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STGWA8M120DF3

STMicroelectronics

STGWA8M120DF3 by STMicroelectronics

STGWA8M120DF3 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.3V, supports up to 1200V collector-emitter voltage, and operates at temperatures from -55 °C to 175 °C. Ideal for high-performance applications, it ensures reliable operation with low turn-off times.

Median Price

$2.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4 parts In-Stock

1+ parts

$2.170

100+ parts

$1.570

1k+ parts

$1.330

10k+ parts

-

4

$2.170

$1.570

$1.330

-

Element14

Singapore . 4 parts In-Stock

1+ parts

$2.820

100+ parts

$2.530

1k+ parts

$2.500

10k+ parts

-

4

$2.820

$2.530

$2.500

-

DigiKey

USA . 334 parts In-Stock

1+ parts

$4.100

100+ parts

$1.896

1k+ parts

$1.525

10k+ parts

$1.399

334

$4.100

$1.896

$1.525

$1.399

Avnet

USA . 690 parts In-Stock

1+ parts

-

100+ parts

-

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-

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690

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EBV Elektronik

Germany . 60 parts In-Stock

1+ parts

-

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60

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Distributors (In-Stock)

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Digiode

USA . 3,302 parts In-Stock

1+ parts

$2.831

100+ parts

-

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-

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3,302

$2.831

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-

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Vyrian

USA . 2,084 parts In-Stock

1+ parts

-

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2,084

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Anansix

USA . 1,152 parts In-Stock

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1,152

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 757 parts In-Stock

1+ parts

$1.259

100+ parts

-

1k+ parts

$1.133

10k+ parts

-

757

$1.259

-

$1.133

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MKK Technologies

India . 620 parts In-Stock

1+ parts

$2.367

100+ parts

-

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620

$2.367

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DigiPath Technology Company

USA . 620 parts In-Stock

1+ parts

$2.367

100+ parts

-

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620

$2.367

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-

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Corphita

USA . 763 parts In-Stock

1+ parts

$2.682

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763

$2.682

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Microchip USA

USA . 124 parts In-Stock

1+ parts

$28.925

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124

$28.925

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iodParts Technologies Inc.

India . 42,000 parts In-Stock

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42,000

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Parana Technologies

USA . 1,144 parts In-Stock

1+ parts

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100+ parts

$1.505

1k+ parts

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1,144

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$1.505

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Overview

Unlock the power of innovation with the STGWA8M120DF3 from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This high-performance Insulated Gate Bipolar Transistor (IGBT) delivers exceptional efficiency and reliability for your power control applications. With its robust design and versatile N-channel configuration, it excels in demanding environments, making it ideal for industrial automation, renewable energy systems, and more. Trust STMicroelectronics to elevate your projects with superior quality and unmatched performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight yet durable package, ensuring reliability and ease of integration into various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer better performance and efficiency for power control applications, making them a preferred choice in many designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design, allowing for better thermal management and increased performance in power applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is optimized for handling high power levels efficiently, making it ideal for various industrial applications.

Maximum VCEsat: 2.3 V

A low VCEsat value enhances efficiency by reducing power loss during operation, which is crucial for high-performance applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and mounting in various applications, facilitating easier integration into existing circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections and are suitable for high-power applications, ensuring durability during operation.

Nominal Turn Off Time (toff): 356 ns

A short turn-off time improves switching performance, allowing the IGBT to operate more efficiently in fast-switching applications.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design and provides flexibility in connectivity for various applications.

Maximum Power Dissipation (Abs): 167 W

High power dissipation capability ensures that the IGBT can handle large power loads without overheating, which is essential for reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides excellent thermal dissipation and allows for easy mounting, improving reliability in high-power applications.

Maximum Operating Temperature: 175 °C

The ability to operate at high temperatures increases the reliability and lifespan of the device in demanding environments.

Maximum Collector-Emitter Voltage: 1200 V

A high collector-emitter voltage rating broadens the application range, making the IGBT suitable for diverse power electronics applications.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent performance characteristics and are widely used in the industry, ensuring compatibility and reliability.

Maximum Gate-Emitter Voltage: 20 V

Allows for a wide range of gate drive configurations, enhancing compatibility with various control circuits.

Minimum Operating Temperature: -55 °C

A wide temperature range enables use in extreme environments, making the IGBT versatile for various industrial applications.

Maximum Collector Current (IC): 16 A

A high collector current capacity supports substantial power loads, ideal for heavy-duty applications requiring reliable switching.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate threshold voltage simplifies gate drive requirements and enhances compatibility with various control circuitry.

Terminal Position: SINGLE

Single terminal position allows for straightforward PCB layout and design, facilitating easier integration into circuit designs.

Case Connection: COLLECTOR

Collector case connection optimizes power handling and thermal dissipation, improving overall device performance.

Nominal Turn On Time (ton): 28.8 ns

Extremely fast turn-on time enhances switching efficiency, making this IGBT suitable for applications that require rapid response.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA8M120DF3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

356 ns

Nominal Turn On Time (ton):

28.8 ns

Maximum VCEsat:

2.3 V

Trade Compliance

STGWA8M120DF3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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