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STK802

STMicroelectronics

STK802 by STMicroelectronics

STK802 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 34 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,565 parts In-Stock

1+ parts

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3,565

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Anansix

USA . 2,740 parts In-Stock

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2,740

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Vyrian

USA . 773 parts In-Stock

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773

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 65 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

$0.405

10k+ parts

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65

$0.450

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$0.405

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MKK Technologies

India . 1,245 parts In-Stock

1+ parts

$0.846

100+ parts

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1,245

$0.846

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DigiPath Technology Company

USA . 1,245 parts In-Stock

1+ parts

$0.846

100+ parts

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1,245

$0.846

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Corphita

USA . 3,448 parts In-Stock

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3,448

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Parana Technologies

USA . 1,724 parts In-Stock

1+ parts

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100+ parts

$0.538

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1,724

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$0.538

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Overview

Elevate your design with the STK802 from STMicroelectronics, a powerhouse in N-Channel FET technology. Engineered for superior performance and reliability, this versatile switching transistor is perfect for applications across automotive, consumer electronics, and industrial sectors. With its compact surface mount design and exceptional current handling, the STK802 ensures efficiency and longevity, empowering you to create innovative solutions that stand out in today's competitive market. Experience quality and innovation with STMicroelectronics—where excellence meets performance!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs usually provide higher electron mobility, resulting in improved switching performance and efficiency, making this product suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode configuration enhances reliability by protecting against reverse polarity, making this FET ideal for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can provide fast and efficient performance, optimizing power management in circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits, enhancing manufacturing efficiency.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle a range of applications without risk of damage, providing a robust solution.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, allowing for high-density designs.

Terminal Form: NO LEAD

No-lead design facilitates better thermal performance and reduces the size of the overall package, enhancing integration in compact applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower ON resistance and better control, making this FET ideal for efficient power usage.

Maximum Pulsed Drain Current (IDM): 136 A

The high pulsed drain current capability supports demanding applications, ensuring reliability under heavy load conditions.

Maximum Drain Current (Abs) (ID): 30 A

A maximum drain current of 30 A indicates strong performance in high-current applications, ideal for power management solutions.

No. of Terminals: 10

The 10-terminal configuration allows for versatile connections and simplifies circuit design, providing flexibility in application.

Maximum Power Dissipation (Abs): 5.2 W

High power dissipation capability ensures the device can operate effectively without overheating in demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style is easy to handle, providing convenience in manufacturing and assembly of electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower gate drive power and high-speed operation, making this FET suitable for energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in harsh environments, making this FET suitable for varied applications.

Transistor Element Material: SILICON

Silicon is well-known for its reliable electrical properties and stability, making this FET a trusted choice in the industry.

Maximum Drain Current (ID): 34 A

The 34 A maximum drain current showcases the transistor's strong performance capabilities, ideal for demanding applications.

Maximum Drain-Source On Resistance: 0.0031 ohm

A low on-resistance value translates to less power loss during operation, enhancing efficiency and longevity of the device.

Terminal Position: DUAL

Dual terminal positioning allows for better thermal performance and layout flexibility in circuit design, enhancing overall efficiency.

Case Connection: SOURCE

Having the case connection at the source provides efficient thermal management, essential for maintaining performance in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STK802 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N10

No. of Elements:

1

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

136 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK802 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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