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STM32MP135DAF7T

STMicroelectronics

STM32MP135DAF7T by STMicroelectronics

STM32MP135DAF7T by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. Its low power mode and extensive I/O support enhance versatility in embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,726 parts In-Stock

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5,726

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Digiode

USA . 4,395 parts In-Stock

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4,395

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Anansix

USA . 2,386 parts In-Stock

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2,386

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Distributors (Availability)

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AZTECH Wire

Italy . 565 parts In-Stock

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$18.950

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565

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Corphita

USA . 4,904 parts In-Stock

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Overview

Unlock a world of innovation with the STM32MP135DAF7T from STMicroelectronics, a trusted leader in microprocessor technology. This powerful yet efficient solution is perfect for a variety of applications, from industrial automation to consumer electronics. With its excellent performance, low power consumption, and robust design, you can count on it to deliver reliability and speed when it matters most. Elevate your projects and experience seamless integration with this exceptional microprocessor!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the microprocessor suitable for a variety of applications.

Integrated Cache: YES

Having an integrated cache enhances data access speed, improving overall performance and making the processor more efficient in handling tasks.

Surface Mount: YES

Surface mount technology allows for greater design flexibility and smaller PCB footprints, facilitating compact electronic designs.

Maximum Supply Voltage: 1.38 V

The low maximum supply voltage makes this microprocessor energy-efficient, reducing power consumption in applications.

On Chip Data RAM Width: 8

A RAM width of 8-bit allows for efficient data handling in certain applications, which can be advantageous for specific computing tasks.

Address Bus Width: 26

The 26-bit address bus width supports a larger addressable memory space, allowing for more extensive data handling and processing capabilities.

Package Shape: SQUARE

A square package shape provides uniform dimensions which can simplify board layout and design considerations.

Bit Size: 32

A 32-bit architecture enables the microprocessor to efficiently process larger data types and perform more complex computations.

No. of Terminals: 320

Having 320 terminals allows for extensive connectivity options, accommodating a wide range of peripherals and enabling versatile application solutions.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style promotes efficient use of board space while providing excellent electrical performance and reliability.

Minimum Supply Voltage: 1.32 V

The low minimum supply voltage extends battery life in portable devices, making this microprocessor an ideal choice for mobile applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature allows the microprocessor to function reliably in high-heat environments, widening its application range.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures the microprocessor can be deployed in harsh environments without performance loss.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better thermal performance and makes the PCB design easier for heat dissipation.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact design, essential for space-constrained electronic systems.

RAM Words: 172032

A significant number of RAM words allows for effective multitasking and efficient data handling, enhancing the processor's overall performance.

Width: 11 mm

The compact width of 11 mm is suitable for fitting into small form factor designs, making it versatile for a variety of applications.

Boundary Scan: YES

Support for boundary scan aids in easier testing and debugging of the microprocessor, speeding up development cycles.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer rates, enhancing the overall data handling capacity.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables quick processing speeds, making it suitable for real-time applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor allows for simpler instructions and higher execution speeds, improving processing efficiency.

Technology: CMOS

The CMOS technology ensures low power consumption, making this microprocessor ideal for portable and battery-operated devices.

Terminal Form: BALL

Ball terminal form provides improved electrical connections and reliability, reducing the risk of solder joint issues.

Maximum Supply Current: 268 mA

A moderate supply current enables effective operation while maintaining low power consumption, which is essential in energy-sensitive applications.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V balances performance and energy efficiency, suitable for various power-restricted applications.

No. of DMA Channels: 56

Having 56 DMA channels allows the microprocessor to efficiently manage data transfers, improving throughput and system performance.

No. of Serial I/Os: 10

With 10 serial I/Os, the microprocessor can easily interface with multiple external devices, enhancing connectivity options.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser packing of components, ideal for compact electronic designs.

Format: FIXED POINT

A fixed-point format can simplify operations in embedded systems, providing precise control over data processing.

Speed: 1000 rpm

The 1000 rpm speed ensures efficient operation, particularly in applications requiring quick data processing and response times.

Low Power Mode: YES

The presence of a low power mode enhances battery life in devices, making this microprocessor well-suited for portable applications.

Technical Specifications

Microprocessors STM32MP135DAF7T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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