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STF7N52DK3

STMicroelectronics

STF7N52DK3 by STMicroelectronics

STF7N52DK3 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 525V breakdown voltage and a max drain current of 6.2A. It operates in enhancement mode with a power dissipation of 25W. This versatile transistor is suitable for various electronic circuits.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 947 parts In-Stock

1+ parts

$1.320

100+ parts

$0.840

1k+ parts

$0.712

10k+ parts

-

947

$1.320

$0.840

$0.712

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,527 parts In-Stock

1+ parts

$1.254

100+ parts

-

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3,527

$1.254

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Cyclops Electronics Ltd

UK . 11,000 parts In-Stock

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11,000

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Vyrian

USA . 2,598 parts In-Stock

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2,598

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,599 parts In-Stock

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1,599

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Flip Electronics

USA . 1,500 parts In-Stock

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1,500

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R&J Components

USA . 800 parts In-Stock

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800

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Ashlea Components Ltd

UK . 90 parts In-Stock

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90

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 157 parts In-Stock

1+ parts

$0.892

100+ parts

-

1k+ parts

$0.803

10k+ parts

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157

$0.892

-

$0.803

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Corphita

USA . 3,536 parts In-Stock

1+ parts

$1.188

100+ parts

-

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3,536

$1.188

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$1.252

100+ parts

$1.139

1k+ parts

$1.027

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-

150

$1.252

$1.139

$1.027

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MKK Technologies

India . 1,043 parts In-Stock

1+ parts

$1.678

100+ parts

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1,043

$1.678

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DigiPath Technology Company

USA . 1,043 parts In-Stock

1+ parts

$1.678

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1,043

$1.678

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Microchip USA

USA . 185 parts In-Stock

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$8.905

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185

$8.905

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Kepictronics

USA . 22,000 parts In-Stock

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Epart123

USA . 11,000 parts In-Stock

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$0.260

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$0.260

11,000

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$0.260

$0.260

GreenTree Electronics

Israel . 11,000 parts In-Stock

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11,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 2,650 parts In-Stock

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2,650

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Parana Technologies

USA . 1,849 parts In-Stock

1+ parts

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$1.067

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1,849

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$1.067

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Alle Elektronik GmbH

Germany . 947 parts In-Stock

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947

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Overview

Unlock unparalleled efficiency with the STF7N52DK3 from STMicroelectronics—a trusted leader in power semiconductors. This robust N-channel FET is designed for reliable switching applications, ensuring optimal performance and durability under demanding conditions. Enjoy reduced energy losses and extended operational life, making it perfect for industrial automation, power management, and renewable energy systems. Elevate your projects with ST’s commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and lower on-resistance compared to P-channel devices, making them ideal for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing protection against reverse voltage, enhancing the overall reliability of the system.

Transistor Application: SWITCHING

Designed for switching applications, this transistor ensures fast response times, making it suitable for various electronics and power control systems.

Minimum DS Breakdown Voltage: 525 V

A high breakdown voltage allows this FET to operate in high-voltage applications, offering flexibility in various circuit designs.

Package Shape: RECTANGULAR

The rectangular shape facilitates space-efficient mounting in designs, optimizing PCB real estate.

Terminal Form: THROUGH-HOLE

Through-hole mounting adds mechanical stability in high-power applications, making it easier to handle and solder onto PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control of the ON/OFF states, improving the efficiency and performance of switching circuits.

Maximum Pulsed Drain Current (IDM): 24 A

A high pulsed drain current rating enables this transistor to handle transient currents effectively, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 100 mJ

The avalanche rating provides added reliability under transient conditions, reducing the risk of failure in unpredictable environments.

Maximum Drain Current (Abs) (ID): 6.2 A

With a maximum drain current of 6.2 A, this FET is capable of supporting moderate power applications efficiently.

No. of Terminals: 3

A three-terminal design promotes easy integration into circuits and minimizes layout complexity.

Maximum Power Dissipation (Abs): 25 W

High power dissipation capability ensures that the transistor can operate safely and stably without overheating in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting style provides additional surface area for heat dissipation, enhancing thermal management in high-power designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for low power consumption and high speed, making it advantageous for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature indicates robust performance in high-temperature environments, increasing design versatility.

Transistor Element Material: SILICON

Silicon is a widely used material in FETs, known for its excellent electrical properties and availability, ensuring cost-effectiveness.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, improving the long-term reliability of the connections.

Maximum Drain Current (ID): 6 A

The specified maximum drain current rating allows for stable operation in typical power applications without exceeding safe limits.

Maximum Drain-Source On Resistance: 1.15 ohm

Low on-resistance contributes to higher efficiency and lower power losses during operation, making this FET suitable for energy-sensitive applications.

Terminal Position: SINGLE

The single terminal position simplifies the PCB layout and reduces the potential for configuration errors in circuit designs.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unwanted electrical interactions, particularly in high-voltage applications.

Technical Specifications

Power Field Effect Transistors (FET) STF7N52DK3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

1.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF7N52DK3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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