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STP10NK70Z

STMicroelectronics

STP10NK70Z by STMicroelectronics

STP10NK70Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 700V breakdown voltage, 34A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$4.470

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 120 parts In-Stock

1+ parts

$4.470

100+ parts

$2.089

1k+ parts

-

10k+ parts

-

120

$4.470

$2.089

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,890 parts In-Stock

1+ parts

$2.138

100+ parts

-

1k+ parts

-

10k+ parts

-

2,890

$2.138

-

-

-

Vyrian

USA . 8,399 parts In-Stock

1+ parts

-

100+ parts

-

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8,399

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Anansix

USA . 307 parts In-Stock

1+ parts

-

100+ parts

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307

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

1+ parts

-

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

$0.839

10k+ parts

-

1,620

$0.932

-

$0.839

-

MKK Technologies

India . 167 parts In-Stock

1+ parts

$1.752

100+ parts

-

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167

$1.752

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-

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DigiPath Technology Company

USA . 167 parts In-Stock

1+ parts

$1.752

100+ parts

-

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167

$1.752

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-

-

Corphita

USA . 939 parts In-Stock

1+ parts

$2.025

100+ parts

-

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939

$2.025

-

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Microchip USA

USA . 7,680 parts In-Stock

1+ parts

$14.495

100+ parts

-

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7,680

$14.495

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A-Z Elektronik GmbH

Germany . 5,790 parts In-Stock

1+ parts

-

100+ parts

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5,790

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

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Parana Technologies

USA . 1,508 parts In-Stock

1+ parts

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100+ parts

$1.114

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1,508

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$1.114

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Perfect Parts

USA . 758 parts In-Stock

1+ parts

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758

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of innovation with the STP10NK70Z from STMicroelectronics, a leader in semiconductor solutions known for their uncompromising quality and reliability. This robust N-channel FET excels in high-voltage applications, offering exceptional efficiency and durability for your switching needs. With its built-in diode and enhanced performance capabilities, it ensures seamless operation in demanding environments. Experience the benefits of superior technology that drives your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent thermal stability and reliability, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances protection against reverse currents.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid state changes, improving overall circuit performance.

Minimum DS Breakdown Voltage: 700 V

A high breakdown voltage ensures the FET can operate safely in high-voltage environments, expanding its application range.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs and facilitates easier integration into circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong, durable connections, making installation straightforward and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower off-state current, which enhances efficiency in power management applications.

Maximum Pulsed Drain Current (IDM): 34 A

The high pulsed drain current rating allows for handling power surges, ensuring reliable performance in dynamic conditions.

Avalanche Energy Rating (EAS): 350 mJ

A robust avalanche rating indicates the FET can handle energy spikes without failing, adding reliability in demanding applications.

Maximum Drain Current (Abs) (ID): 8.6 A

A maximum drain current rating of 8.6 A enables the FET to drive larger loads, making it suitable for high-power applications.

No. of Terminals: 3

The three-terminal design allows for simple and efficient circuit layouts while minimizing complexity.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability means the FET can handle significant power without overheating, enhancing durability and longevity.

Package Style (Meter): FLANGE MOUNT

The flange mount style facilitates secure mounting on a heatsink, improving thermal management in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances switching speed and efficiency, making this FET a great choice for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows for usage in demanding thermal environments without failure.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its stability and efficiency in power applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring durable electrical connections.

Maximum Drain Current (ID): 8.6 A

This duplicate entry reaffirms the FET's ability to efficiently drive substantial load currents, making it versatile for various applications.

Maximum Drain-Source On Resistance: 0.85 ohm

Low on-resistance minimizes energy loss during operation, enhancing the overall efficiency of power systems.

Terminal Position: SINGLE

A single terminal position allows for straightforward PCB design, making integration into existing layouts simpler and more efficient.

Technical Specifications

Power Field Effect Transistors (FET) STP10NK70Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

8.6 A

Maximum Drain Current (ID):

8.6 A

Maximum Drain-Source On Resistance:

.85 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

34 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP10NK70Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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