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STL80NF3LL

STMicroelectronics

STL80NF3LL by STMicroelectronics

STL80NF3LL by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for high-power circuits, it offers low on-resistance (0.007 Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,496 parts In-Stock

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Digiode

USA . 1,819 parts In-Stock

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Anansix

USA . 774 parts In-Stock

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IDEA Electronic Components Group

UK . 1,350 parts In-Stock

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$0.972

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$0.874

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$0.972

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MKK Technologies

India . 1,807 parts In-Stock

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$1.827

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DigiPath Technology Company

USA . 1,807 parts In-Stock

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$1.827

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1,807

$1.827

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A-Z Elektronik GmbH

Germany . 7,236 parts In-Stock

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Corphita

USA . 4,084 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 2,090 parts In-Stock

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$1.162

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$1.162

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Overview

Unlock unparalleled performance with the STL80NF3LL from STMicroelectronics, a powerhouse in Power FET technology. Designed for efficient switching applications, this N-channel transistor offers exceptional current handling and thermal management, ensuring reliability in demanding environments. With STMicroelectronics' commitment to quality and innovation, you can trust that this component will elevate your designs, delivering efficiency and durability for automotive, industrial, and consumer electronics applications.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their efficiency in switching applications, allowing for faster operation and better performance in power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional circuit protection and simplifies design by reducing the need for external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable performance, making it ideal for power control and regulation tasks.

Surface Mount: YES

Surface mount technology facilitates compact designs, allowing for higher density component placement and improved overall circuit performance.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures this transistor can handle higher voltages, providing better reliability in various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space and allows for efficient heat dissipation, which is crucial for maintaining performance.

Terminal Form: NO LEAD

No lead design enhances thermal performance and minimizes the footprint on the PCB, benefiting compact circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower operating power and ensures the transistor turns on with minimal gate voltage, increasing efficiency.

Maximum Pulsed Drain Current (IDM): 80 A

The capability to handle pulsed currents up to 80 A makes this FET suitable for high-power applications, enhancing versatility.

Maximum Drain Current (Abs) (ID): 80 A

With an absolute maximum drain current of 80 A, this device supports high-load applications, making it a robust choice.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and integration into complex circuits, providing flexibility in application.

Maximum Power Dissipation (Abs): 80 W

An ability to dissipate up to 80 W ensures that the device can manage heat effectively, enhancing reliability in demanding applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides durability while maintaining a low profile, suitable for high-density assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology contributes to low gate drive power and high input impedance, making this FET efficient for various applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C increases operational reliability in extreme conditions, suitable for industrial environments.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal stability and electrical properties, ensuring a dependable performance in applications.

Maximum Drain Current (ID): 20 A

While the absolute max is 80 A, a rated max of 20 A provides a reliable performance baseline in standard operations, contributing to overall safety.

Maximum Drain-Source On Resistance: 0.007 ohm

With a low on-resistance of 0.007 ohm, this FET minimizes power loss during operation, enhancing overall efficiency for power management.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better thermal contact with heat sinks, improving heat dissipation and reliability.

Case Connection: DRAIN

DRAIN case connection facilitates efficient circuit connections, simplifying integration within power management systems.

Technical Specifications

Power Field Effect Transistors (FET) STL80NF3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL80NF3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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