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STK32N4LLF5

STMicroelectronics

STK32N4LLF5 by STMicroelectronics

STK32N4LLF5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 32 A, a breakdown voltage of 40 V, and low on-resistance of 0.003 Ω. Ideal for compact power management in modern electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 408 parts In-Stock

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408

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Vyrian

USA . 330 parts In-Stock

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330

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Digiode

USA . 324 parts In-Stock

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324

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,342 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

$0.495

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2,342

$0.550

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$0.495

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MKK Technologies

India . 2,032 parts In-Stock

1+ parts

$1.035

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2,032

$1.035

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DigiPath Technology Company

USA . 2,032 parts In-Stock

1+ parts

$1.035

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2,032

$1.035

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Corphita

USA . 3,985 parts In-Stock

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3,985

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Parana Technologies

USA . 929 parts In-Stock

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$0.658

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929

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$0.658

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Overview

Unlock the potential of your designs with the STK32N4LLF5 from STMicroelectronics, a powerhouse in semiconductor innovation. This N-channel power FET delivers exceptional efficiency and reliability, ensuring seamless switching performance for a wide range of applications. With unmatched quality and advanced technology, STMicroelectronics guarantees superior durability, making the STK32N4LLF5 your go-to solution for cutting-edge projects that demand excellence. Experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance in terms of speed and on-resistance, making them ideal for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode aids in protecting against reverse voltage, enhancing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can manage power efficiently, making it suitable for a variety of electronic circuits.

Surface Mount: YES

Surface mount technology allows for reduced space on PCBs and enables automated assembly processes, facilitating higher manufacturing efficiency.

Minimum DS Breakdown Voltage: 40 V

With a breakdown voltage of 40 V, this FET is capable of handling various high-voltage applications, providing robustness and versatility.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and thermal management, which is crucial for maintaining performance in densely packed circuits.

Terminal Form: NO LEAD

No lead design minimizes parasitic inductance and resistance, which is beneficial for high-speed applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for lower gate drive voltages, reducing overall power consumption in low-power applications.

Maximum Pulsed Drain Current (IDM): 128 A

This high pulsed drain current rating enables the FET to handle transient loads effectively, making it suitable for demanding applications.

No. of Terminals: 10

Having 10 terminals allows for multiple connection options and flexibility in circuit design, accommodating complex layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in compact designs while ensuring adequate cooling and thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology contributes to high efficiency and fast switching speeds, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material, providing reliable performance, availability, and cost-effectiveness.

Terminal Finish: MATTE TIN

A matte tin finish improves solderability and prevents oxidation, enhancing the reliability of electrical connections.

Maximum Drain Current (ID): 32 A

The maximum drain current rating ensures that the FET can handle substantial loads safely, vital for stable performance in power applications.

Maximum Drain-Source On Resistance: 0.003 ohm

A low on resistance means lower power losses during operation, contributing to overall efficiency and thermal management in circuits.

Terminal Position: DUAL

Dual terminal positioning supports both easy routing of connections and improved heat dissipation, enhancing overall device performance.

Case Connection: SOURCE

The source case connection primarily eases thermal management, allowing for better performance stability in high-load scenarios.

Technical Specifications

Power Field Effect Transistors (FET) STK32N4LLF5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

128 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK32N4LLF5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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