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STL9N65M2

STMicroelectronics

STL9N65M2 by STMicroelectronics

STL9N65M2 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 12A pulsed drain current, and operates in enhancement mode. Ideal for high-power circuits, it supports surface mount configurations.

Median Price

$0.532

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,000 parts In-Stock

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$0.532

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$0.532

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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Vyrian

USA . 5,662 parts In-Stock

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Anansix

USA . 2,124 parts In-Stock

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Digiode

USA . 699 parts In-Stock

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699

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IDEA Electronic Components Group

UK . 686 parts In-Stock

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$0.858

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$0.773

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686

$0.858

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$0.773

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MKK Technologies

India . 150 parts In-Stock

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$1.614

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DigiPath Technology Company

USA . 150 parts In-Stock

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$1.614

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Perfect Parts

USA . 10,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,367 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 542 parts In-Stock

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Parana Technologies

USA . 515 parts In-Stock

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$1.026

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Overview

Unlock unparalleled efficiency with the STL9N65M2 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality N-channel Power FET is designed for reliable switching applications, delivering exceptional performance even in the most demanding environments. With its robust construction and built-in diode, it ensures durability and thermal stability, making it perfect for industrial, automotive, and consumer electronics applications. Experience the power of precision engineering and elevate your projects today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency for high-speed applications, making this product ideal for switching use.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode ensures protection against back EMF and allows for efficient switching in applications such as motor control.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring rapid on/off transitions for optimal performance in electronic circuits.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage adds robustness, making this FET suitable for high-voltage applications and enhancing reliability.

Package Shape: SQUARE

The square package shape maximizes space efficiency on PCBs, allowing for more precise layout in confined spaces.

Terminal Form: NO LEAD

No-lead design contributes to reduced parasitic inductance and capacitance, which benefits high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables efficient switching characteristics, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 12 A

High pulsed current capability is essential for applications requiring brief high current surges, improving performance in demanding environments.

Avalanche Energy Rating (EAS): 95 mJ

A high avalanche energy rating enhances protection against transient voltage spikes, increasing the longevity and reliability of the component.

Maximum Drain Current (Abs) (ID): 4.5 A

The maximum drain current specification allows the FET to handle substantial workloads without overheating, enhancing safety and performance.

No. of Terminals: 12

Having multiple terminals allows for flexible circuit designs and provides options for redundancy in critical applications.

Maximum Power Dissipation (Abs): 46 W

High power dissipation capability keeps thermal management efficient, making this FET suitable for high-power applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports high density and can simplify the layout process in compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making this FET suitable for energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high operating temperature range ensures reliability in harsh environmental conditions, contributing to longevity.

Transistor Element Material: SILICON

Silicon provides excellent thermal performance and reliability, making it a standard choice for FETs in various applications.

Minimum Operating Temperature: -55 °C

A wide operating temperature range allows the FET to function in extreme conditions, making it suitable for industrial and automotive applications.

Maximum Drain Current (ID): 4.5 A

The ability to handle a maximum drain current of 4.5 A makes it effective for controlling loads in various applications.

Maximum Drain-Source On Resistance: 1 ohm

Low on-resistance minimizes power loss and heat generation during operation, enhancing overall efficiency in switching applications.

Terminal Position: QUAD

Quad terminal positioning offers flexible layout options, facilitating easy connections in complex circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STL9N65M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

95 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N12

No. of Elements:

1

No. of Terminals:

12

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL9N65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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