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STM806TM6E

STMicroelectronics

STM806TM6E by STMicroelectronics

STM806TM6E by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.1V to 5.5V, features an operating temp from -40 °C to 85 °C, and comes in an 8-terminal SO package. Ideal for efficient power supply support circuits, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,919 parts In-Stock

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3,919

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Vyrian

USA . 2,538 parts In-Stock

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2,538

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Anansix

USA . 465 parts In-Stock

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465

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$14.630

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-

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227

$14.630

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IDEA Electronic Components Group

UK . 1,009 parts In-Stock

1+ parts

$22.711

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-

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$20.440

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-

1,009

$22.711

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$20.440

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$26.296

100+ parts

$23.929

1k+ parts

$21.563

10k+ parts

-

1,000

$26.296

$23.929

$21.563

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MKK Technologies

India . 487 parts In-Stock

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$42.707

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487

$42.707

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DigiPath Technology Company

USA . 487 parts In-Stock

1+ parts

$42.707

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487

$42.707

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Microchip USA

USA . 5,821 parts In-Stock

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5,821

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Corphita

USA . 4,825 parts In-Stock

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4,825

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A-Z Elektronik GmbH

Germany . 4,793 parts In-Stock

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4,793

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 160 parts In-Stock

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$27.155

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160

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$27.155

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Overview

Unlock unparalleled efficiency with the STM806TM6E from STMicroelectronics, a leader in innovation and quality. This power management IC is designed to enhance performance in a variety of applications, from industrial automation to consumer electronics. With its robust temperature range and reliable surface mount design, it provides exceptional stability and longevity. Choose STM806TM6E for superior reliability and energy savings that propel your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight yet durable structure, making it ideal for various applications in electronic devices.

Surface Mount: YES

Surface mount compatibility allows for easier integration into compact PCB layouts, enhancing design flexibility.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space on the PCB and allows for efficient assembly.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V offers a stable operating point for reliable power management in various applications.

Power Supplies (V): 3.3/5

Supports dual power supply options (3.3V and 5V), providing versatility for different device requirements.

No. of Terminals: 8

Eight terminals allow for a compact design while still providing necessary connectivity for power management functions.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces PCB space requirements, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Able to operate at elevated temperatures, ensuring reliability in high-heat environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent electrical conductivity and corrosion resistance, enhancing durability.

Terminal Position: DUAL

Dual terminal position provides better layout flexibility and simplifies integration into various designs.

Maximum Seated Height: 1.75 mm

Low seated height allows for slim designs, making this IC suitable for modern sleek electronic devices.

Width: 3.9 mm

Compact width aids in space-saving designs and improves placement options on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed for power supply support, this IC is crucial for ensuring stable operation in power-critical applications.

Minimum Supply Voltage (Vsup): 1.1 V

Low minimum supply voltage makes this IC suitable for low-power applications, extending battery life.

Maximum Time At Peak Reflow Temperature: 40 s

Allows for prolonged exposure during the reflow process without damaging the IC, ensuring reliable solder joints.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability ensures compatibility with various soldering processes.

Length: 4.9 mm

Compact length contributes to a reduced footprint on the PCB, allowing for higher component density.

Nominal Threshold Voltage: +3.075V

Precise threshold voltage enhances operational reliability and can improve energy efficiency in circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees consistent performance in harsh environments, suitable for rugged applications.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current indicates energy efficiency, making this product ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier installation and better mechanical stability on the PCB.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with widely-used PCB designs, easing manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle supply voltages up to 5.5 V provides adaptability for various power requirements.

Technical Specifications

Power Management ICs STM806TM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.075V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM806TM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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