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STL85N6F3

STMicroelectronics

STL85N6F3 by STMicroelectronics

STL85N6F3 by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 85 A, a breakdown voltage of 60 V, and low on-resistance of 0.0057 Ω. This compact surface-mount device excels in power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,617 parts In-Stock

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Digiode

USA . 1,886 parts In-Stock

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Anansix

USA . 229 parts In-Stock

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Sunrise Surplus Inc.

USA . 57 parts In-Stock

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

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$1.065

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$0.959

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$1.065

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$0.959

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MKK Technologies

India . 1,218 parts In-Stock

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$2.003

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DigiPath Technology Company

USA . 1,218 parts In-Stock

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$2.003

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$2.003

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AZTECH Wire

Italy . 302 parts In-Stock

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$21.750

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Perfect Parts

USA . 16,257 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,409 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,120 parts In-Stock

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Parana Technologies

USA . 1,030 parts In-Stock

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$1.274

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Kepictronics

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Overview

Elevate your designs with the STL85N6F3 from STMicroelectronics, a leading name in advanced semiconductor technology. This robust N-channel power FET combines exceptional efficiency and reliability, making it ideal for high-performance switching applications. Experience benefits like minimal energy loss and impressive power handling, ensuring your projects achieve optimal performance while enjoying the backing of a trusted manufacturer known for quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging provides excellent durability and resistance to moisture, making it ideal for a variety of electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency, making them suitable for applications requiring high current handling.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates designs in which reverse current flow is expected, enhancing the device's versatility.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control power in various electronic circuits, providing high performance.

Surface Mount: YES

Surface mount capability allows for compact designs and ease of integration into modern PCB layouts.

Minimum DS Breakdown Voltage: 60 V

A minimum rating of 60V ensures reliable performance in high voltage applications, offering significant design flexibility.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs and can improve thermal management.

Terminal Form: NO LEAD

No-lead technology reduces parasitic inductance and allows for better thermal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves efficiency in switching and amplifying applications by providing better control over channel conductivity.

Maximum Pulsed Drain Current (IDM): 76 A

The high pulsed drain current rating allows for powerful surge handling in dynamic applications.

Maximum Drain Current (Abs) (ID): 19 A

A solid maximum continuous drain current rating ensures that the FET can handle substantial loads, making it suitable for heavy-duty applications.

No. of Terminals: 5

Five terminals allow for flexible circuit integration and simplify connections in more complex designs.

Maximum Power Dissipation (Abs): 80 W

A maximum power dissipation rating of 80W offers robust performance in high-power applications while maintaining thermal stability.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact footprint, enabling fitting into space-constrained electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low leakage, enhancing overall circuit efficiency and performance.

Maximum Operating Temperature: 150 °C

Operating at up to 150 °C enhances reliability in high-temperature environments often encountered in industrial applications.

Transistor Element Material: SILICON

Silicon as the element material ensures a proven track record of high performance, thermal efficiency, and low cost.

Maximum Drain Current (ID): 85 A

The high drain current capability at 85A allows for extensive use in demanding power applications.

Maximum Drain-Source On Resistance: 0.0057 ohm

A low on-resistance value significantly reduces power losses during operation, leading to improved energy efficiency.

Terminal Position: DUAL

Dual terminal positioning can enhance thermal performance and optimize layout designs in various configurations.

Case Connection: DRAIN

A drain case connection simplifies thermal management, facilitating better heat dissipation in integrated circuits.

Technical Specifications

Power Field Effect Transistors (FET) STL85N6F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

85 A

Maximum Drain-Source On Resistance:

.0057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL85N6F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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