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STP80NF06

STMicroelectronics

STP80NF06 by STMicroelectronics

STP80NF06 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 80 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$1.896

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,400 parts In-Stock

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5,400

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EBV Elektronik

Germany . 600 parts In-Stock

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600

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Future Electronics

Canada . 82 parts In-Stock

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$1.270

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$1.240

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$1.200

82

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$1.270

$1.240

$1.200

Distrelec

Netherlands . 48 parts In-Stock

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48

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Verical

USA . 24 parts In-Stock

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$2.523

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$2.523

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Vyrian

USA . 5,180 parts In-Stock

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Anansix

USA . 2,584 parts In-Stock

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Digiode

USA . 790 parts In-Stock

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790

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ACDS - Activité Composants Distribution Service

France . 650 parts In-Stock

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650

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Bristol Electronics

USA . 650 parts In-Stock

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650

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Dan-Mar Components

USA . 650 parts In-Stock

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650

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Inventory MP

USA . 370 parts In-Stock

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370

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IBS Electronics

USA . 250 parts In-Stock

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$1.651

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$1.612

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$1.560

250

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$1.651

$1.612

$1.560

Sunrise Surplus Inc.

USA . 50 parts In-Stock

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50

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Ack Elektronik San.Tic.Ltd.Sti

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EMSNET

USA . 6 parts In-Stock

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6

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First Choice Components Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,460 parts In-Stock

1+ parts

$0.729

100+ parts

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$0.656

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1,460

$0.729

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$0.656

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MKK Technologies

India . 1,339 parts In-Stock

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$1.370

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1,339

$1.370

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DigiPath Technology Company

USA . 1,339 parts In-Stock

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$1.370

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1,339

$1.370

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AZTECH Wire

Italy . 982 parts In-Stock

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$21.620

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982

$21.620

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 44,381 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,000 parts In-Stock

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Eastek

USA . 5,500 parts In-Stock

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GreenTree Electronics

Israel . 5,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,456 parts In-Stock

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Kepictronics

USA . 4,800 parts In-Stock

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4,800

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Parana Technologies

USA . 2,190 parts In-Stock

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$0.871

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$0.871

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Corphita

USA . 1,820 parts In-Stock

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1,820

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Alle Elektronik GmbH

Germany . 746 parts In-Stock

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746

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Overview

Unlock the power of innovation with the STP80NF06 from STMicroelectronics. Renowned for their exceptional quality, STMicroelectronics delivers a robust N-channel FET perfect for high-efficiency switching applications. With impressive performance ratings and built-in reliability, this transistor ensures optimal operation in demanding environments. Elevate your designs with unparalleled durability and efficiency, maximizing value while minimizing energy loss.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and better performance for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and simplifies circuit design by reducing the number of external components needed.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET enables efficient control of power in electronic circuits.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60V allows for safe operation in applications with higher voltage requirements.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier PCB layout and integration into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical stability and make the product suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides effective control capabilities, essential for modern electronic circuits.

Maximum Pulsed Drain Current (IDM): 320 A

The ability to handle high pulsed currents makes this FET ideal for demanding applications requiring robust performance.

Avalanche Energy Rating (EAS): 870 mJ

A high avalanche energy rating indicates that the transistor can withstand abrupt changes in current, enhancing its reliability.

Maximum Drain Current (Abs) (ID): 80 A

Handling up to 80A allows this FET to be used in high-power applications, providing flexibility in design.

No. of Terminals: 3

With three terminals, this FET offers a simple connection setup, making it easier to deploy in various circuits.

Maximum Power Dissipation (Abs): 300 W

The ability to dissipate up to 300W ensures efficient thermal management, which is critical in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides strong fixation and enhances thermal performance, suitable for industrial use.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology provides lower on-resistance and improved efficiency, making it suitable for power management applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows the FET to perform reliably in harsh environments.

Transistor Element Material: SILICON

Silicon is a widely used material that provides a good balance of performance and cost-effectiveness.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability, ensuring reliable connections in electronic assemblies.

Maximum Drain Current (ID): 80 A

This rating allows for versatile applications in both low and high current environments.

Maximum Drain-Source On Resistance: 0.008 ohm

Low on-resistance reduces power loss and improves overall efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position offers straightforward implementation in designs with limited space.

Technical Specifications

Power Field Effect Transistors (FET) STP80NF06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

870 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP80NF06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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