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STM32MP133AAF3

STMicroelectronics

STM32MP133AAF3 by STMicroelectronics

STM32MP133AAF3 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. Its compact design features a thin profile grid array package with 320 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,190 parts In-Stock

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8,190

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Digiode

USA . 4,043 parts In-Stock

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4,043

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Anansix

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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AZTECH Wire

Italy . 715 parts In-Stock

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$17.960

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715

$17.960

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Corphita

USA . 699 parts In-Stock

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699

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Overview

Elevate your projects with the STM32MP133AAF3 from STMicroelectronics, a trusted leader in innovative microprocessing solutions. Designed for efficiency and versatility, this powerful processor excels in a multitude of applications—from industrial automation to IoT devices. Enjoy exceptional performance with lower power consumption, ensuring longer battery life and reliability. Unlock limitless possibilities and propel your creations forward with this robust, high-quality technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers durability and protection against environmental factors, making the microprocessor suitable for various applications.

Integrated Cache: YES

The presence of integrated cache increases data access speeds and improves overall processing efficiency, enhancing system performance.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier assembly on PCBs, making it ideal for compact electronic devices.

Maximum Supply Voltage: 1.38 V

This low maximum supply voltage ensures compatibility with low-power systems, contributing to energy efficiency.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data handling and processing, beneficial for applications requiring moderate data throughput.

Address Bus Width: 26

A 26-bit address bus width enables access to a larger memory space, allowing for more complex applications and multitasking capabilities.

Package Shape: SQUARE

The square package shape facilitates better PCB layout and integration, making it versatile for varied design requirements.

Bit Size: 32

A 32-bit architecture supports a wider range of applications, providing better performance for software that requires extensive computation.

No. of Terminals: 320

A high number of terminals supports more peripheral connections, enhancing the microprocessor's versatility for different applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This configuration allows for better thermal management and signal integrity, making the microprocessor suitable for high-performance applications.

Minimum Supply Voltage: 1.21 V

A low minimum supply voltage extends the applicability of the microprocessor in various battery-operated devices, enhancing its usability.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microprocessor reliable in demanding environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at very low temperatures ensures functionality in extreme conditions, making this microprocessor ideal for outdoor and rugged applications.

Terminal Position: BOTTOM

Bottom terminal positioning enables efficient packing and heat dissipation, contributing to improved thermal performance.

Maximum Seated Height: 1.2 mm

A low seated height aids in compact design applications, ensuring the microprocessor fits seamlessly into small electronic devices.

RAM Words: 172032

A substantial number of RAM words provides sufficient memory for handling numerous tasks simultaneously, enhancing overall system performance.

Width: 11 mm

With a compact width of 11 mm, the microprocessor is well-suited for space-constrained applications in modern electronics.

Boundary Scan: YES

The boundary scan feature improves debugging and testing capabilities, ensuring that potential faults can be detected easily.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient communication with memory and peripherals, enhancing data transfer rates.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, this microprocessor can handle moderate processing tasks efficiently.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, it offers higher performance per watt, making it suitable for power-sensitive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, extending the device's life in portable applications.

Terminal Form: BALL

Ball terminal form factors provide reliable connections and can support higher pin densities, enhancing the overall design flexibility.

Maximum Supply Current: 239 mA

A maximum supply current of 239 mA is suitable for many low-power applications, ensuring efficient energy use.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage supports optimized power usage, making it ideal for battery-operated and low-energy devices.

No. of DMA Channels: 56

A high number of DMA channels facilitates efficient data transfer with minimal CPU intervention, improving system performance.

No. of Serial I/Os: 10

With 10 serial I/O channels, the microprocessor supports multiple communication interfaces, enhancing connectivity options.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more compact designs, enabling higher integration in smaller electronic devices.

Format: FIXED POINT

Fixed-point format provides consistent and precise calculations, making it suitable for embedded systems requiring mathematical computations.

Speed: 650 rpm

Providing a speed of 650 rpm suggests reliable performance in varied applications, supporting overall system efficiency.

Low Power Mode: YES

The low power mode feature allows the microprocessor to conserve energy when not in full use, extending battery life in portable applications.

Technical Specifications

Microprocessors STM32MP133AAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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