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STL21N65M5

STMicroelectronics

STL21N65M5 by STMicroelectronics

STL21N65M5 by STMicroelectronics is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features 10.8A Max Pulsed Drain Current and 0.19 ohm Max Drain-Source On Resistance. The transistor operates in ENHANCEMENT MODE, with a max power dissipation of 125W at 150°C.

Median Price

$3.955

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,449 parts In-Stock

1+ parts

$2.738

100+ parts

-

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-

10k+ parts

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1,449

$2.738

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Chip1Stop

Japan . 1,449 parts In-Stock

1+ parts

$3.580

100+ parts

-

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-

10k+ parts

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1,449

$3.580

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Mouser Electronics

USA . 2,712 parts In-Stock

1+ parts

$4.330

100+ parts

$2.880

1k+ parts

$2.680

10k+ parts

-

2,712

$4.330

$2.880

$2.680

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DigiKey

USA . 4,741 parts In-Stock

1+ parts

$6.240

100+ parts

$3.026

1k+ parts

$2.465

10k+ parts

$2.465

4,741

$6.240

$3.026

$2.465

$2.465

Verical

USA . 1,449 parts In-Stock

1+ parts

-

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1,449

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Distributors (In-Stock)

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EXC GmbH

Germany . 228 parts In-Stock

1+ parts

$2.115

100+ parts

-

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228

$2.115

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Vyrian

USA . 2,468 parts In-Stock

1+ parts

$2.420

100+ parts

-

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2,468

$2.420

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Digiode

USA . 4,230 parts In-Stock

1+ parts

$2.601

100+ parts

-

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4,230

$2.601

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$4.783

3,000

-

-

-

$4.783

Anansix

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

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2,287

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Rebound Electronics

UK . 992 parts In-Stock

1+ parts

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992

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Nova Conductors

Japan . 97 parts In-Stock

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97

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Prism Electronics

USA . 68 parts In-Stock

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68

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.415

100+ parts

$0.378

1k+ parts

$0.340

10k+ parts

-

100

$0.415

$0.378

$0.340

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IDEA Electronic Components Group

UK . 467 parts In-Stock

1+ parts

$1.413

100+ parts

-

1k+ parts

$1.272

10k+ parts

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467

$1.413

-

$1.272

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Modulus Dynamics

Lithuania . 200 parts In-Stock

1+ parts

$2.168

100+ parts

$2.168

1k+ parts

$2.168

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-

200

$2.168

$2.168

$2.168

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Ampacity Inc.

Singapore . 2,337 parts In-Stock

1+ parts

$2.330

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2,337

$2.330

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Corphita

USA . 4,599 parts In-Stock

1+ parts

$2.464

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4,599

$2.464

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MKK Technologies

India . 1,515 parts In-Stock

1+ parts

$2.657

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1,515

$2.657

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DigiPath Technology Company

USA . 1,515 parts In-Stock

1+ parts

$2.657

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1,515

$2.657

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Microchip USA

USA . 8,233 parts In-Stock

1+ parts

$22.079

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8,233

$22.079

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 396 parts In-Stock

1+ parts

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$1.690

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396

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$1.690

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Experience unmatched performance and reliability with the STL21N65M5 by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-notch Power FETs that are perfect for switching applications. This N-channel transistor boasts a high DS breakdown voltage of 650V and a maximum drain current of 17A, ensuring optimal efficiency and power handling. With a small outline package style and matte tin terminal finish, this FET is not only easy to install but also durable and long-lasting. Trust STMicroelectronics to provide you with the quality and value you need for all your power switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher mobility and faster switching speeds compared to P-channel transistors, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces the need for external components, making the product more efficient and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product offers fast and reliable performance in various electronic circuits.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this product can handle high voltage applications without breakdown, ensuring safe operation in demanding environments.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for applications where space is limited.

Terminal Form: NO LEAD

The no-lead terminal form offers improved thermal performance and reliability, making the product suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer lower on-resistance and higher gate voltage control, making them suitable for high-speed switching applications.

Maximum Pulsed Drain Current (IDM): 10.8 A

The high pulsed drain current rating allows the product to withstand short-duration high current spikes, making it suitable for surge protection and power management applications.

Avalanche Energy Rating (EAS): 400 mJ

With a high avalanche energy rating, this product can dissipate energy during high-power switching without damage, ensuring reliable operation in harsh conditions.

Maximum Drain Current (Abs) (ID): 17 A

The high maximum drain current rating ensures the product can handle high current loads, making it suitable for power electronics applications.

No. of Terminals: 5

With five terminals, this product offers versatile connection options and flexibility in circuit design.

Maximum Power Dissipation (Abs): 125 W

The high maximum power dissipation allows the product to handle high power levels without overheating, ensuring reliable operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability compared to other transistor technologies, making this product a high-quality choice.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can operate reliably in high-temperature environments, ensuring consistent performance under extreme conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, offering good thermal conductivity and electrical properties for efficient performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections in various applications.

Maximum Drain Current (ID): 2.7 A

The high maximum drain current rating allows the product to handle moderate current loads, making it suitable for a wide range of electronic applications.

Maximum Drain-Source On Resistance: 0.19 ohm

With a low on-resistance, this product minimizes power loss and heat generation during operation, making it energy-efficient and suitable for high-performance applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and connection options, making the product versatile and easy to integrate into various electronic systems.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation, ensuring the product can handle high-power operation without overheating.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures reliable soldering and joint formation during assembly, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for fast and effective soldering during assembly, ensuring strong and reliable connections in the final product.

Technical Specifications

Power Field Effect Transistors (FET) STL21N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10.8 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL21N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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