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STK3N50(SOT-194)

STMicroelectronics

STK3N50(SOT-194) by STMicroelectronics

STK3N50(SOT-194) by STMicroelectronics is a N-channel FET with 500V DS breakdown voltage, 12A IDM, and 200mJ EAS. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 60W at 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,033 parts In-Stock

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3,033

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Digiode

USA . 2,633 parts In-Stock

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2,633

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Anansix

USA . 2,473 parts In-Stock

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2,473

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,555 parts In-Stock

1+ parts

$0.304

100+ parts

-

1k+ parts

$0.273

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1,555

$0.304

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$0.273

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MKK Technologies

India . 1,629 parts In-Stock

1+ parts

$0.571

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1,629

$0.571

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DigiPath Technology Company

USA . 1,629 parts In-Stock

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$0.571

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1,629

$0.571

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Corphita

USA . 3,845 parts In-Stock

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3,845

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Parana Technologies

USA . 1,895 parts In-Stock

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$0.363

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1,895

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$0.363

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Overview

Unleash the power of innovation with the STK3N50(SOT-194) by STMicroelectronics. Crafted with precision and expertise, this N-channel power field effect transistor offers unparalleled performance in switching applications. Its high operating temperature, low on-resistance, and built-in diode make it a standout choice for projects requiring reliability and efficiency. With a maximum breakdown voltage of 500V and a pulsing drain current of 12A, this transistor is a game-changer in the field of semiconductor technology. Trust STMicroelectronics to deliver quality products that exceed expectations and elevate your designs to new heights. Choose the STK3N50(SOT-194) for cutting-edge solutions that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher conductivity, making them ideal for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient performance.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, saving space and reducing overall manufacturing costs.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage makes this FET suitable for high voltage applications, offering enhanced reliability and safety.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB, optimizing space utilization.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simple control characteristics and can be easily turned on and off, enhancing overall circuit performance.

Maximum Pulsed Drain Current (IDM): 12 A

The high pulsed drain current rating makes this FET capable of handling surge currents, ensuring reliable operation in demanding conditions.

Avalanche Energy Rating (EAS): 200 mJ

The high avalanche energy rating signifies the FET's ability to withstand sudden voltage spikes and transient events, increasing overall robustness.

No. of Terminals: 3

Having three terminals simplifies the connection process and makes the FET easy to integrate into circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical support and heat dissipation capabilities, enhancing the FET's overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this FET suitable for a wide range of applications.

Maximum Power Dissipation Ambient: 60 W

The high power dissipation capability ensures the FET can operate at elevated temperatures without compromising performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments, offering versatility in various applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, ensuring consistent operation over an extended lifespan.

Maximum Turn On Time (ton): 137 ns

The fast turn-on time allows for quick switching speeds, making this FET suitable for applications that require rapid response times.

Maximum Drain Current (ID): 2.7 A

The high drain current rating indicates the FET's ability to carry significant current loads without overheating or compromising performance.

Maximum Drain-Source On Resistance: 3.8 ohm

With low on-resistance, this FET minimizes power losses and heat dissipation, ensuring efficient operation in various circuit designs.

Terminal Position: SINGLE

A single terminal position simplifies the FET's installation process and enhances overall circuit integration.

Case Connection: ISOLATED

An isolated case connection enhances safety and eliminates the risk of short circuits or electrical interference in the circuit.

Maximum Feedback Capacitance (Crss): 50 pF

The low feedback capacitance minimizes signal distortion and ensures stable performance, making this FET suitable for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STK3N50(SOT-194) attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

3.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

60 W

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn On Time (ton):

137 ns

Trade Compliance

STK3N50(SOT-194) Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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