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STR712FR1H6

STMicroelectronics

STR712FR1H6 by STMicroelectronics

STR712FR1H6 from STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 3.0-3.6V, features 64 terminals, and supports ADC/PWM channels with a max clock of 16.5 MHz. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,215 parts In-Stock

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Digiode

USA . 3,059 parts In-Stock

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3,059

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Anansix

USA . 1,631 parts In-Stock

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1,631

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 274 parts In-Stock

1+ parts

$10.859

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274

$10.859

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AZTECH Wire

Italy . 195 parts In-Stock

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$17.120

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195

$17.120

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IDEA Electronic Components Group

UK . 1,521 parts In-Stock

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$47.116

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$42.404

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1,521

$47.116

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$42.404

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MKK Technologies

India . 2,331 parts In-Stock

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$88.598

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2,331

$88.598

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DigiPath Technology Company

USA . 2,331 parts In-Stock

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$88.598

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2,331

$88.598

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QUARKTWIN TECHNOLOGY LTD

USA . 22,639 parts In-Stock

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Corphita

USA . 2,796 parts In-Stock

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2,796

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Parana Technologies

USA . 2,346 parts In-Stock

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$56.334

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$56.334

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Overview

Elevate your projects with the STR712FR1H6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. With its robust ARM7 architecture and industrial-grade reliability, this low-profile device excels in performance while consuming minimal power. Ideal for diverse applications like IoT devices, automotive systems, and industrial controls, it offers superior efficiency and unmatched versatility, ensuring your designs stand out in today’s competitive landscape. Experience quality and innovation that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, enhancing overall product design flexibility.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape facilitates straightforward integration into printed circuit boards, optimizing layout stability.

Bit Size: 32

The 32-bit architecture provides ample processing power for complex applications and allows for more advanced computations.

Power Supplies: 3.3 V

The 3.3 V power supply suits modern low-power applications, promoting energy efficiency.

No. of Terminals: 64

64 terminals provide extensive connectivity options, allowing for multiple interfaces and peripherals.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array package style enhances thermal management and supports high-density mounting configurations.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures reliable operation in low-voltage environments.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C aligns with industrial-grade applications, ensuring reliability in harsh conditions.

CPU Family: ARM7

The ARM7 CPU family offers excellent performance and low power consumption, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature enables usage in extreme environments, expanding application versatility.

Terminal Finish: TIN SILVER COPPER

This terminal finish enhances solderability and reliability, ensuring stable connections over time.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors easily, broadening application possibilities.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient space usage and improved thermal performance on PCBs.

ROM Words: 131072

Significant ROM capacity supports complex firmware and extensive application code storage.

Maximum Seated Height: 1.7 mm

The low profile height minimizes space requirements, making it perfect for compact designs.

Width: 8 mm

The size of 8 mm facilitates integration into space-constrained projects while still providing ample functionality.

Maximum Clock Frequency: 16.5 MHz

A clock frequency of 16.5 MHz offers a good balance between performance and power consumption for many applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification indicates compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature: 260 °C

The ability to withstand peak reflow temperatures of 260 °C ensures reliability in assembly.

Length: 8 mm

An 8 mm length supports compact design requirements and is suitable for dense circuitry.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in demanding operational environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers efficient processing capabilities, making it optimal for many embedded applications.

RAM Bytes: 32768

32 KB of RAM allows for responsive operation and efficient data handling in real-time applications.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances soldering ease and ensures reliable electrical connections.

Maximum Supply Current: 100 mA

The maximum supply current of 100 mA sustains various peripheral operations, enabling versatile usage.

Nominal Supply Voltage: 3.3 V

3.3 V nominal supply voltage allows compatibility with numerous low-voltage systems, enhancing design conformity.

PWM Channels: YES

The inclusion of PWM channels enables motor control and signal modulation, expanding the microcontroller's use.

ROM Programmability: FLASH

FLASH programmability allows for easy firmware updates and customization, enhancing flexibility in product development.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch permits high-density packing and efficient layout on PCBs, valuable in compact circuits.

Moisture Sensitivity Level (MSL): 3

A MSL of 3 indicates moderate care in handling, suitable for automated assembly processes and improving longevity.

Speed: 66 rpm

Speed rating of 66 rpm indicates suitability for time-sensitive applications where response time is crucial.

No. of I/O Lines: 32

32 I/O lines facilitate extensive interfacing and communication with various external components, enhancing application versatility.

Technical Specifications

Microcontrollers STR712FR1H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR712FR1H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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