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STK38N3LLH5

STMicroelectronics

STK38N3LLH5 by STMicroelectronics

STK38N3LLH5 by STMicroelectronics is a power FET with N-channel configuration and built-in diode. It is used for switching applications, has a min DS breakdown voltage of 30V, and can handle a max drain current of 38A.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,701 parts In-Stock

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Digiode

USA . 4,045 parts In-Stock

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Anansix

USA . 852 parts In-Stock

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Nova Conductors

Japan . 87 parts In-Stock

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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IDEA Electronic Components Group

UK . 382 parts In-Stock

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$0.324

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-

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$0.291

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382

$0.324

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$0.291

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MKK Technologies

India . 671 parts In-Stock

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$0.609

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671

$0.609

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DigiPath Technology Company

USA . 671 parts In-Stock

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$0.609

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671

$0.609

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Corohmni

South Africa . 61 parts In-Stock

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$1.529

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61

$1.529

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Aztec Data Supply Inc.

USA . 1,912 parts In-Stock

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$1.910

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Ampacity Inc.

Singapore . 133 parts In-Stock

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$6.050

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AZTECH Wire

Italy . 346 parts In-Stock

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$7.253

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Semicontronic

India . 509 parts In-Stock

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$43.050

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$41.974

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$41.758

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Continental Prestige Electronics

USA . 3,341 parts In-Stock

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Perfect Parts

USA . 3,310 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,128 parts In-Stock

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Argo Parts USA

USA . 2,725 parts In-Stock

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Corphita

USA . 2,470 parts In-Stock

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Parana Technologies

USA . 248 parts In-Stock

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$0.387

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience the power and reliability of the STK38N3LLH5 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers exceptional quality and advanced technology in every product. The STK38N3LLH5 belongs to the Power Field Effect Transistors (FET) category, making it ideal for various switching applications. With a minimum DS Breakdown Voltage of 30V and a maximum Pulsed Drain Current of 152A, this transistor offers outstanding performance. Its single configuration with a built-in diode enhances its functionality and convenience. Trust the STK38N3LLH5 for efficient and reliable switching operations.

Feature Benefit Bullets

Enhanced Switching Performance

The power field effect transistor (FET) is specifically designed for switching applications, ensuring quick and reliable switching between different states. This means that customers can efficiently control the flow of current through the circuit, providing them with precise control over their electronic devices.

Built-in Diode for Protection

With a single FET configuration that includes a built-in diode, customers can benefit from enhanced protection against voltage spikes or reverse currents. This feature prevents damage to the circuitry and extends the lifespan of the product, saving customers both time and money on repairs or replacements.

High Breakdown Voltage

The FET has a minimum DS breakdown voltage of 30 V, allowing it to handle higher voltages without failing. This ensures the safety and reliability of the device, reducing the risk of voltage overload or short circuits that could potentially damage the connected equipment.

Small Outline Package Style

The FET's small outline package style makes it compact and easy to integrate into space-constrained designs. This enables customers to save valuable board space, making it ideal for applications where size is a critical factor.

Robust Maximum Drain Current

With a maximum drain current of 38 A, the FET can handle high loads, delivering sufficient power to drive various components in the circuit. This feature ensures that customers can confidently use the product in demanding applications without worrying about performance degradation or failure due to excessive current flow.

Low Drain-Source On Resistance

The FET boasts a low drain-source on resistance of 0.0026 ohm, minimizing power loss and improving overall efficiency. Customers can enjoy reduced voltage drops across the FET, resulting in more efficient energy usage and improved performance of their electronic devices.

Wide Temperature Range

The FET can operate in temperatures up to 150°C, offering customers versatility in various environments and applications. This allows the product to withstand high-temperature conditions without compromising its performance, ensuring reliability and longevity.

Metal-Oxide Semiconductor Technology

Built with metal-oxide semiconductor technology, the FET provides customers with improved performance, low power consumption, and reduced noise. This advanced technology enhances the overall efficiency and functionality of the product, meeting the demands of modern electronic applications.

Durable Terminal Finish

The FET's matte tin terminal finish enhances its durability and resistance to corrosion, ensuring a longer lifespan and reducing the need for frequent maintenance. Customers can rely on the product to deliver consistent performance over time, saving them both time and money on replacements or repairs.

Technical Specifications

Power Field Effect Transistors (FET) STK38N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

152 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STK38N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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