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STL22NF10

STMicroelectronics

STL22NF10 by STMicroelectronics

STL22NF10 by STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 22 A, a breakdown voltage of 100 V, and operates at up to 150 °C. Its compact design with no leads makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,811 parts In-Stock

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4,811

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Vyrian

USA . 3,741 parts In-Stock

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3,741

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Anansix

USA . 1,402 parts In-Stock

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1,402

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,177 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

$0.324

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1,177

$0.360

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$0.324

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MKK Technologies

India . 662 parts In-Stock

1+ parts

$0.676

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662

$0.676

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DigiPath Technology Company

USA . 662 parts In-Stock

1+ parts

$0.676

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662

$0.676

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 2,104 parts In-Stock

1+ parts

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100+ parts

$0.430

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2,104

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$0.430

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Corphita

USA . 107 parts In-Stock

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107

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Overview

Experience exceptional performance with the STL22NF10 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET delivers reliable switching capabilities and unmatched efficiency, perfect for diverse applications from automotive to industrial systems. Built with quality and precision, it ensures robust operation under demanding conditions, offering customers peace of mind and high-value returns on investment. Elevate your projects with STMicroelectronics' commitment to excellence!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics in terms of speed and efficiency, making this FET a great choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability by providing a path for inductive kickback, which is essential for applications that involve inductive loads.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers improved efficiency in on/off control of electrical signals.

Surface Mount: YES

Surface mount technology allows for compact design and reduces space requirements on printed circuit boards, facilitating modern electronics practices.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can withstand high voltage applications, ensuring durability and reliability.

Package Shape: SQUARE

The square package shape allows for efficient thermal management and space utilization on the circuit board.

Terminal Form: NO LEAD

No-lead packaging improves thermal performance and allows for better electrical connection, enhancing overall device reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides excellent switching characteristics, making this FET suitable for various electronic circuits.

Maximum Pulsed Drain Current (IDM): 22 A

Capable of handling pulsed currents up to 22 A, this FET is ideal for applications that may require high current surges.

Avalanche Energy Rating (EAS): 82 mJ

An avalanche energy rating of 82 mJ indicates robust performance under transient conditions, enhancing product reliability in dynamic applications.

Maximum Drain Current (Abs) (ID): 22 A

Allows for high continuous current handling capabilities, making this transistor suitable for high-power applications.

No. of Terminals: 5

The five terminals enable more complex configurations and connections, offering versatility in circuit design.

Maximum Power Dissipation (Abs): 70 W

With a maximum power dissipation of 70 W, this FET can efficiently manage heat, preventing thermal overload in high-power scenarios.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are suited for integrated assemblies, allowing for better integration into complex electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and fast switching speeds, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures this FET can perform reliably in extreme conditions in various environments.

Transistor Element Material: SILICON

Silicon-based FETs are widely used due to their established properties and reliability, ensuring a broad range of use cases.

Maximum Drain Current (ID): 5.3 A

Provides a robust capability for handling drain current up to 5.3 A under normal operating conditions, ensuring dependable performance.

Maximum Drain-Source On Resistance: 0.06 ohm

A low on-resistance indicates minimal power loss during operation, which translates to higher efficiency and reduced heat generation.

Terminal Position: QUAD

The quad terminal position allows for flexible design options, facilitating efficient layout on circuit boards.

Case Connection: DRAIN

Having the case connected to the drain enhances thermal performance and simplifies circuit layout, making it easier to integrate into designs.

Technical Specifications

Power Field Effect Transistors (FET) STL22NF10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

82 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

5.3 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQCC-N5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL22NF10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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