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STL20NF06LAG

STMicroelectronics

STL20NF06LAG by STMicroelectronics

STL20NF06LAG by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 20 A, a breakdown voltage of 60 V, and operates at temperatures from -55 °C to 175 °C. Ideal for power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,753 parts In-Stock

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4,753

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Vyrian

USA . 3,745 parts In-Stock

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3,745

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Bristol Electronics

USA . 1,354 parts In-Stock

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1,354

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Atlantic Semiconductor

USA . 1,354 parts In-Stock

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Anansix

USA . 1,345 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$1.271

100+ parts

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$1.143

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728

$1.271

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$1.143

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MKK Technologies

India . 1,076 parts In-Stock

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$2.389

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DigiPath Technology Company

USA . 1,076 parts In-Stock

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$2.389

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$2.389

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AZTECH Wire

Italy . 127 parts In-Stock

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$19.590

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Ampacity Inc.

Singapore . 1,105 parts In-Stock

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$26.050

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$26.050

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Perfect Parts

USA . 10,080 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,649 parts In-Stock

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Corphita

USA . 3,147 parts In-Stock

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Parana Technologies

USA . 2,214 parts In-Stock

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$1.519

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Overview

Elevate your designs with the STL20NF06LAG from STMicroelectronics, a powerhouse in innovation and reliability. This N-Channel MOSFET offers exceptional switching capabilities, ensuring efficient power management across diverse applications. With a robust design capable of handling high currents and temperatures, it’s perfect for everything from automotive to industrial uses. Trust in STMicroelectronics’ commitment to quality and performance, and unlock unmatched value for your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy materials enhances durability and protects the internal components from environmental factors, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage, which enhances the overall reliability of the device in demanding applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in energy-efficient power management systems.

Surface Mount: YES

Surface mount capability allows for compact designs and easier assembly, making this component suitable for modern electronic devices.

Minimum DS Breakdown Voltage: 60 V

This relatively high breakdown voltage ensures the FET can operate safely in applications requiring substantial voltage handling.

Package Shape: RECTANGULAR

The rectangular package shape aids in space efficiency on PCBs, allowing for denser circuit designs.

Terminal Form: FLAT

Flat terminal design allows for better thermal transfer and more efficient soldering, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides low power consumption when idle, making it highly efficient in energy-sensitive applications.

Maximum Pulsed Drain Current (IDM): 80 A

The high pulsed drain current capability enables the device to manage substantial current spikes, vital for power applications.

Avalanche Energy Rating (EAS): 210 mJ

A higher avalanche energy rating improves protection against transient voltage spikes, increasing the device's reliability in real-world scenarios.

No. of Terminals: 5

Having five terminals allows for flexible circuit design, particularly in applications requiring multiple connections.

Maximum Power Dissipation (Abs): 75 W

This high power dissipation rating allows for effective heat management, enabling the FET to operate reliably under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to miniaturization of circuit designs, allowing for more compact and portable devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to faster switching speeds and lower power consumption compared to traditional transistor technologies.

Maximum Operating Temperature: 175 °C

This high maximum operating temperature increases the FET's versatility, allowing it to be used in high-temperature environments without failure.

Transistor Element Material: SILICON

Silicon is a globally recognized standard for FETs, providing reliability and efficiency in a wide range of applications.

Minimum Operating Temperature: -55 °C

A wide operating temperature range ensures the FET can perform effectively in extreme conditions, making it suitable for automotive and aerospace applications.

Maximum Drain Current (ID): 20 A

A maximum drain current rating of 20 A indicates this FET can handle significant current loads, beneficial for high-power switching applications.

Maximum Drain-Source On Resistance: 0.05 ohm

Low on-resistance aids in reducing power losses and improving switching efficiency, thus contributing to overall system performance.

Terminal Position: DUAL

Dual terminal positions allow for more versatile circuit layouts, providing flexibility during integration into various designs.

Case Connection: DRAIN

DRAIN case connection optimizes thermal management and enhances the performance of the FET in practical applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard indicates the FET's reliability and robustness, suitable for automotive and high-stakes applications.

Technical Specifications

Power Field Effect Transistors (FET) STL20NF06LAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL20NF06LAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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