functionality.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and flexibility in software implementations.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, it accommodates high-density packaging for maximal space efficiency.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate humidity sensitivity, showcasing suitability for certain production environments.

Speed: 66 rpm

A speed of 66 rpm can be advantageous in applications requiring fast response times and dynamic control.

No. of I/O Lines: 32

Offering 32 I/O lines provides flexibility for numerous interfacing options with other components.

Technical Specifications

Microcontrollers STR712FR2H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR712FR2H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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