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STP8NM60FP

STMicroelectronics

STP8NM60FP by STMicroelectronics

STP8NM60FP from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 32A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,456 parts In-Stock

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Digiode

USA . 1,760 parts In-Stock

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1,760

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Anansix

USA . 816 parts In-Stock

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816

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ABC Electronics Ltd.

UK . 50 parts In-Stock

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Classic Components Corporation

USA . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 2,016 parts In-Stock

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$1.257

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-

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$1.131

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$1.257

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$1.131

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MKK Technologies

India . 400 parts In-Stock

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$2.363

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400

$2.363

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DigiPath Technology Company

USA . 400 parts In-Stock

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$2.363

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$2.363

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AZTECH Wire

Italy . 851 parts In-Stock

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$11.130

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851

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Component Stockers USA

USA . 545 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Authorized Procurement Solutions

USA . 54,033 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,104 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 6,774 parts In-Stock

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Corphita

USA . 3,829 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,120 parts In-Stock

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GreenTree Electronics

Israel . 1,048 parts In-Stock

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Parana Technologies

USA . 728 parts In-Stock

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$1.503

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$1.503

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Overview

Elevate your designs with the STP8NM60FP from STMicroelectronics, a top-tier N-channel power FET that ensures optimal performance in demanding applications. Renowned for its reliability and innovation, STMicroelectronics delivers unparalleled quality, making this transistor an ideal choice for efficient switching solutions. Experience enhanced durability and efficiency, empowering your projects while reducing energy consumption. Choose the STP8NM60FP to drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and lower on-resistance than their P-channel counterparts, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the single configuration enhances circuit efficiency and simplifies design, offering effective protection against back EMF in inductive loads.

Transistor Application: SWITCHING

Being specifically designed for switching applications, this transistor exhibits fast response times and high efficiency in on/off control scenarios.

Minimum DS Breakdown Voltage: 600 V

A minimum breakdown voltage of 600V indicates a robust capacity to withstand high voltages, ensuring reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, facilitating easier layout designs in various electronic applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides excellent mechanical strength and soldering reliability, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to improved efficiency and lower power loss in applications, providing better performance in switching modes.

Maximum Pulsed Drain Current (IDM): 32 A

A maximum pulsed drain current of 32A allows for handling high current loads during short intervals, ideal for demanding applications.

Avalanche Energy Rating (EAS): 200 mJ

The avalanche energy rating of 200mJ signals the ability to safely absorb energy during avalanche conditions, improving reliability in over-voltage situations.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum absolute drain current of 8A, this FET is capable of reliable operation under a wide range of load conditions.

No. of Terminals: 3

The three-terminal configuration simplifies the circuit design while providing essential functionalities for effective control of the device.

Maximum Power Dissipation (Abs): 30 W

A maximum power dissipation of 30W allows for efficient heat management, making it suitable for higher power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers enhanced mechanical stability and allows for easy mounting and assembly in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides benefits such as high efficiency, fast switching speeds, and low power consumption, essential for modern electronics.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can function reliably in high-heat environments, making it versatile for various applications.

Transistor Element Material: SILICON

Silicon as the transistor element material serves excellent stability, performance, and compatibility, widely used in the industry for FETs.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections and longevity of the device.

Maximum Drain Current (ID): 8 A

Duplicate specification confirming a maximum drain current of 8A illustrates consistent performance under specified conditions, providing reliability.

Maximum Drain-Source On Resistance: 1 ohm

A low on-resistance of 1 ohm reduces power losses and improves the efficiency of the device during operation, making it a suitable choice for power applications.

Terminal Position: SINGLE

The single terminal position aids in straightforward integration into circuits, facilitating user-friendly assembly and installation.

Case Connection: ISOLATED

An isolated case connection helps in preventing unintended current paths, improving safety and performance in critical applications.

Technical Specifications

Power Field Effect Transistors (FET) STP8NM60FP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP8NM60FP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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