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STGW19NC60W

STMicroelectronics

STGW19NC60W by STMicroelectronics

STGW19NC60W from STMicroelectronics is a powerful N-channel IGBT ideal for motor control applications. It features a max collector-emitter voltage of 600V, power dissipation of 140W, and operates at up to 150 °C. Its fast switching times enhance efficiency in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,410 parts In-Stock

1+ parts

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5,410

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Anansix

USA . 2,519 parts In-Stock

1+ parts

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2,519

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Digiode

USA . 1,562 parts In-Stock

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1,562

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.512

100+ parts

$0.466

1k+ parts

$0.420

10k+ parts

-

500

$0.512

$0.466

$0.420

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IDEA Electronic Components Group

UK . 1,017 parts In-Stock

1+ parts

$0.528

100+ parts

-

1k+ parts

$0.475

10k+ parts

-

1,017

$0.528

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$0.475

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MKK Technologies

India . 608 parts In-Stock

1+ parts

$0.993

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-

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608

$0.993

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

$0.993

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608

$0.993

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AZTECH Wire

Italy . 721 parts In-Stock

1+ parts

$13.320

100+ parts

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721

$13.320

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Component Stockers USA

USA . 266 parts In-Stock

1+ parts

$99.990

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266

$99.990

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RC Electronics

USA . 3,010 parts In-Stock

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3,010

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 1,628 parts In-Stock

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1,628

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Perfect Parts

USA . 1,315 parts In-Stock

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1,315

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Corphita

USA . 459 parts In-Stock

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459

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Parana Technologies

USA . 384 parts In-Stock

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$0.631

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384

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$0.631

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Overview

Unlock the power of innovation with the STGW19NC60W IGBT from STMicroelectronics, a leader in semiconductor technology. Engineered for superior motor control applications, this robust component delivers outstanding efficiency and reliability, ensuring optimal performance in demanding environments. With its high voltage and current capabilities, it offers customers unparalleled value, enhancing system durability and reducing downtime—your gateway to smarter, more resilient designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and thermal performance, making it suitable for robust applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration typically offers higher electron mobility, resulting in better performance and lower on-state resistance.

Configuration: SINGLE

A single configuration simplifies design and minimizes space, making it easier to integrate into various circuits.

Transistor Application: MOTOR CONTROL

Optimized for motor control applications, this IGBT provides efficient switching and manages high currents effectively.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient heat dissipation and easy mounting options in various setups.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides better mechanical stability and ease of soldering in power applications.

Nominal Turn Off Time (toff): 204 ns

A short turn-off time enhances switching efficiency, reducing energy loss in high-frequency applications.

No. of Terminals: 3

Three terminals facilitate various connection configurations, making it versatile for different circuit designs.

Maximum Power Dissipation (Abs): 140 W

With a maximum power dissipation of 140 W, this IGBT can handle significant power loads, ensuring reliable operation.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers sturdy mounting options, allowing for simple integration into heat sinks for improved thermal management.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

A high collector-emitter voltage rating means the IGBT can handle substantial voltage levels, making it suitable for high-power applications.

Transistor Element Material: SILICON

Silicon as the element material provides well-established performance and reliability for high-power applications.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage allows for better control and integration with standard gate drive circuits.

Maximum Collector Current (IC): 42 A

With a maximum collector current of 42 A, this IGBT is capable of handling substantial load currents effectively.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A moderate threshold voltage simplifies gate drive requirements, ensuring compatibility with various control systems.

Terminal Position: SINGLE

A single terminal position simplifies circuit layout, leading to easier designs and less potential for errors.

Nominal Turn On Time (ton): 33 ns

Fast turn-on time results in improved switching performance, enabling high-frequency operation and better overall efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW19NC60W attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

204 ns

Nominal Turn On Time (ton):

33 ns

Trade Compliance

STGW19NC60W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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