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STM32MP131DAG7

STMicroelectronics

STM32MP131DAG7 by STMicroelectronics

STM32MP131DAG7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. Its low power mode and extensive I/O support enhance versatility in embedded systems.

Median Price

$7.605

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$7.480

100+ parts

$4.800

1k+ parts

$3.980

10k+ parts

$3.810

200

$7.480

$4.800

$3.980

$3.810

DigiKey

USA . 1,522 parts In-Stock

1+ parts

$7.730

100+ parts

$5.049

1k+ parts

$4.566

10k+ parts

-

1,522

$7.730

$5.049

$4.566

-

Mouser Electronics

USA . 125 parts In-Stock

1+ parts

$7.730

100+ parts

$5.050

1k+ parts

$4.560

10k+ parts

-

125

$7.730

$5.050

$4.560

-

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$4.800

1k+ parts

$4.670

10k+ parts

-

200

-

$4.800

$4.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,131 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

$5.700

-

-

-

Vyrian

USA . 3,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,713

-

-

-

-

Anansix

USA . 1,657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,760 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

3,760

$5.400

-

-

-

Overview

Unlock unparalleled performance with the STM32MP131DAG7 microprocessor from STMicroelectronics. Renowned for its robust quality and innovation, STMicroelectronics empowers your projects with exceptional reliability and efficiency. Perfect for diverse applications—from industrial automation to IoT devices—this high-performance chip ensures seamless integration and low power consumption. Elevate your designs, reduce time to market, and experience the cutting-edge advantage that comes with choosing a trusted leader in microprocessor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability against environmental factors.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, leading to better overall performance.

Surface Mount: YES

Surface mount capability allows for a more compact design and enhances manufacturability.

Maximum Supply Voltage: 1.38 V

Supports a higher voltage limit, contributing to better performance and stability under peak load conditions.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width is suitable for tasks requiring efficient data handling.

Address Bus Width: 26

A wide address bus width improves memory addressing capabilities, expanding possible memory access.

Package Shape: SQUARE

The square package shape facilitates effective use of space on the circuit board, optimizing layout.

Bit Size: 32

The 32-bit architecture supports advanced computing functions, making it ideal for modern applications.

No. of Terminals: 289

A higher number of terminals enhances connectivity options and enables integration with various systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This packaging style allows for increased pin density, improving the performance of compact devices.

Minimum Supply Voltage: 1.32 V

A lower minimum supply voltage can help in energy-efficient applications, reducing power consumption.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures reliability and functionality in demanding environments.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this product suitable for use in extreme conditions.

Terminal Position: BOTTOM

Bottom terminal positioning enhances thermal performance and allows for a compact design.

Maximum Seated Height: 1.2 mm

The low seated height is beneficial for applications that require low-profile components.

RAM Words: 172032

A substantial amount of RAM words enables efficient data storage and quick access for applications.

Width: 9 mm

Compact width allows for space-saving designs without compromising performance.

Boundary Scan: YES

The inclusion of boundary scan enhances testing capabilities and helps in fault detection during manufacturing.

External Data Bus Width: 16

A 16-bit external data bus width supports data transfer efficiency, allowing for better performance.

Maximum Clock Frequency: 48 MHz

The high clock frequency enables faster processing speeds, enhancing the overall computing performance.

Length: 9 mm

The length contributes to the compact design of the microprocessor, ideal for constrained spaces.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing RISC architecture promotes faster execution times and efficient instruction processing.

Technology: CMOS

CMOS technology provides low power consumption, making the microprocessor suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form improves soldering quality and enhances the compact design of the package.

Maximum Supply Current: 268 mA

Moderate supply current allows for efficient performance without excessive power demand.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage indicates energy efficiency, reducing operating costs in long-term applications.

No. of DMA Channels: 56

A high number of DMA channels enables efficient data transfers, freeing up CPU resources for other tasks.

No. of Serial I/Os: 8

Multiple serial I/Os allow for versatile connectivity options, facilitating integration into various systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides enhanced connectivity in a compact design, suitable for modern circuits.

Format: FIXED POINT

The fixed-point format is advantageous for applications that require consistent performance and predictable behavior.

Speed: 1000 rpm

The specified speed can support operations in specific applications, providing optimal performance.

Low Power Mode: YES

Low power mode enhances energy efficiency, extending battery life in portable applications.

Technical Specifications

Microprocessors STM32MP131DAG7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

9 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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