Loading...

STR711FR0T6

STMicroelectronics

STR711FR0T6 by STMicroelectronics

STR711FR0T6 by STMicroelectronics is a 32-bit ARM7 microcontroller ideal for industrial applications. It operates at 3.3V with a max temp of 85 °C, featuring 16K ROM and 4 ADC channels. Its connectivity options include I2C, SPI, UART, and USB for versatile integration.

Median Price

$8.460

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

1+ parts

$8.460

100+ parts

$6.350

1k+ parts

$5.500

10k+ parts

-

6

$8.460

$6.350

$5.500

-

Prism Electronics

USA . 4,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,880

-

-

-

-

Vyrian

USA . 2,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,309

-

-

-

-

Anansix

USA . 2,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,048

-

-

-

-

Digiode

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

-

-

-

-

Zilex Electronics Inc.

Canada . 320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

320

-

-

-

-

ComSIT Distribution GmbH

Germany . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

R&J Components

USA . 85 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

85

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Bristol Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 99 parts In-Stock

1+ parts

$19.520

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$19.520

-

-

-

Microchip USA

USA . 405 parts In-Stock

1+ parts

$20.674

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$20.674

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$33.082

100+ parts

$30.105

1k+ parts

$27.127

10k+ parts

-

1,000

$33.082

$30.105

$27.127

-

IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$50.696

100+ parts

-

1k+ parts

$45.626

10k+ parts

-

1,245

$50.696

-

$45.626

-

MKK Technologies

India . 1,269 parts In-Stock

1+ parts

$95.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$95.330

-

-

-

DigiPath Technology Company

USA . 1,269 parts In-Stock

1+ parts

$95.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,269

$95.330

-

-

-

Perfect Parts

USA . 16,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,083

-

-

-

-

Kepictronics

USA . 9,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,520

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

-

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Parana Technologies

USA . 308 parts In-Stock

1+ parts

-

100+ parts

$60.614

1k+ parts

-

10k+ parts

-

308

-

$60.614

-

-

Corphita

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

iodParts Technologies Inc.

India . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Overview

Unlock the potential of your projects with the STR711FR0T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this 32-bit ARM7 device excels in industrial applications, offering robust performance in demanding environments. With advanced features like multiple connectivity options, powerful processing capabilities, and energy efficiency, it empowers you to create smarter solutions effortlessly. Choose STMicroelectronics for reliability and expertise that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures a rugged design, making this microcontroller suitable for various applications where reliability is critical.

Surface Mount: YES

Surface mount technology enables efficient space utilization and allows for automated assembly, reducing production costs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage provides flexibility in design, enabling compatibility with various power supply systems.

Package Shape: SQUARE

The square package shape enhances ease of placement on PCBs, facilitating more efficient use of board space.

Bit Size: 32

The 32-bit architecture allows for powerful processing capabilities, enabling complex computations and robust applications.

Power Supplies (V): 3.3

Operating at 3.3V reduces power consumption, making it ideal for battery-powered applications.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connectivity options for diverse peripheral integrations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style is advantageous for space-constrained designs while supporting fine pitch connectivity for high-density applications.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for operation in low-power scenarios, further enhancing its versatility in various applications.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures makes this microcontroller suitable for industrial and automotive applications where thermal conditions can be harsh.

CPU Family: ARM7

ARM7 architecture provides efficient processing power and supports a wide range of software, boosting performance for embedded applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is well-suited for extreme environments, ensuring reliability in critical applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and ensures long-term reliability, particularly in challenging environments.

ADC Channels: YES

Built-in ADC channels allow for precise analog signal processing, making it ideal for applications requiring analog-to-digital conversions.

Terminal Position: QUAD

Quad terminal positioning offers improved connectivity options and can reduce signal interference, making it suitable for high-performance applications.

ROM Words: 16384

The substantial ROM capacity provides ample memory for firmware storage, enabling complex application development.

Maximum Seated Height: 1.6 mm

The compact seated height allows for low-profile designs, making it suitable for slim, space-constrained devices.

Width: 10 mm

A width of 10 mm balances size and functionality, fitting well in various electronic designs without sacrificing performance.

Data EEPROM Size: 16K

The 16K EEPROM size provides additional non-volatile memory, allowing for data retention even when the power is off.

Peripherals: RTC, TIMER(5)

The inclusion of real-time clock and multiple timers enhances application capabilities in time-sensitive tasks and monitoring.

Maximum Clock Frequency: 16.5 MHz

A maximum clock frequency of 16.5 MHz enables rapid processing of tasks, improving overall application performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specification for peak reflow time ensures compatibility with automated assembly processes, optimizing production efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates good thermal stability, making it suitable for lead-free soldering processes.

Length: 10 mm

The 10 mm length complements compact designs while providing a stable footprint for various PCB layouts.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in harsh environments, suitable for applications in factories, outdoor installations, and vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it is designed for high performance combined with low power consumption, making it efficient for embedded systems.

RAM Bytes: 16384

The ample RAM size allows for the execution of more complex processes and enhances the overall performance of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, crucial for energy-efficient designs in modern electronics.

Terminal Form: GULL WING

The gull wing terminal form is easier to solder and ensures reliable connections, enhancing the robustness of the device.

Analog To Digital Convertors: 4-Ch 12-Bit

The presence of 4-channel, 12-bit ADCs allows for accurate and versatile signal processing, ideal for various sensor applications.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA ensures sufficient power for demanding applications while maintaining efficiency.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V aids in power efficiency while being compatible with a vast array of hardware.

PWM Channels: YES

With PWM channels available, it supports advanced control techniques for motor and lighting applications, expanding its utility.

Connectivity: I2C(2), SMARTCARD, SPI(2), UART(4), USB

Diverse connectivity options ensure extensive communication capabilities with other devices, enhancing integration in complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in firmware development, extending the product's lifespan.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch strikes a balance between compactness and ease of soldering, suitable for high-density applications.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, allowing proper handling and storage methods to ensure longevity.

Speed: 66 rpm

This speed rating indicates potential operability in applications requiring rapid processes, enhancing versatility.

On Chip Program ROM Width: 32

The 32-bit program ROM width offers efficient instruction processing, improving overall performance in embedded systems.

No. of I/O Lines: 30

Having 30 I/O lines provides sufficient interfacing capacity for various peripherals, enhancing the overall functionality of the device.

Technical Specifications

Microcontrollers STR711FR0T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

16.5 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

64

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C(2), SMARTCARD, SPI(2), UART(4), USB

Peripherals:

RTC, TIMER(5)

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

STR711FR0T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20