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STR711FR1H6

STMicroelectronics

STR711FR1H6 by STMicroelectronics

STR711FR1H6 by STMicroelectronics is a 32-bit ARM7 microcontroller with a max supply voltage of 3.6V and operates in industrial temperatures from -40 °C to 85 °C. It features 64 terminals, 32KB RAM, and supports ADC/PWM channels for versatile applications. Ideal for embedded systems requiring low power consumption and robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,411 parts In-Stock

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4,411

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Digiode

USA . 1,881 parts In-Stock

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1,881

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Anansix

USA . 1,801 parts In-Stock

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1,801

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Distributors (Availability)

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AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$8.030

100+ parts

-

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767

$8.030

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Microchip USA

USA . 222 parts In-Stock

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$10.859

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222

$10.859

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IDEA Electronic Components Group

UK . 2,268 parts In-Stock

1+ parts

$56.758

100+ parts

-

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$51.082

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2,268

$56.758

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$51.082

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MKK Technologies

India . 769 parts In-Stock

1+ parts

$106.729

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769

$106.729

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DigiPath Technology Company

USA . 769 parts In-Stock

1+ parts

$106.729

100+ parts

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769

$106.729

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Corphita

USA . 2,358 parts In-Stock

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2,358

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Parana Technologies

USA . 1,706 parts In-Stock

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$67.862

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1,706

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$67.862

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Overview

Unlock the potential of your next innovative project with the STR711FR1H6 microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this 32-bit ARM7 powerhouse offers outstanding performance in compact designs. Ideal for industrial applications requiring robustness, it supports advanced features like ADC and PWM channels, ensuring seamless integration and efficiency. Elevate your creations with a trusted partner that brings unmatched value and superior technology to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern electronics, making it suitable for high-density applications.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage ensures compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on the PCB, enabling more effective circuit designs.

Bit Size: 32

The 32-bit architecture allows for processing of larger data types, enhancing computational capabilities for complex applications.

Power Supplies (V): 3.3

Operating with a standard 3.3V power supply makes it easy to find compatible components and reduces power consumption.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals, sensors, and other components, enhancing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style allows for efficient heat dissipation and is ideal for high-performance applications.

Minimum Supply Voltage: 3 V

A low minimum supply voltage ensures functionality in battery-powered and energy-sensitive applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for harsh environments and industrial applications.

CPU Family: ARM7

The ARM7 family offers a robust and widely supported architecture, ensuring performance and a rich ecosystem of development tools.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) allows this microcontroller to function reliably in extreme conditions.

Terminal Finish: TIN SILVER COPPER

The quality terminal finish ensures better solderability and enhances the durability of connections.

ADC Channels: YES

Inclusion of ADC channels allows for direct integration with analog sensors, providing versatility for various applications.

Terminal Position: BOTTOM

Bottom terminal positioning is ideal for certain PCB layouts, optimizing space and connectivity.

ROM Words: 131072

A large ROM space supports complex applications, allowing for efficient firmware storage and execution.

Maximum Seated Height: 1.7 mm

The low profile design makes it suitable for compact applications where space is a premium.

Width: 8 mm

The 8 mm width implies compatibility with a variety of layout designs, making it a versatile choice.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz balances performance with power consumption, suitable for efficient processing.

Maximum Time At Peak Reflow Temperature: 30s

This specification helps in adhering to assembly process requirements, ensuring reliability during manufacturing.

Peak Reflow Temperature: 260 C

The high peak reflow temperature tolerances ensure robust manufacturing processes, reducing the risk of damage during soldering.

Length: 8 mm

The compact length of 8 mm optimizes board space, allowing for more efficient designs.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller meets higher durability standards for critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it ensures efficient execution of instructions, leading to better performance at lower power consumption.

RAM Bytes: 32768

With 32KB of RAM, it supports the execution of more extensive applications without frequent memory swapping.

Technology: CMOS

CMOS technology provides lower power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and provides a reliable electrical connection.

Maximum Supply Current: 100 mA

The 100 mA current capability ensures sufficient power for a range of connected peripherals and supports diverse applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V is standard across many devices, ensuring compatibility and ease of integration.

PWM Channels: YES

PWM channel support allows for control of motors and other devices, enhancing the functionality for diverse applications.

ROM Programmability: FLASH

Flash programmability enables easy firmware updates and modifications, improving the longevity and adaptability of the device.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is standard for compact layouts, enabling modern PCB design practices.

Moisture Sensitivity Level (MSL): 3

A MSL level of 3 indicates moderate sensitivity to moisture, making it suitable for proper storage and handling in manufacturing.

Speed: 66 rpm

The speed parameter pertains to operational efficiency, making it a good choice for applications requiring consistent performance.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller offers ample connectivity for integrating various peripherals and sensors.

Technical Specifications

Microcontrollers STR711FR1H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Trade Compliance

STR711FR1H6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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