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STL9P2UH7

STMicroelectronics

STL9P2UH7 by STMicroelectronics

STL9P2UH7 by STMicroelectronics is a P-CHANNEL FET with 20V DS Breakdown Voltage, 36A IDM, and 0.085 ohm RDS(on). It is used for SWITCHING applications in small outline packages with 5 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,540 parts In-Stock

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Digiode

USA . 3,406 parts In-Stock

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Anansix

USA . 101 parts In-Stock

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101

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$1.326

100+ parts

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$1.193

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286

$1.326

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MKK Technologies

India . 976 parts In-Stock

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$2.493

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976

$2.493

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DigiPath Technology Company

USA . 976 parts In-Stock

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$2.493

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976

$2.493

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AZTECH Wire

Italy . 538 parts In-Stock

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$17.920

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538

$17.920

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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A-Z Elektronik GmbH

Germany . 5,084 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,241 parts In-Stock

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Corphita

USA . 3,901 parts In-Stock

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Parana Technologies

USA . 96 parts In-Stock

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$1.585

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$1.585

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Overview

Unlock the power of innovation with the STL9P2UH7 by STMicroelectronics. As a leader in semiconductor technology, STMicroelectronics is known for its high-quality components. The STL9P2UH7 is a P-Channel Power FET perfect for switching applications. With a maximum pulsed drain current of 36A and a small outline package style, this transistor offers reliability and efficiency. Whether you're designing consumer electronics or automotive systems, the STL9P2UH7 provides the performance and value you need to bring your projects to life. Elevate your designs with STMicroelectronics.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Polarity or Channel Type : P-CHANNEL

P-channel FETs are known for their low on-resistance and high input impedance, making them efficient for switching applications.

Configuration : SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the product's functionality.

Transistor Application : SWITCHING

Designed specifically for switching applications, ensuring reliable performance in controlling power flow.

Surface Mount : YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Minimum DS Breakdown Voltage : 20 V

With a minimum breakdown voltage of 20V, this FET can handle moderate voltage levels, suitable for a wide range of applications.

Package Shape : SQUARE

The square package shape provides a compact footprint, ideal for space-constrained designs.

Terminal Form : FLAT

Flat terminals ensure secure connections and ease of soldering during assembly.

Operating Mode : ENHANCEMENT MODE

Operates in enhancement mode, offering fast switching speeds and low input current requirements.

Maximum Pulsed Drain Current (IDM) : 36 A

High maximum pulsed drain current allows for handling sudden surge currents, making it suitable for high-power applications.

Maximum Drain Current (Abs) (ID) : 9 A

With a maximum drain current of 9A, it can handle moderate power levels, suitable for a range of applications.

No. of Terminals : 5

Five terminals provide flexibility in circuit connections and allow for multiple configurations.

Maximum Power Dissipation (Abs) : 2.9 W

A maximum power dissipation of 2.9W ensures efficient heat dissipation and reliability under load.

Package Style (Meter) : SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs.

Field Effect Transistor Technology : METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in power switching applications.

Maximum Operating Temperature : 150 °C

With a maximum operating temperature of 150 °C, it can withstand high-temperature environments without compromising performance.

Transistor Element Material : SILICON

Silicon-based transistor elements offer superior performance and reliability in power switching applications.

Maximum Drain-Source On Resistance : 0.085 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in power switching applications.

Terminal Position : DUAL

Dual terminal position offers flexibility in circuit connections and allows for various mounting orientations.

Case Connection : DRAIN

The drain case connection simplifies circuit design and improves overall reliability.

Maximum Feedback Capacitance (Crss) : 188 pF

Low feedback capacitance helps in reducing noise and improving stability in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STL9P2UH7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

188 pF

JESD-30 Code:

S-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL9P2UH7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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