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STL9N3LLH5

STMicroelectronics

STL9N3LLH5 by STMicroelectronics

STL9N3LLH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 9 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in surface mount designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,934 parts In-Stock

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Anansix

USA . 2,113 parts In-Stock

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Digiode

USA . 354 parts In-Stock

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354

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IDEA Electronic Components Group

UK . 565 parts In-Stock

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$1.788

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$1.610

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565

$1.788

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MKK Technologies

India . 59 parts In-Stock

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$3.363

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59

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DigiPath Technology Company

USA . 59 parts In-Stock

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$3.363

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59

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AZTECH Wire

Italy . 459 parts In-Stock

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$16.210

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Component Stockers USA

USA . 728 parts In-Stock

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$99.990

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728

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Alle Elektronik GmbH

Germany . 3,991 parts In-Stock

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Assy Fe

Spain . 1,293 parts In-Stock

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Parana Technologies

USA . 377 parts In-Stock

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$2.138

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Corphita

USA . 338 parts In-Stock

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Overview

Unlock the power of reliability with the STL9N3LLH5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, delivering exceptional performance with minimal energy loss. Its compact design and built-in diode make it ideal for space-constrained environments. Experience enhanced efficiency and durability, ensuring your projects exceed expectations while benefiting from STMicroelectronics' renowned quality and support.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, resulting in greater efficiency and faster switching capabilities.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the design and adds protection against back EMF and reverse polarity situations.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures quick response times and reduced power losses during operation.

Surface Mount: YES

Surface mount technology allows for compact designs, making it suitable for modern electronic devices with space constraints.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V provides robust performance in high-voltage applications, enhancing reliability.

Package Shape: SQUARE

The square package shape efficiently utilizes board space and allows for better heat dissipation.

Terminal Form: NO LEAD

No-lead terminals improve thermal performance and allow for multiple mounting options.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a normally-off state, reducing power consumption in idle applications.

Maximum Pulsed Drain Current (IDM): 36 A

High maximum pulsed drain current capability supports demanding applications and ensures reliable performance under transient conditions.

Maximum Drain Current (Abs) (ID): 9 A

Absorption of up to 9 A makes this FET suitable for a variety of load applications while ensuring safety margins.

No. of Terminals: 5

Five terminals allow for versatile circuit configurations and robust connectivity options.

Maximum Power Dissipation (Abs): 50 W

A maximum power dissipation of 50 W enables this FET to handle high levels of power without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern, compact electronics, saving board space and improving layout efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides a high input impedance, which minimizes loading effects and enhances circuit stability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows the FET to function reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon is a well-established material known for good performance, stability, and availability in FET designs.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability and provides excellent corrosion resistance for long-term reliability.

Maximum Drain Current (ID): 9 A

Consistent with previous points, a maximum drain current of 9 A supports safe operation in various power levels.

Maximum Drain-Source On Resistance: 0.022 ohm

Low on-resistance reduces power losses during operation, increasing efficiency and minimizing heat generation.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and ease of thermal management.

Case Connection: DRAIN

DRAIN case connection improves the thermal conduction path, maximizing the efficiency of heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures reliable solder joint formation while guarding against thermal damage.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with high-temperature soldering processes, enhancing manufacturability.

Technical Specifications

Power Field Effect Transistors (FET) STL9N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL9N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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