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STL80N4LL

STMicroelectronics

STL80N4LL by STMicroelectronics

STL80N4LL by STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 150 °C. Its compact design with no leads makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,237 parts In-Stock

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4,237

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Vyrian

USA . 3,885 parts In-Stock

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3,885

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Anansix

USA . 1,056 parts In-Stock

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1,056

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 145 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

$0.249

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145

$0.277

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$0.249

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MKK Technologies

India . 1,367 parts In-Stock

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$0.521

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1,367

$0.521

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DigiPath Technology Company

USA . 1,367 parts In-Stock

1+ parts

$0.521

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1,367

$0.521

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Corphita

USA . 3,715 parts In-Stock

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3,715

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Parana Technologies

USA . 205 parts In-Stock

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$0.331

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205

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$0.331

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Overview

Elevate your designs with the STL80N4LL from STMicroelectronics—a powerful N-channel FET that delivers unmatched efficiency for switching applications. Renowned for precision and reliability, STMicroelectronics ensures each transistor meets the highest quality standards, enabling robust performance even in demanding environments. With its compact surface mount design and impressive power handling capabilities, this FET is perfect for automotive, industrial, and consumer electronics, offering you enhanced reliability and longevity for your projects. Choose STL80N4LL to drive innovation and excellence!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better electron mobility and efficiency, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides intrinsic protection and simplifies circuit design, reducing the number of components needed.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast operation and minimal delay in high-speed circuits.

Surface Mount: YES

Surface mount capability allows for smaller designs and automated assembly, making it suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a breakdown voltage of 40V, this FET can reliably handle a variety of applications without risk of failure due to voltage over-rating.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, facilitating compact designs without sacrificing performance.

Terminal Form: NO LEAD

No lead construction minimizes the physical footprint and reduces inductance for improved high-frequency performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enhances performance in applications requiring low on-resistance and high efficiency.

Maximum Pulsed Drain Current (IDM): 80 A

High pulsed drain current capacity allows the FET to handle brief high-power applications, making it versatile in different circuits.

Maximum Drain Current (Abs) (ID): 80 A

The high absolute drain current rating enables the FET to support demanding applications without overheating or failing.

No. of Terminals: 5

Five terminals offer flexibility in circuit design and layout, ensuring compatibility with various configurations.

Maximum Power Dissipation (Abs): 80 W

High power dissipation capability allows for safe operation in high-power applications, improving reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications, ensuring a neat and compact implementation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low power consumption and high speed, making this FET suitable for a wide range of electronic applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the FET to function in tough thermal environments without degradation.

Transistor Element Material: SILICON

Silicon as the material ensures reliable performance, good thermal conductivity, and widespread availability.

Terminal Finish: TIN

Tin finish enhances solderability and provides good corrosion resistance, ensuring durability in various environments.

Maximum Drain Current (ID): 20 A

This rated current ensures dependable operation in applications that require consistent switch performance.

Maximum Drain-Source On Resistance: 0.007 ohm

Ultra-low on-state resistance significantly reduces power loss during operation, improving overall system efficiency.

Terminal Position: DUAL

Dual terminal position allows for flexible circuit design, supporting both parallel and series configurations.

Case Connection: DRAIN

Drain connection ensures compatibility with a wide range of circuit configurations, improving design versatility.

Technical Specifications

Power Field Effect Transistors (FET) STL80N4LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N5

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL80N4LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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