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STM32MP133AAE3

STMicroelectronics

STM32MP133AAE3 by STMicroelectronics

STM32MP133AAE3 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. With low power modes and extensive I/O options, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,507 parts In-Stock

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10,507

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Digiode

USA . 2,381 parts In-Stock

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2,381

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Anansix

USA . 415 parts In-Stock

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415

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$14.260

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406

$14.260

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Corphita

USA . 4,324 parts In-Stock

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4,324

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Overview

Unlock the potential of your next project with the STM32MP133AAE3 microprocessor from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this powerful 32-bit processor excels in industrial automation, IoT applications, and more, offering exceptional performance while maintaining energy efficiency. Enjoy the reliability and support of a trusted manufacturer, empowering you to create cutting-edge solutions that drive your success forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material enhances the product's reliability and protection against environmental factors.

Integrated Cache: YES

The integration of cache improves data access speed, enhancing overall processing performance.

Surface Mount: YES

Surface mount technology allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 1.38 V

This low maximum voltage contributes to lower power consumption, which is critical for battery-powered devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width supports efficient data processing for various applications.

Address Bus Width: 26

The larger address bus width enables access to a wider range of memory, accommodating more complex applications.

Package Shape: SQUARE

A square shape allows for efficient heat dissipation and improved thermal performance.

Bit Size: 32

The 32-bit architecture supports high performance and the ability to handle larger data efficiently.

No. of Terminals: 289

A higher number of terminals allows for more interfaces and connections, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This packaging style enables denser integration and better performance in compact electronic designs.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage further aids in energy efficiency and thermal management.

Maximum Operating Temperature: 125 °C

This high operating temperature enables use in harsh environments, enhancing versatility.

Minimum Operating Temperature: -40 °C

Capability to operate in extreme low temperatures expands possible applications, especially in outdoor or industrial settings.

Terminal Position: BOTTOM

Bottom terminal positioning provides a compact footprint, allowing for efficient PCB layout.

Maximum Seated Height: 1.7 mm

The low seated height contributes to slim and low-profile device designs.

RAM Words: 172032

A substantial amount of RAM enhances processing capability, supporting complex tasks and multitasking.

Width: 14 mm

A narrow width supports compact design, making it compatible with a variety of applications.

Boundary Scan: YES

Support for boundary scan facilitates easier debugging and testing in complex systems.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data transfer between the microprocessor and other components.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz supports fast processing, enhancing performance for demanding applications.

Length: 14 mm

The compact length allows for space-saving configurations in device design.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture is known for high performance and efficiency, making this product suitable for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for modern electronic devices.

Terminal Form: BALL

Ball terminals provide robust connections for high reliability in various applications.

Maximum Supply Current: 239 mA

The relatively low maximum supply current contributes to energy efficiency, suitable for battery-operated devices.

Nominal Supply Voltage: 1.25 V

A nominal supply voltage of 1.25 V aids in energy conservation, which is essential for portable devices.

No. of DMA Channels: 56

A high number of DMA channels allows for efficient data transfers, freeing up CPU resources for other tasks.

No. of Serial I/Os: 10

Multiple serial I/O interfaces enable flexible connectivity options with various peripheral devices.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch supports higher density in PCB layouts without losing connection reliability.

Format: FIXED POINT

Fixed point format is efficient for speed-critical applications, enabling rapid processing without floating-point overhead.

Speed: 650 rpm

A speed of 650 rpm indicates effective performance in applications requiring quick data retrieval and processing.

Low Power Mode: YES

The inclusion of a low power mode enhances battery life for portable devices, making it energy-efficient.

Technical Specifications

Microprocessors STM32MP133AAE3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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