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STR712FR0H6

STMicroelectronics

STR712FR0H6 by STMicroelectronics

STR712FR0H6 by STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 3.0-3.6V with a max temp of 85 °C, featuring 64 terminals and supports ADC/PWM channels. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,761 parts In-Stock

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Digiode

USA . 1,328 parts In-Stock

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1,328

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Anansix

USA . 1,079 parts In-Stock

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1,079

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Distributors (Availability)

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AZTECH Wire

Italy . 799 parts In-Stock

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$18.160

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799

$18.160

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IDEA Electronic Components Group

UK . 50 parts In-Stock

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$52.010

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$46.809

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50

$52.010

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$46.809

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MKK Technologies

India . 978 parts In-Stock

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$97.802

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978

$97.802

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DigiPath Technology Company

USA . 978 parts In-Stock

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$97.802

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978

$97.802

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QUARKTWIN TECHNOLOGY LTD

USA . 5,927 parts In-Stock

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Microchip USA

USA . 4,989 parts In-Stock

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Corphita

USA . 4,287 parts In-Stock

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Parana Technologies

USA . 1,588 parts In-Stock

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$62.186

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$62.186

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Overview

Elevate your projects with the STR712FR0H6, a robust ARM-based microcontroller from STMicroelectronics. Renowned for their precision and reliability, STMicroelectronics delivers unmatched quality, making this 32-bit MCU ideal for industrial applications requiring durability in extreme temperatures. With advanced features like ADC and PWM channels, it empowers engineers to innovate confidently while ensuring exceptional performance and energy efficiency in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly processes, enabling space-saving in electronic devices.

Maximum Supply Voltage: 3.6 V

This product can operate at a maximum supply voltage of 3.6 V, providing flexibility in power supply options.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and improves heat dissipation.

Bit Size: 32

A 32-bit architecture enhances computational capabilities, making it suitable for complex applications.

Power Supplies (V): 3.3

Operating at 3.3 V ensures compatibility with modern digital circuits and lower power consumption.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for various peripherals and external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low profile and fine pitch design result in a compact footprint, ideal for modern high-density applications.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum of 3 V extends its usability in low-power scenarios.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in industrial applications.

CPU Family: ARM7

ARM7 architecture provides robust performance and low power consumption, making it suitable for embedded systems.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions enhances the versatility of this microcontroller for harsh environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish enhances solderability and reduces the risk of oxidation, ensuring reliable connections.

ADC Channels: YES

Inclusion of ADC channels allows for analog signal processing, expanding the application potential in sensor-based systems.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for compact layouts and thermal management in PCB design.

ROM Words: 65536

A substantial ROM allows for efficient storage of firmware, improving overall application performance.

Maximum Seated Height: 1.7 mm

The low seated height contributes to better thermal performance and compact design in applications.

Width: 8 mm

A width of 8 mm facilitates easy integration into tight spaces on circuit boards.

Maximum Clock Frequency: 16.5 MHz

This clock frequency supports moderate processing speeds suitable for a range of applications without significant power draw.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with most manufacturing processes.

Peak Reflow Temperature °C: 260

It can withstand peak reflow temperatures of 260 °C, making it suitable for high-temperature soldering processes.

Length: 8 mm

A compact length of 8 mm enhances space efficiency in various electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is reliable in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture balances performance and efficiency, ideal for a range of embedded applications.

RAM Bytes: 16384

Adequate RAM ensures efficient processing and data handling for applications requiring fast execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances electrical performance and reliability in solder joints compared to traditional leads.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows for sufficient power to drive connected peripherals.

Nominal Supply Voltage: 3.3 V

Operating at this nominal voltage optimizes power efficiency and ensures compatibility with standard logic levels.

PWM Channels: YES

The presence of PWM channels enables precise control of motor speeds and light dimming applications.

ROM Programmability: FLASH

Programmable FLASH ROM allows for easy updates and customization of firmware, enhancing flexibility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm facilitates compact designs while maintaining reliable connections.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates reasonable handling precautions, ensuring longevity and performance in storage.

Speed: 66 rpm

This speed is ideal for applications requiring consistent and dependable operation, suitable for real-time applications.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller provides ample connectivity for various sensors and devices, enhancing its application range.

Technical Specifications

Microcontrollers STR712FR0H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR712FR0H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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