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STL9NK30Z

STMicroelectronics

STL9NK30Z by STMicroelectronics

STL9NK30Z by STMicroelectronics is a powerful N-channel FET designed for efficient switching applications. It features a 300V breakdown voltage, 36A pulsed drain current, and operates at up to 150 °C. Ideal for high-performance power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,245 parts In-Stock

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3,245

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Vyrian

USA . 1,475 parts In-Stock

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1,475

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Anansix

USA . 809 parts In-Stock

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809

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 996 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

$0.349

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996

$0.388

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$0.349

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MKK Technologies

India . 2,044 parts In-Stock

1+ parts

$0.730

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2,044

$0.730

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DigiPath Technology Company

USA . 2,044 parts In-Stock

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$0.730

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2,044

$0.730

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.921

100+ parts

$1.902

1k+ parts

$1.825

10k+ parts

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3,000

$1.921

$1.902

$1.825

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A-Z Elektronik GmbH

Germany . 4,650 parts In-Stock

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4,650

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Corphita

USA . 4,624 parts In-Stock

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4,624

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Kepictronics

USA . 1,083 parts In-Stock

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1,083

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Metaverse IC Inc.

Canada . 1,083 parts In-Stock

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1,083

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Parana Technologies

USA . 255 parts In-Stock

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$0.464

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255

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$0.464

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Overview

Unlock the full potential of your designs with the STL9NK30Z from STMicroelectronics—an industry leader known for its commitment to quality and innovation. This powerful N-channel FET excels in switching applications, delivering superior performance with enhanced energy efficiency. Its compact design and built-in diode make it ideal for modern electronics, ensuring reliability and longevity in diverse applications. Elevate your projects with STMicroelectronics' trusted technology and experience unparalleled value!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better electron mobility and efficiency for high-speed switching applications, making this transistor ideal for performance-oriented designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability by providing a path for reverse current, making it suitable for applications that require protection against inductive loads.

Transistor Application: SWITCHING

Optimized for switching applications, this FET enables efficient control in power supply circuits and other dynamic electronic configurations.

Surface Mount: YES

Surface mount technology ensures a compact footprint and simplifies assembly, making it easier to integrate into modern PCB designs.

Minimum DS Breakdown Voltage: 300 V

A high breakdown voltage allows this FET to handle high-voltage applications, enhancing its safety and versatility in various electrical environments.

Package Shape: SQUARE

The square package shape provides uniform thermal distribution and efficient use of space on the circuit board, facilitating effective heat dissipation.

Terminal Form: NO LEAD

No lead design minimizes space and prevents potential lead-related issues, contributing to better reliability and easier assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures that the transistor remains off in its default state, providing greater control over current flow and minimizing power consumption.

Maximum Pulsed Drain Current (IDM): 36 A

High pulsed drain current capability allows this FET to handle short bursts of high current, making it excellent for applications that require peak performance.

Avalanche Energy Rating (EAS): 155 mJ

A substantial avalanche energy rating indicates robustness against transient voltage spikes, enhancing reliability in unpredictable environments.

Maximum Drain Current (Abs) (ID): 9 A

A 9 A maximum drain current provides substantial control capabilities, making it effective for driving loads in various applications.

No. of Terminals: 8

The 8-terminal configuration offers versatile connection options for complex circuit designs, enabling more sophisticated applications.

Maximum Power Dissipation (Abs): 75 W

High power dissipation capability allows for efficient heat management, ensuring longevity and reliability in demanding applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for excellent thermal performance and easier handling during manufacturing and assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables low gate drive power and high-speed operation, making this FET suitable for modern digital and analog applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliable operation in harsh environments, meeting the demands of industrial applications.

Transistor Element Material: SILICON

Silicon is a well-established semiconductor material, ensuring compatibility with a wide range of electronics and robust performance characteristics.

Maximum Drain Current (ID): 9 A

Reiterating the maximum drain current value is crucial, as it confirms the FET's ability to drive significant load currents efficiently.

Maximum Drain-Source On Resistance: 0.4 ohm

A low on-resistance lowers power losses and increases efficiency, making this FET ideal for applications requiring high efficiency.

Terminal Position: QUAD

The quad terminal positioning allows for flexible circuit designs and layout options, enhancing application versatility.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 necessitates proper handling procedures, ensuring product reliability and longevity in storage and application.

Case Connection: DRAIN

A drain connection facilitates straightforward circuit design, simplifying integration into switching power circuits and enhancing functionality.

Technical Specifications

Power Field Effect Transistors (FET) STL9NK30Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

155 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N8

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL9NK30Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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