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STK850

STMicroelectronics

STK850 by STMicroelectronics

STK850 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max pulsed drain current of 120 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,408 parts In-Stock

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Digiode

USA . 3,821 parts In-Stock

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3,821

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Anansix

USA . 2,530 parts In-Stock

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2,530

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Bristol Electronics

USA . 1,415 parts In-Stock

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Sunrise Surplus Inc.

USA . 75 parts In-Stock

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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IDEA Electronic Components Group

UK . 1,746 parts In-Stock

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$1.528

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$1.375

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$1.528

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$1.375

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MKK Technologies

India . 594 parts In-Stock

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$2.874

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DigiPath Technology Company

USA . 594 parts In-Stock

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$2.874

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AZTECH Wire

Italy . 239 parts In-Stock

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$21.480

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Kepictronics

USA . 5,050 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,793 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,791 parts In-Stock

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Corphita

USA . 997 parts In-Stock

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Parana Technologies

USA . 873 parts In-Stock

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$1.827

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$1.827

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Overview

Unlock the potential of your designs with the STK850 from STMicroelectronics, a leader in semiconductor innovation. This powerful N-channel FET ensures reliable performance in switching applications, boasting an impressive 120A pulsed drain current and built-in diode for enhanced efficiency. Designed for surface mount technology, it's perfect for compact applications where space and reliability matter. Trust STMicroelectronics for unmatched quality and experience the difference in your projects!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer lower on-resistance and better performance in switching applications, making them ideal for efficient power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for fast switching and reverse protection, enhancing the reliability of the application.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides rapid response times necessary for modern electronic devices.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

A 30V breakdown voltage ensures robust operation in various environments, allowing it to withstand voltage spikes without damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space in circuit designs and easier PCB layout.

Terminal Form: NO LEAD

No-lead design minimizes parasitic inductance and capacitance, improving performance in high-frequency applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are ideal for low-power applications, allowing for a complete shut-off when the gate voltage is low.

Maximum Pulsed Drain Current (IDM): 120 A

A high pulsed drain current rating supports demanding applications, enabling the FET to handle short bursts of high current.

Avalanche Energy Rating (EAS): 1400 mJ

The substantial avalanche energy rating contributes to the FET's durability, protecting it against energy transient events.

Maximum Drain Current (Abs) (ID): 30 A

With a maximum drain current of 30 A, this FET is suitable for high-power applications where substantial current is required.

No. of Terminals: 4

Four terminals provide additional connection options, enhancing versatility in circuit configurations.

Maximum Power Dissipation (Abs): 5.2 W

A power dissipation rating of 5.2 W helps prevent overheating, which is critical for maintaining performance stability.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes the footprint on PCBs, ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-density integration and superior switching speeds, making it suitable for complex circuits.

Maximum Operating Temperature: 150 °C

A high operating temperature allows the FET to function reliably in demanding environments and reduces the need for extensive cooling.

Transistor Element Material: SILICON

Silicon as the element material ensures excellent electrical performance and is widely used for its reliability in various applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures better solderability, which is vital for the longevity and dependability of connections.

Maximum Drain Current (ID): 30 A

The repeated specification highlights the FET's capability to sustain high current performance reliably in multiple operational scenarios.

Maximum Drain-Source On Resistance: 0.0035 ohm

A very low on-resistance significantly reduces power loss during operation, increasing overall efficiency.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility, aiding in better thermal management and design optimization.

Case Connection: SOURCE

Having the source as the case connection simplifies design and enhances thermal performance by providing a direct cooling path.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak temperature ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness against thermal cycling, crucial for long-term reliability in electronic assemblies.

Technical Specifications

Power Field Effect Transistors (FET) STK850 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK850 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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