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STGW60H65DF

STMicroelectronics

STGW60H65DF by STMicroelectronics

STGW60H65DF by STMicroelectronics is an N-CHANNEL IGBT with 650V VCE, 120A IC, and 360W Ptot. It is used for power control applications due to its fast turn-off time of 247ns and turn-on time of 113ns. The transistor comes in a rectangular package with through-hole terminals and built-in diode.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,184 parts In-Stock

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Digiode

USA . 4,585 parts In-Stock

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R&J Components

USA . 468 parts In-Stock

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468

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Anansix

USA . 129 parts In-Stock

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IDEA Electronic Components Group

UK . 1,567 parts In-Stock

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$1.176

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$1.058

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$1.176

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$1.058

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MKK Technologies

India . 1,089 parts In-Stock

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$2.211

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DigiPath Technology Company

USA . 1,089 parts In-Stock

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$2.211

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1,089

$2.211

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AZTECH Wire

Italy . 722 parts In-Stock

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$11.350

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722

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,504 parts In-Stock

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Corphita

USA . 2,656 parts In-Stock

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RC Electronics

USA . 2,628 parts In-Stock

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Perfect Parts

USA . 1,522 parts In-Stock

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Parana Technologies

USA . 847 parts In-Stock

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$1.406

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Kepictronics

USA . 175 parts In-Stock

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Overview

Elevate your power control applications with the STGW60H65DF by STMicroelectronics, a top-tier Insulated Gate Bipolar Transistor designed for high performance and reliability. With its N-CHANNEL configuration and built-in diode, this transistor offers seamless power control in a variety of settings. From industrial machinery to renewable energy systems, this IGBT is a game-changer in efficiency and durability. Trust in the quality and expertise of STMicroelectronics to bring you cutting-edge technology that delivers unmatched value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and mechanical protection for the IGBT, making it reliable and durable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-Channel IGBTs, making them a better choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and helps protect the IGBT from voltage spikes, enhancing the overall performance and reliability of the device.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high power and efficient switching, making it a suitable choice for various power control needs.

Package Shape: RECTANGULAR

The rectangular package shape offers easy mounting and efficient use of space on circuit boards, allowing for compact and well-organized designs.

Nominal Turn Off Time (toff): 247 ns

The fast turn-off time helps reduce switching losses and improves efficiency in power control applications, enhancing the overall performance of the IGBT.

Maximum Power Dissipation (Abs): 360 W

With a high maximum power dissipation, this IGBT can handle high power levels and operate reliably under demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and secure mounting, ensuring stability and reliability in various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand elevated temperatures and operate effectively in challenging environments.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating allows this IGBT to handle high voltage levels, making it suitable for a wide range of power control applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing good electrical properties and performance for the IGBT.

Maximum Gate-Emitter Voltage: 20 V

The low maximum gate-emitter voltage requirement simplifies the driver circuitry and enhances the overall ease of use and compatibility of this IGBT.

Maximum Collector Current (IC): 120 A

With a high maximum collector current rating, this IGBT can handle high current levels, making it suitable for power control applications that require high current capabilities.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance for the terminals, ensuring reliable connections and long-term performance of the IGBT.

Terminal Position: SINGLE

The single terminal position simplifies the connection and installation of the IGBT, providing convenience and ease of use in various applications.

Nominal Turn On Time (ton): 113 ns

The fast turn-on time helps improve the switching speed and efficiency of the IGBT, enhancing its overall performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW60H65DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

247 ns

Nominal Turn On Time (ton):

113 ns

Trade Compliance

STGW60H65DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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