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STR711FR1T6

STMicroelectronics

STR711FR1T6 by STMicroelectronics

STR711FR1T6 from STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C range. It features 64 terminals, 16K EEPROM, and supports multiple connectivity options like I2C and USB. Ideal for industrial applications requiring robust performance and low power consumption.

Median Price

$7.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 839 parts In-Stock

1+ parts

-

100+ parts

$7.420

1k+ parts

$6.640

10k+ parts

$6.250

839

-

$7.420

$6.640

$6.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,334 parts In-Stock

1+ parts

$8.236

100+ parts

-

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4,334

$8.236

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Vyrian

USA . 4,847 parts In-Stock

1+ parts

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4,847

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Chip Stock

USA . 503 parts In-Stock

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503

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Anansix

USA . 407 parts In-Stock

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407

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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15

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Mil-Aero Solutions, Inc.

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,510 parts In-Stock

1+ parts

$7.803

100+ parts

-

1k+ parts

-

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-

2,510

$7.803

-

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AZTECH Wire

Italy . 114 parts In-Stock

1+ parts

$11.120

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-

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114

$11.120

-

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IDEA Electronic Components Group

UK . 79 parts In-Stock

1+ parts

$24.630

100+ parts

-

1k+ parts

$22.167

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-

79

$24.630

-

$22.167

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Microchip USA

USA . 401 parts In-Stock

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$40.112

100+ parts

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401

$40.112

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MKK Technologies

India . 1,585 parts In-Stock

1+ parts

$46.316

100+ parts

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1,585

$46.316

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DigiPath Technology Company

USA . 1,585 parts In-Stock

1+ parts

$46.316

100+ parts

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1,585

$46.316

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Component Stockers USA

USA . 493 parts In-Stock

1+ parts

$99.990

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493

$99.990

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Authorized Procurement Solutions

USA . 36,800 parts In-Stock

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36,800

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A-Z Elektronik GmbH

Germany . 7,356 parts In-Stock

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7,356

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RC Electronics

USA . 5,781 parts In-Stock

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5,781

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Perfect Parts

USA . 3,329 parts In-Stock

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3,329

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Parana Technologies

USA . 1,302 parts In-Stock

1+ parts

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100+ parts

$29.449

1k+ parts

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1,302

-

$29.449

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Overview

Unlock your project's potential with the STR711FR1T6 microcontroller from STMicroelectronics! Renowned for excellence, ST offers a reliable and versatile solution tailored for diverse applications, from industrial automation to consumer electronics. With its robust design, low power consumption, and rich connectivity options, this 32-bit powerhouse ensures seamless performance in critical environments. Elevate your designs and accelerate innovation effortlessly with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and more efficient assembly processes, contributing to reduced device size.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with many low-power devices, enhancing versatility in designs.

Package Shape: SQUARE

The square package enables efficient use of PCB space, facilitating compact design for various applications.

Bit Size: 32

A 32-bit architecture allows for advanced processing capabilities, enabling the handling of complex tasks and applications.

Power Supplies (V): 3.3

Operating at 3.3V minimizes power consumption, ideal for battery-operated and energy-sensitive applications.

No. of Terminals: 64

With 64 terminals, the microcontroller provides ample connectivity options for peripherals and functionality, enhancing its application scope.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile design is beneficial for compact assemblies where space is a constraint, making it ideal for modern electronics.

Minimum Supply Voltage: 3 V

The lower supply voltage ensures greater flexibility in designs, accommodating power variations in many environments.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications where heat is a concern.

CPU Family: ARM7

The ARM7 CPU family offers efficient performance, supporting a wide range of applications with its established architecture.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes it suitable for harsh environments, ensuring reliability in diverse conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish ensures excellent conductivity and resistance to corrosion, enhancing the microcontroller's reliability over time.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to interface with analog sensors, making it versatile for various applications.

Terminal Position: QUAD

A quad terminal position supports efficient PCB routing and design flexibility, simplifying integration into various projects.

ROM Words: 32768

A significant ROM size allows for substantial program storage, enabling complex applications to run seamlessly.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm accommodates space-saving designs, making it suitable for compact devices.

Width: 10 mm

A width of 10 mm helps to keep the overall footprint of the device manageable, ideal for miniaturized applications.

Data EEPROM Size: 16K

The 16K EEPROM provides ample storage for non-volatile data, enabling devices to retain important information after power loss.

Peripherals: RTC, TIMER(5)

Integrated peripherals like RTC and timers enhance the functionality of the microcontroller for time-sensitive applications.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz provides satisfactory processing speed for many applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Supports robust soldering processes, ensuring the microcontroller can withstand the rigors of assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports reliable assembly using various soldering techniques, enhancing production flexibility.

Length: 10 mm

The length of 10 mm contributes to a compact design, suitable for applications where space is at a premium.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller is built to last and perform reliably in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances performance through efficient instruction set architecture, ensuring high throughput.

RAM Bytes: 32768

A RAM size of 32K facilitates the execution of programs without over-reliance on external memory, boosting efficiency.

Technology: CMOS

The CMOS technology ensures low power consumption while maintaining high performance, perfect for energy-sensitive devices.

Terminal Form: GULL WING

Gull wing terminals simplify PCB mounting while ensuring robust connections, enhancing reliability during operation.

Analog To Digital Convertors: 4-Ch 12-Bit

The integrated 4-channel 12-bit ADC allows precise analog measurement, crucial for applications requiring high accuracy.

Maximum Supply Current: 100 mA

A maximum supply current limit of 100 mA ensures efficient power use, suitable for battery-powered and portable applications.

Nominal Supply Voltage: 3.3 V

The nominal supply of 3.3V aligns with most modern digital logic levels, ensuring seamless integration with other components.

PWM Channels: YES

The presence of PWM channels is ideal for applications requiring precise signal control, such as motor control and LED dimming.

Connectivity: I2C(2), SMARTCARD, SPI(2), UART(4), USB

Robust connectivity options offer versatility in communication with various peripherals, enhancing the microcontroller's application range.

ROM Programmability: FLASH

Flash memory programmability allows easy updates and reconfigurations of firmware, saving costs and time in development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides dense packing of connections on PCBs, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating implies the device can withstand a moderate level of moisture without damaging performance during assembly and storage.

Speed: 66 rpm

The operational speed enhances response times for applications needing rapid processing, such as real-time systems.

On Chip Program ROM Width: 32

A 32-bit program ROM width allows for efficient data handling and processing, beneficial for complex programming tasks.

No. of I/O Lines: 30

With 30 I/O lines available, the microcontroller can interact with multiple peripheral devices, making it versatile for varied applications.

Technical Specifications

Microcontrollers STR711FR1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C(2), SMARTCARD, SPI(2), UART(4), USB

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR711FR1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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